Sewing method and apparatus to increase 3D object strength

Patent metadata

Field	Value
Publication number	US-11840784-B2
Application number	US-202117160971-A
Country	US
Kind code	B2
Filing date	Jan 28, 2021
Priority date	Mar 29, 2019
Publication date	Dec 12, 2023
Grant date	Dec 12, 2023

Abstract

An addition to additive manufacturing sews a number of printed substrate sheets together using industrial sewing machine technology. Portions of the final 3D object that will be solid are sewn together into bundles of the object with a needle protruding through the top of the bundle via a sewing machine with a looping mechanism connecting the thread loops under each bundle of printed substrate sheet layers. This will result in many well connected stack bundles that are then stacked in alignment to form the final stack. During heat and compression, the stitch thread may bunch together and become entangled with the cooled plastic of the final solid 3D object. Removal of the excess substrate may proceed as usual, since the sewing is applied only in the solid portions of the final object. The end result will be a part with much higher strength in the Z axis.

First claim

What is claimed is:

1. An apparatus for bonding printed composite layers into bundles during composite based additive manufacturing, comprising:
a bundle convey subsystem having a piling station configured to receive and stack a plurality of printed substrate layers in succession from an additive manufacturing device in aligned formation as a bundle of the printed substrate layers, each printed substrate layer having a substrate sheet printed with a polymer, the bundle of printed substrate layers being a part of a stack of the printed substrate sheets forming a 3D composite object; and
a sewing machine proximate the bundle convey subsystem, the bundle convey subsystem configured to transfer the bundle of printed substrate layers to the sewing machine, the sewing machine configured to sew the printed substrate layers together as a sewn bundle, the bundle convey subsystem further configured to transfer the sewn bundle to a stacker subsystem for subsequent bonding of the sewn bundle with a second sewn bundle to form a stack of printed substrate layers including the sewn bundle,
the sewing machine including a sewing mechanism above the bundle of printed substrate layers and a looping mechanism below the bundle of printed substrate layers, the sewing mechanism including a sewing needle having a sewing thread attached thereto, the sewing mechanism configured to repeatedly pass the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from one side of the bundle of printed substrate layers to the opposite side of the bundle of printed substrate layers, the looping mechanism configured to repeatedly wrap the first loop of the sewing thread around one of a second sewing thread and a second loop of the sewing thread, the sewing mechanism further configured to pull the sewing needle and attached sewing thread out of the bundle of printed substrate layers.

2. The apparatus of claim 1 , wherein the looping mechanism is configured to repeatedly wrap the first loop of the sewing thread around the second sewing thread.

3. The apparatus of claim 1 , wherein the looping mechanism is configured to repeatedly wrap the first loop of the sewing thread around the second loop of the sewing thread.

4. The apparatus of claim 1 , wherein the sewing thread used by the sewing machine to sew the printed substrate layers together as the sewn bundle is a polymer fiber.

5. The apparatus of claim 1 , wherein the sewing thread used by the sewing machine to sew the printed substrate layers together as the sewn bundle is a carbon fiber.

6. The apparatus of claim 1 , the bundle convey subsystem further comprising registration pins configured to receive registration apertures of the printed substrate layers.

7. The apparatus of claim 1 , further comprising the stacker subsystem having registration pins, the stacker subsystem configured to receive the sewn bundle in alignment over the second sewn bundle with alignment apertures of the bundles in register with the registration pins of the stacker subsystem, the stacker subsystem receiving the sewn bundles to form a stack of the sewn bundles.

8. The apparatus of claim 7 , further comprising, a heater configured to at least partially melt the polymer printed on the printed substrate layers of a plurality of the bundles, and a compressor configured to compress the stack of the sewn bundles, the heating and compressing entangling the sewing thread from the sewn bundle with the polymer printed on a printed substrate layer of an adjacent bundle of printed substrate layers.

9. The apparatus of claim 1 , further comprising a controller in communication with the sewing machine to control an operation of the sewing machine.

10. An apparatus for forming a stack of sewn bundles during composite based additive manufacturing, the composite based additive manufacturing including an additive manufacturing device that prints a plurality of printed substrate layers, the apparatus comprising:
a piling station configured to stack a plurality of the printed substrate layers in aligned formation as a bundle of printed substrate layers, each printed substrate layer having a substrate sheet printed with a polymer, the bundle of printed substrate layers being a part of a stack of the printed substrate layers forming a 3D composite object;
a sewing machine proximate the piling station, the sewing machine configured to sew the bundle of printed substrate layers together as a sewn bundle; and
a stacker subsystem for bonding the sewn bundle with a second sewn bundle and form a stack of printed substrate layers including the sewn bundle.

11. The apparatus of claim 10 , the sewing machine including a sewing mechanism above the bundle of printed substrate layers and a looping mechanism below the bundle of printed substrate layers, the sewing mechanism including a sewing needle having a sewing thread attached thereto, the sewing mechanism configured to repeatedly pass the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from above the bundle to below the bundle, the looping mechanism configured to repeatedly wrap the first loop of the sewing thread around a second sewing thread, the sewing mechanism further configured to pull the sewing needle and attached sewing thread out of the bundle of printed substrate layers.

12. The apparatus of claim 10 , the sewing machine including a sewing mechanism above the bundle of printed substrate layers and a looping mechanism below the bundle of printed substrate layers, the sewing mechanism including a sewing needle having a sewing thread attached thereto, the sewing mechanism configured to repeatedly pass the sewing needle through the bundle of printed substrate layers to pull a first loop of the sewing thread from above the bundle to below the bundle, the looping mechanism configured to repeatedly wrap the first loop of the sewing thread around a second loop of the sewing thread, the sewing mechanism further configured to pull the sewing needle and attached sewing thread out of the bundle of printed substrate layers.

13. The apparatus of claim 10 , further comprising the stacker subsystem having registration pins, the stacker subsystem configured to receive the sewn bundle in alignment over a previously formed sewn bundle with alignment apertures of the bundles in register with the registration pins of the stacker subsystem, the stacker subsystem receiving the sewn bundles to form a stack of the sewn bundles.

14. The apparatus of claim 13 , further comprising, a heater configured to at least partially melt the polymer printed on the printed substrate layers of a plurality of the bundles, and a compressor configured to compress the stack of the sewn bundles, the heating and compressing entangling the sewing thread from the bundle with the polymer printed on a printed substrate layer of an adjacent bundle of printed substrate layers.

15. A method of forming a stack of sewn bundles during composite based additive manufacturing with the apparatus of claim 10 , comprising:
a) stacking the plurality of the printed substrate layers in aligned formation at the piling station to form the bundle of printed substrate layers, each of the printed substrate layers having the substrate sheet printed with the polymer by an additive manufacturing device, the bundle of printed substrate layers being the part of the stack of the printed substrate sheets forming the 3D composite object;
b) sewing the printed substrate layers together with the sewing machine to form the sewn bundle; and
c) transferring the sewn bundle to the stacke

Assignees

• Xerox Corp

Inventors

• Daniels Marc D

Classifications

• D05B19/02 Primary

  Sewing machines having electronic memory or microprocessor control unit · CPC title

• B29C64/147 Primary

  using sheet material, e.g. laminated object manufacturing [LOM] or laminating sheet material precut to local cross sections of the 3D object · CPC title

• B29C64/205

  Means for applying layers · CPC title

• B29C64/393

  for controlling or regulating additive manufacturing processes · CPC title

• D05B19/006

  Control knobs or display means (D05B19/085, D05B19/105 take precedence) · CPC title