Injection molding apparatus, cooling plate for injection molding apparatus, and cassette mold

US11845212B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11845212-B2
Application numberUS-202117160637-A
CountryUS
Kind codeB2
Filing dateJan 28, 2021
Priority dateJan 28, 2020
Publication dateDec 19, 2023
Grant dateDec 19, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An injection molding apparatus includes: a molding mold including a fixed mold in which a gate into which a molding material flows is formed, and a movable mold in which a cavity portion is formed and which is separated from the fixed mold when the mold is opened; a nozzle in which a flow path that guides the molding material to the gate is formed; and a first cooling plate which is detachably attached to an opposite-side surface of the movable mold from a surface to be in contact with the fixed mold and which is provided with a first cooling mechanism therein, and the first cooling mechanism cools the molding material in the cavity portion.

First claim

Opening claim text (preview).

What is claimed is: 1. An injection molding apparatus, comprising: a molding mold including a fixed mold in which a gate into which a molding material flows is formed, and a movable mold in which a cavity portion is formed and which is separated from the fixed mold when the molding mold is opened; a nozzle in which a flow path that guides the molding material to the gate is formed; a first cooling plate which is detachably attached to an opposite-side surface of the movable mold from a surface to be in contact with the fixed mold and which is provided with a first cooling mechanism therein, wherein the first cooling mechanism cools the molding material in the cavity portion; an extrusion mechanism that comprises an ejector pin, a support plate which is a plate-like member that supports the ejector pin, a support rod, and a spring, wherein the ejector pin passes through the movable mold for insertion into the cavity portion, the movable mold comprises a first through hole for insertion of the support rod, the spring is inserted around the support rod, and the first cooling plate is between the support plate and the movable mold; and a control unit configured to: acquire feature data that includes a type of the molding material, molding accuracy, and cycle time associated with a molding process of the molding material; and select, based on the acquired feature data, the first cooling plate from a plurality of first cooling plates, wherein the selection is based on a machine learning model that is trained with a correspondence between the plurality of first cooling plates and the feature data. 2. The injection molding apparatus according to claim 1 , further comprising a second cooling plate which is detachably attached to an opposite-side surface of the fixed mold from a surface to be in contact with the movable mold and which is provided with a second cooling mechanism therein, the second cooling mechanism cooling the molding material in the cavity portion. 3. The injection molding apparatus according to claim 1 , wherein the feature data further includes data representing a size of the cavity portion. 4. The injection molding apparatus according to claim 1 , further comprising a display unit that displays information indicating the first cooling plate selected by the control unit. 5. The injection molding apparatus according to claim 1 , wherein vertical and horizontal dimensions in an outer shape of the first cooling plate and vertical and horizontal dimensions in an outer shape of the movable mold are unified. 6. The injection molding apparatus according to claim 1 , wherein the spring is inserted around the support rod and is between the movable mold and the support plate, the spring biases the support plate such that a head portion of the ejector pin is a part of a wall surface of the cavity portion during molding, the extrusion mechanism further comprises an extrusion plate that is fixed to the support plate, and the extrusion plate includes a thrust bearing. 7. The injection molding apparatus according to claim 1 , wherein the first cooling plate comprises a second through hole for insertion of the support rod. 8. The injection molding apparatus according to claim 1 , further comprising a temperature controller, wherein the first cooling plate includes an internal flow path through which a heat medium flows, the temperature controller is coupled to the internal flow path of the first cooling plate to enable the heat medium to circulate between the internal flow path and the temperature controller, and the temperature controller is configured to control a temperature of the heat medium. 9. The injection molding apparatus according to claim 1 , further comprising a melting unit that includes a rotor, wherein a rotation axis of the rotor coincides with each of a central axis of the cavity portion and a central axis of the ejector pin.

Assignees

Inventors

Classifications

  • B29C45/73Primary

    of the mould {(B29C45/2642 and B29C45/2737 take precedence)} · CPC title

  • B29C45/03Primary

    Injection moulding apparatus (transfer moulding B29C45/02) · CPC title

  • Display units or mountings therefor; Switch cabinets · CPC title

  • with exchangeable mould parts, e.g. cassette moulds (B29C45/1756 takes precedence) · CPC title

  • Measuring, controlling or regulating {(measuring in general G01; controlling or regulating in general G05)} · CPC title

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What does patent US11845212B2 cover?
An injection molding apparatus includes: a molding mold including a fixed mold in which a gate into which a molding material flows is formed, and a movable mold in which a cavity portion is formed and which is separated from the fixed mold when the mold is opened; a nozzle in which a flow path that guides the molding material to the gate is formed; and a first cooling plate which is detachably …
Who is the assignee on this patent?
Seiko Epson Corp
What technology area does this patent fall under?
Primary CPC classification B29C45/73. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Dec 19 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).