Voice coil assembly and loudspeaker

Patent metadata

Field	Value
Publication number	US-11838735-B2
Application number	US-202017775905-A
Country	US
Kind code	B2
Filing date	Nov 11, 2020
Priority date	Nov 11, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

Disclosed are a voice coil assembly and a loudspeaker, comprising a main voice coil and a connecting coil connected to the main voice coil, the main voice coil is connected to an external circuit, and comprises a first voice coil and a second voice coil, the first voice coil is formed by winding a conductive first wire with self-bonding coating, the second voice coil is formed by winding a second wire with self-bonding coating, the first voice coil and the second voice coil are positioned close to each other and bonded together, the first voice coil and the second voice coil are connected in series or in parallel, the connecting coil is formed by winding a third wire, and the density of the third wire is less than or equal to that of the first wire and the second wire.

First claim

What is claimed is:

1. A voice coil assembly, comprising a main voice coil and a connecting coil connected to the main voice coil,
wherein the main voice coil is connected to an external circuit,
wherein the main voice coil comprises a first voice coil and a second voice coil,
wherein the first voice coil is formed by winding a first wire, and the first wire is a conductive wire with a self-bonding coating,
wherein the second voice coil is formed by winding a second wire, and the second wire is a conductive wire with a self-bonding coating, the first voice coil and the second voice coil are positioned close to each other and bonded together by the self-bonding coatings of the first wire and the second wire, and the first voice coil and the second voice coil are connected in series or in parallel,
wherein the connecting coil is formed by winding a third wire, the third wire is a wire with a self-bonding coating, and the density of the third wire is less than or equal to that of the first wire and the second wire, and
wherein the connecting coil and the first voice coil are positioned close to each other and bonded together by the self-bonding coatings of the third wire and the first wire,
wherein a height of the main voice coil is greater than a height of the connecting coil.

2. The voice coil assembly of claim 1 , wherein the third wire is a conductive wire or an insulating wire.

3. The voice coil assembly of claim 1 , wherein the first wire and the second wire are copper wires with the self-bonding coatings, or copper-clad aluminum wires with the self-bonding coatings, and the third wire is a copper-clad aluminum wire with the self-bonding coating or an aluminum wire with the self-bonding coating.

4. The voice coil assembly of claim 1 , wherein wire diameters of the first wire and the second wire are the same, and a wire diameter of the third wire is smaller than the wire diameters of the first wire and the second wire.

5. The voice coil assembly of claim 1 , wherein a thickness of the connecting coil is smaller than a thickness of the main voice coil, and
wherein the connecting coil is located at an inner side of a top surface of the first voice coil, and an accommodation space is formed between an outer surface of the connecting coil and an outer side of the top surface of the first voice coil, or
wherein the connecting coil is located at the outer side of the top surface of the first voice coil, and an accommodation space is formed between an inner surface of the connecting coil and the inner side of the top surface of the first voice coil, or
wherein the connecting coil is located at a center portion of the top surface of the first voice coil, and an accommodation space is formed between the outer surface of the connecting coil and the outer side of the top surface of the first voice coil and between the inner surface of the connecting coil and the inner side of the top surface of the first voice coil.

6. The voice coil assembly of claim 5 , wherein the connecting coil is located at the inner side of the top surface of the first voice coil, the top surface of the first voice coil is provided with a groove correspondingly opened at the inner side and the top surface of the first voice coil, and a bottom surface and an outer surface of the lower end of the connecting coil are bonded with a bottom surface and a side surface of the groove of the first voice coil, or
the connecting coil is located at the outer side of the top surface of the first voice coil, the top surface of the first voice coil is provided with a groove correspondingly opened at the outer side and the top surface of the first voice coil, and the bottom surface and an inner surface of the lower end of the connecting coil are bonded with the bottom surface and side surface of the groove of the first voice coil.

7. The voice coil assembly of claim 1 , wherein the first wire, the second wire, and the third wire have a circular cross section or a rectangular cross section.

8. A loudspeaker, comprising a vibration system and a magnetic circuit system, the vibration system comprises a diaphragm and a voice coil assembly, wherein the voice coil assembly is the voice coil assembly of claim 1 , a top surface of the connecting coil is connected to the diaphragm, and the main voice coil is provided in a magnetic gap of the magnetic circuit system.

9. The loudspeaker of claim 8 , wherein the vibration system further comprises a damper, and the damper comprises an inner fixing portion, an outer fixing portion, and a deformation portion connecting the inner fixing portion and the outer fixing portion,
wherein the diaphragm comprises a center portion, a folded ring portion and an edge portion from inside to outside thereof, the inner fixing portion is coupled to the center portion, and the outer fixing portion is coupled to the edge portion, and
wherein the top surface of the connecting coil is coupled to the inner fixing portion.

Assignees

• Goertek Inc

Inventors

• Zhao Yue
• Wang Xinglong
• Wang Jianjian

Classifications

• H04R9/046 Primary

  Construction · CPC title

• H04R7/12

  Non-planar diaphragms or cones · CPC title

• H04R7/18

  at the periphery · CPC title

• H04R7/26

  Damping by means acting directly on free portion of diaphragm or cone (air damping H04R1/28) · CPC title

• H04R9/025

  Magnetic circuit · CPC title