Film, metal-clad laminate, flexible substrate, manufacturing method for film, manufacturing method for metal-clad laminate, and manufacturing method for flexible substrate

Patent metadata

Field	Value
Publication number	US-11845246-B2
Application number	US-202017056885-A
Country	US
Kind code	B2
Filing date	Jan 9, 2020
Priority date	Jan 11, 2019
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

Provided is a film including a matrix layer formed with polyimide for a matrix obtained from pyromellitic dianhydride and m-tolidine, a first adhesive layer formed on one surface of the matrix layer and formed with first thermoplastic polyimide, and a second adhesive layer formed on the other surface of the matrix layer and formed with second thermoplastic polyimide, wherein maximum height roughness of a first interface between the matrix layer and the first adhesive layer and maximum height roughness of a second interface between the matrix layer and the second adhesive layer are 1.0 μm or less.

First claim

The invention claimed is:

1. A film comprising:
a matrix layer formed with a polyimide obtained from pyromellitic dianhydride and m-tolidine;
a first adhesive layer formed on one surface of the matrix layer formed with first thermoplastic polyimide; and
a second adhesive layer formed on the other surface of the matrix layer formed with second thermoplastic polyimide,
wherein the first and second thermoplastic polyimide comprises a tetracarboxylic acid component and a diamine component, and wherein the tetracarboxylic acid component comprises 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride (DSDA) wherein the diamine component is chosen from the group consisting of 1,3-bis(4-aminophenoxy)benzene (TPE-R) and 1,4-bis(4-aminophenoxy)benzene (APD),
wherein a maximum height roughness of a first interface between the matrix layer and the first adhesive layer and a maximum height roughness of a second interface between the matrix layer and the second adhesive layer are 1.0 μm or less, wherein the maximum height roughness is measured according to JIS B 0601.

2. The film of claim 1 , wherein the first thermoplastic polyimide and the second thermoplastic polyimide are the same polyimide.

3. The film of claim 1 , wherein the first adhesive layer and the second adhesive layer have approximately the same thickness.

4. A metal clad laminate comprising:
the film of claim 1 ; and
a metal clad layer formed on at least one surface of the film.

5. The metal clad laminate of claim 4 , wherein the metal clad layer is formed on both surfaces of the film; and a peel strength to peel off the metal clad layer from the film is 10 kg/cm or greater on both surfaces of the film.

6. A flexible substrate comprising:
the film of claim 1 ; and
a conductive pattern formed on at least one surface of the film.

7. A method for preparing a film of claim 1 using a thermal imidization method, the method comprising:
preparing a first precursor including a first polyamic acid obtained from pyromellitic dianhydride and m-tolidine;
preparing a second precursor including a second polyamic acid and a third precursor including a third polyamic acid;
forming a laminate body having the first precursor sandwiched between the second precursor and the third precursor by simultaneously extrusion molding the first precursor, the second precursor and the third precursor; and
obtaining a three-layer film by heating the laminate body.

8. The method for preparing a film of claim 7 , wherein obtaining the three-layer film includes a process of conducting thermal imidization on the first polyamic acid, the second polyamic acid and the third polyamic acid, by heating the laminate body to produce polyimide for a matrix derived from the first polyamic acid, first thermoplastic polyimide derived from the second polyamic acid, and second thermoplastic polyimide derived from the third polyamic acid.

9. The method for preparing a film of claim 7 , wherein the second polyamic acid and the third polyamic acid are the same polyamic acid.

10. The method for preparing a film of claim 7 , wherein the second polyamic acid and the third polyamic acid are each polyamic acid obtained from pyromellitic anhydride and 2,2-bis[4-(4-aminophenoxy)phenyl]propane.

11. A method for preparing a metal clad laminate of claim 4 using a thermal imidization method, the method comprising:
preparing a first precursor including a first polyamic acid obtained from pyromellitic dianhydride and m-tolidine;
preparing a second precursor including a second polyamic acid and a third precursor including third polyamic acid;
forming a laminate body having the first precursor sandwiched between the second precursor and the third precursor by simultaneously extrusion molding the first precursor, the second precursor and the third precursor;
obtaining a three-layer film by heating the laminate body; and
laminating a metal clad layer on the three-layer film.

12. The method for preparing a metal clad laminate of claim 11 , further comprising:
forming a conductive pattern on at least one surface of the three-layer film by etching the metal clad layer.

Assignees

• Lg Chemical Ltd

Inventors

• Kino Takashi
• Park Soonyong
• Park Youngseok

Classifications

• B32B27/281 Primary

  comprising polyimides · CPC title

• B29C48/0021

  combined with joining, lining or laminating · CPC title

• B32B7/12

  using interposed adhesives or interposed materials with bonding properties · CPC title

• B32B15/08 Primary

  of synthetic resin · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title