Crack engineering as a new route for the construction of arbitrary hierarchical architectures

Patent metadata

Field	Value
Publication number	US-11839998-B2
Application number	US-202017078102-A
Country	US
Kind code	B2
Filing date	Oct 23, 2020
Priority date	Oct 23, 2019
Publication date	Dec 12, 2023
Grant date	Dec 12, 2023

Abstract

Three-dimensional (3D) hierarchical morphologies widely exist in natural and biomimetic materials, which impart preferential functions including liquid and mass transport, energy conversion, and signal transmission for various applications. While notable progress has been made in the design and manufacturing of various hierarchical materials, the state-of-the-art approaches suffer from limited materials selection, high costs, as well as low processing throughput. Herein, by harnessing the configurable elastic crack engineering-controlled formation and configuration of cracks in elastic materials, an effect normally avoided in various industrial processes, the present invention provides a facile and powerful technique to enable the faithful transfer of arbitrary hierarchical structures with broad material compatibility and structural and functional integrity. The present invention provides a cost-effective, large-scale production method of a variety of flexible, inexpensive, and transparent 3D hierarchical and biomimetic materials.

First claim

What we claim:

1. A method of fabricating and mass-producing a three-dimensional hierarchical structure, the method comprising:
a first phase comprising:
using a three-dimensional hierarchical structure as a master structure;
enclosing the master structure in an elastomer mold, wherein a Young's modulus of the elastomer mold is at least one order of magnitude lower than a Young's modulus of the master structure;
removing the master structure from the elastomer mold, wherein one or more controlled cracks are formed in the elastomer mold along the direction of a vertical peeling force, and a cavity mold is formed with a shape of the master structure in the elastomer mold; and
controlling the formation of the one or more controlled cracks in the elastomer mold by adjusting a curing temperature and a curing time of the elastomer mold, so that the one or more controlled cracks are formed at a locked region in the elastomer mold during the master structure removal, wherein the elastomer mold has a cracking coefficient η of at least 100% for preventing a neck region of the elastomer mold from breaking and a deformation coefficient φ during the first phase, wherein 1/φ is equal to or greater than the ultimate elongation at break of the elastomer mold so as to ensure that the elastomer mold is able to be separated from the master structure;
wherein the cracking coefficient is computed by:
η= W min/ h,

wherein Wmin is the smallest width of the neck region;
h is the height of the locked region, and 2 μm<h<15 μm;
wherein the deformation coefficient is computed by:
φ= W min/ W max,

wherein Wmin is the smallest width of the neck region;
Wmax is the largest width near the locked region;

a second phase comprising:
curing the elastomer mold at a temperature higher than the curing temperature during the first phase to enhance the stiffness, self-sealing and configurability of the elastomer mold;
filling the cavity mold with a replica material and curing the replica material to fabricate a replica of the master structure; and
removing the replica from the elastomer mold.

2. The method of claim 1 , wherein the three-dimensional hierarchical structure comprises a closed-loop structure, a doubly reentrant structure, an arch, a high aspect ratio rod, a high aspect ratio two-cycle helix, or a 3D array.

3. The method of claim 1 , wherein the elastomer mold has a local stress lower than a failure strength of the elastomer mold during fabricating.

4. The method of claim 1 , wherein the replica material comprises a base material or an engineering material.

5. The method of claim 4 , wherein the base material comprises silicon and a photoresist.

6. The method of claim 4 , wherein the engineering material comprises a polymer or a printable material.

7. The method of claim 6 , wherein the printable material comprises SiO 2 , a metal, or a ceramic.

8. The method of claim 6 , wherein the polymer comprises a UV curable resin, a thermoset, a thermoset metal, and a thermoplastic.

9. The method of claim 8 , wherein the thermoplastic comprises low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), high-density polyethylene (HDPE), polypropylene (PP), polystyrene (PS), fluorinated ethylene propylene (FEP), perfluoroalkoxy alkane (PFA), polyvinyl acetate (PVA), Poly(methyl methacrylate) (PMMA), polyurethan (PU), polycarbonate (PC), Polyvinyl Chloride (PVC), polyethylene terephthalate (PET) and acrylonitrile butadiene styrene copolymers (ABS).

10. The method of claim 1 , wherein the elastomer mold comprises polydimethylsiloxane (PDMS) polymer.

11. The method of claim 1 , wherein the curing temperature and the curing time of the elastomer mold during the first phase is at 22 to 25° C. for 24 hours.

12. The method of claim 1 , wherein the elastomer mold is cured by baking at 150° C. for 30 minutes during the second phase, and wherein the temperature gradually rises from room temperature at a rate of 10° C. per minute during the baking process.

13. The method of claim 1 , wherein the elastomer mold is cured by baking at 250° C. for 1 hour during the second phase, and wherein the temperature gradually rises from room temperature at a rate of 10° C. per minute during the baking process.

Assignees

• Univ Hong Kong Baptist Univ
• Univ Hong Kong Science & Tech
• Univ City Hong Kong

Inventors

• Ren Kangning
• Wu Hongkai
• Wang Zuankai
• Yao Shuhuai
• Ong Beng
• Li Wanbo
• Li Zeyu
• Sun Han
• Chan Chiu Wing

Classifications

• B29C39/003 Primary

  characterised by the choice of material · CPC title

• B29C39/26

  Moulds or cores · CPC title

• B29C39/36

  Removing moulded articles · CPC title

• B29C39/38

  Heating or cooling · CPC title

• B29K2023/065

  HDPE, i.e. high density polyethylene · CPC title