Electronic component series and base tape

US11844179B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11844179-B2
Application numberUS-202017063548-A
CountryUS
Kind codeB2
Filing dateOct 5, 2020
Priority dateOct 23, 2019
Publication dateDec 12, 2023
Grant dateDec 12, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic component series includes a base tape mainly composed of paper and having a multiplicity of accommodation recesses formed continuously at predetermined intervals for accommodating electronic components each having a substantially rectangular parallelepiped shape with an L dimension of less than or equal to 0.6 mm, a W dimension of less than or equal to 0.3 mm, and a T dimension of less than or equal to 0.3 mm; the electronic components accommodated in the accommodation recesses; and a cover tape continuously adhered to a surface of the base tape to cover the accommodation recesses. The electronic components are lifted from the accommodation recesses by peeling off the cover tape. Each of the accommodation recesses has a bottom surface inclined in a range of from 10° to 20° with respect to the surface of the base tape to be deeper toward a downstream in a conveyance direction.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic component series comprising: a base tape provided with a multiplicity of accommodation recesses for accommodating electronic components each having a rectangular parallelepiped shape with a length dimension (L dimension) of less than or equal to 0.6 mm, a width dimension (W dimension) of less than or equal to 0.3 mm, and a height dimension (T dimension) of less than or equal to 0.3 mm, the accommodation recesses being configured continuously at predetermined intervals, the base tape including paper; the electronic components accommodated in the accommodation recesses; and a cover tape continuously adhered to a surface of the base tape so as to cover the accommodation recesses, wherein the electronic components are lifted out from the accommodation recesses by peeling off the cover tape while conveying the base tape in one direction, each of the accommodation recesses has a bottom surface inclined to be deeper toward a downstream in a conveyance direction, and the bottom surface is inclined in a range of from more than 10° to 20° with respect to the surface of the base tape. 2. The electronic component series according to claim 1 , wherein a right angle is between the bottom surface of the accommodation recess and a side surface of the accommodation recess located on a downstream side in the conveyance direction, a cutout portion is provided only on the side surface side of the accommodation recess located on the downstream side so as to provide a widened opening of the accommodation recess, and a length D from a lowermost point to an uppermost point of the side surface of the accommodation recess located on the downstream side in contact with a corresponding electronic component in a direction along the side surface located on the downstream side is smaller than the T dimension of the electronic component. 3. The electronic component series according to claim 1 , wherein each of the accommodation recesses is inclined from one side to the other side in a width direction that is a short side direction of the base tape. 4. The electronic component series according to claim 2 , wherein each of the accommodation recesses is inclined from one side to the other side in a width direction that is a short side direction of the base tape. 5. An electronic component series comprising: a base tape provided with a multiplicity of accommodation recesses for accommodating electronic components each having a rectangular parallelepiped shape with a length dimension (L dimension) of less than or equal to 0.6 mm, a width dimension (W dimension) of less than or equal to 0.3 mm, and a height dimension (T dimension) of less than or equal to 0.3 mm, the accommodation recesses being configured continuously at predetermined intervals; the electronic components accommodated in the accommodation recesses; and a cover tape continuously adhered to a surface of the base tape so as to cover the accommodation recesses, wherein the electronic components are lifted out from the accommodation recesses by peeling off the cover tape while conveying the base tape in one direction, each of the accommodation recesses has a bottom surface having a surface parallel to the surface of the base tape, a first side surface configured at a right angle with respect to the bottom surface on a downstream side in a conveyance direction, and a second side surface configured at a right angle with respect to the bottom surface on an upstream side in the conveyance direction, the bottom surface has a placement portion for placing a corresponding electronic component, and a guiding portion for guiding the electronic component to the placement portion, the guiding portion being provided between the placement portion and at least one of the first side surface and the second side surface, and the guiding portion is an inclined surface inclined by more than or equal to 30° with respect to a surface of the placement portion. 6. The electronic component series according to claim 5 , wherein the guiding portion exists only on the second side surface side, and a relation between a width B of the guiding portion in the conveyance direction and the W dimension of the electronic component satisfies a condition of 0.7×(A−W)≤B≤0.9×(A−W), where A represents a length of an opening portion of the accommodation recess in the conveyance direction. 7. The electronic component series according to claim 5 , wherein the guiding portion exists only on the second side surface side, and a cutout portion is configured only on the downstream side of the accommodation recess in the conveyance direction, and a length D from a lowermost point to an uppermost point of the first side surface of the accommodation recess in contact with a corresponding electronic component in a direction along the first side surface is smaller than the T dimension of the electronic component. 8. The electronic component series according to claim 6 , wherein the base tape is an embossed tape composed of a resin, and a center of the electronic component is located at a position on the downstream side in the conveyance direction relative to a center of the accommodation recess. 9. The electronic component series according to claim 5 , wherein a first guiding portion is provided between the first side surface and the placement portion, a second guiding portion is provided between the second side surface and the placement portion, a width B 1 of the first guiding portion in the conveyance direction is from 70% to 90% of a distance between a downstream end of the electronic component and the first side surface, and a width B 2 of the second guiding portion in the conveyance direction is from 70% to 90% of a distance between an upstream end of the electronic component and the second side surface. 10. The electronic component series according to claim 5 , wherein the guiding portion is provided in the bottom surface of the accommodation recess on at least one of one side and the other side in a short side direction of the base tape. 11. The electronic component series according to claim 6 , wherein the guiding portion exists only on the second side surface side, and a cutout portion is configured only on the downstream side of the accommodation recess in the conveyance direction, and a length D from a lowermost point to an uppermost point of the first side surface of the accommodation recess in contact with a corresponding electronic component in a direction along the first side surface is smaller than the T dimension of the electronic component. 12. The electronic component series according to claim 7 , wherein the base tape is an embossed tape composed of a resin, and a center of the electronic component is located at a position on the downstream side in the conveyance direction relative to a center of the accommodation recess. 13. A base tape provided with a multiplicity of accommodation recesses for accommodating electronic components each having a rectangular parallelepiped shape with a length dimension (L dimension) of less than or equal to 0.6 mm, a width dimension (W dimension) of less than or equal to 0.3 mm, and a height dimension (T dimension) of less than or equal to 0.3 mm, the accommodation recesses being configured continuously at predetermined intervals, the base tape including paper, wherein each of the accommodation recesses has a bottom surface inclined to be deeper toward a downstream in a conveyance direction, and the bottom surface is inclined in a range of from more than 10° to 20° with respect to the surface of the base tape. 14. The

Assignees

Inventors

Classifications

  • H05K13/022Primary

    with orientation of the elements · CPC title

  • Attaching a series of articles, e.g. small electrical components, to a continuous web {(ammunition filling F42B)} · CPC title

  • Containers and magazines for components, e.g. tube-like magazines · CPC title

  • tape feeders · CPC title

  • B65D73/02Primary

    Articles, e.g. small electrical components, attached to webs · CPC title

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Frequently asked questions

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What does patent US11844179B2 cover?
An electronic component series includes a base tape mainly composed of paper and having a multiplicity of accommodation recesses formed continuously at predetermined intervals for accommodating electronic components each having a substantially rectangular parallelepiped shape with an L dimension of less than or equal to 0.6 mm, a W dimension of less than or equal to 0.3 mm, and a T dimension of…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H05K13/022. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Dec 12 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).