Injection molding apparatus and cap member

Patent metadata

Field	Value
Publication number	US-11845210-B2
Application number	US-202117176753-A
Country	US
Kind code	B2
Filing date	Feb 16, 2021
Priority date	Feb 20, 2020
Publication date	Dec 19, 2023
Grant date	Dec 19, 2023

Abstract

An injection molding apparatus including a fixed die including a gate via which a molding material flows in, a movable die that forms along with the fixed die a cavity and separates from the fixed die at a point of time of mold opening, an open-gate hot runner that includes a nozzle including a channel that guides the molding material to the gate and a heater that heats the channel, the hot runner being attachable to and detachable from the fixed die, and a cap member that is disposed between the fixed die and the hot runner and has a melting point higher than a melting point of the molding material.

First claim

What is claimed is:

1. An injection molding apparatus comprising:
a fixed die including a gate via which a molding material flows in;
a movable die that forms along with the fixed die a cavity and separates from the fixed die at a point of time of mold opening;
an open-gate hot runner in the fixed die, wherein the open-gate hot runner includes:
a main body;
a nozzle including a channel that guides the molding material to the gate, wherein the nozzle is disposed at an end portion of the main body; and
a heater that heats the channel, the open-gate hot runner being attachable to and detachable from the fixed die; and

a cap that is disposed between the fixed die and the open-gate hot runner and has a melting point higher than a melting point of the molding material, wherein the cap is in contact with each of the fixed die, the main body of the open-gate hot runner, and the nozzle.

2. The injection molding apparatus according to claim 1 , wherein
the nozzle has a plurality of nozzle openings in a circumferential direction of the nozzle,
a front end surface of the nozzle and the gate form a gate opening,
the gate opening has a ring-like shape when viewed in a first direction from the fixed die toward the movable die, and
the molding material is filled into the cavity through the plurality of nozzle openings.

3. The injection molding apparatus according to claim 1 , wherein a thermal conductivity of the cap is smaller than a thermal conductivity of the fixed die.

4. The injection molding apparatus according to claim 1 , wherein a thermal conductivity of the cap is smaller than a thermal conductivity of the molding material.

5. The injection molding apparatus according to claim 1 , wherein a clearance between the cap and the nozzle is smaller than a clearance between the cap and the fixed die.

6. The injection molding apparatus according to claim 1 , wherein the cap contains at least one of ceramic, metal, polyether ether ketone, and polybenzimidazole.

7. The injection molding apparatus according to claim 1 , further comprising a control section that controls injection of the molding material via the nozzle and a temperature of the heater,
wherein the control section, when stopping injecting the molding material via the nozzle, lowers the temperature of the heater as compared with the temperature at a point of time of injection of the molding material via the nozzle.

8. The injection molding apparatus according to claim 1 , further comprising a plasticizer that plasticizes a solid material to generate the molding material, wherein the plasticizer includes
a drive motor,
a screw that is rotated by the drive motor and has a groove formation surface where a spiral groove is formed,
a barrel having a facing surface that faces the groove formation surface and provided with a through hole, and
a heating section that heats at least one of the screw and the barrel.

9. The injection molding apparatus according to claim 1 , wherein a coefficient of thermal expansion of the cap is smaller than a coefficient of thermal expansion of the nozzle.

10. The injection molding apparatus according to claim 1 , wherein the heater includes:
a first heater around the nozzle,
a second heater in an outer circumferential portion of the main body, and
the second heater is separate from the nozzle.

11. The injection molding apparatus according to claim 10 , wherein
the nozzle includes:
a connection section;
a flange section; and
a front-end section,

the connection section is disposed inside the main body and fixed to the main body,
the flange section is continuous with the connection section and contacts the end portion of the main body,
the front-end section is continuous with the flange section and includes a nozzle opening, and
the first heater is disposed around the connection section of the nozzle.

12. A cap used in an injection molding apparatus including
a fixed die including a gate via which a molding material flows in;
a movable die that forms along with the fixed die a cavity and separates from the fixed die at a point of time of mold opening; and
an open-gate hot runner in the fixed die, wherein
the open-gate hot runner includes:
a main body;
a nozzle including a channel that guides the molding material to the gate, wherein the nozzle is disposed at an end portion of the main body; and
a heater that heats the channel, the open-gate hot runner being attachable to and detachable from the fixed die,

the cap is disposed between the fixed die and the open-gate hot runner,
the cap has a melting point higher than a melting point of the molding material, and
the cap is in contact with each of the fixed die, the main body of the open-gate hot runner, and the nozzle.

Assignees

• Seiko Epson Corp

Inventors

• Hayashi Ríona
• Anegawa Kenta
• Sasagawa Kakeru
• Takano Hiroki

Classifications

• B29C45/2701 Primary

  Details not specific to hot or cold runner channels (B29C45/2725 takes precedence) · CPC title

• B29C45/78

  of temperature · CPC title

• B29C2045/272

  Part of the nozzle, bushing or runner in contact with the injected material being made from ceramic material · CPC title

• B29C2045/2724

  Preventing stringing of the moulding material · CPC title

• B29C2945/76531

  Temperature · CPC title