Non-planar ingress protection element for a sensor device

Patent metadata

Field	Value
Publication number	US-11838708-B2
Application number	US-202017602091-A
Country	US
Kind code	B2
Filing date	Apr 3, 2020
Priority date	Apr 10, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A sensor device includes a substrate, a microelectromechanical systems (MEMS) transducer disposed on the substrate, in integrated circuit, and a cover disposed on the substrate. The sensor device includes a port or an opening for allowing acoustic energy to be incident on the MEMS transducer. The sensor device further includes an ingress protection element positioned to cover the port, the ingress protection element comprising at least one non-planar portion.

First claim

What is claimed is:

1. A sensor comprising:
a substrate having a first surface and an opposing second surface, the substrate defining a port that extends between the first surface and the second surface;
a microelectromechanical systems (MEMS) transducer disposed on the first surface of the substrate over the port;
in integrated circuit (IC);
a cover disposed on the substrate covering the MEMS transducer and the IC; and
an ingress protection element positioned to cover the port, the ingress protection element comprising a third surface facing an environment outside the sensor, a fourth opposite facing surface, a perimeter of the third surface, and a thickness defined between the third and fourth surfaces, wherein the perimeter lies within a plane, and at least a portion of the third surface does not lie within the plane.

2. The sensor of claim 1 , wherein the ingress protection element is disposed on the second surface of the substrate.

3. The sensor of claim 1 , wherein the ingress protection element is disposed on the first surface of the substrate.

4. The sensor of claim 1 , wherein at least a portion of the ingress protection element is embedded into the substrate between the first surface and the second surface of the substrate.

5. The sensor of claim 1 , further comprising a shim assembly disposed on the substrate, the shim assembly having a plurality of walls that form a hollow interior cavity, the shim assembly having a top surface and a bottom surface, the bottom surface being coupled to the substrate; wherein the ingress protection element is coupled to the top surface of the shim assembly.

6. The sensor of claim 1 , wherein the second surface of the substrate includes an indented region around at least a portion of a periphery of the port, and wherein the ingress protection element is disposed on the indented region.

7. The sensor of claim 1 , wherein a distance measured between the portion of the third surface and the plane is greater than the thickness of the ingress protection element.

8. The sensor of claim 1 , wherein a cross-section of the third surface has a sinusoidal shape.

9. The sensor of claim 1 , wherein a cross-section of the third surface has a rectangular shape.

10. The sensor of claim 1 , wherein a cross-section of the third surface has a triangular shape.

11. The sensor of claim 1 , wherein a cross-section of the third surface includes a curvilinear domed shape.

12. A sensor comprising:
a substrate;
a microelectromechanical systems (MEMS) transducer;
an integrated circuit (IC);
a cover disposed on the substrate covering the MEMS transducer and the IC, the cover having a first surface and a second surface, the cover defining a port that extends between the first surface and the second surface; and
an ingress protection element positioned to cover the port, the ingress protection element comprising a third surface facing an environment outside the sensor, a fourth opposite facing surface, a perimeter of the third surface, and a thickness defined between the third and fourth surfaces, wherein the perimeter lies within a plane, and at least a portion of the third surface does not lie within the plane.

13. The sensor of claim 12 , wherein the ingress protection element is disposed on the second surface of the cover.

14. The sensor of claim 12 , wherein the ingress protection element is disposed on the first surface of the cover.

15. The sensor of claim 12 , further comprising a shim assembly disposed on the cover, the shim assembly having a plurality of walls that form a hollow interior cavity, the shim assembly having a top surface and a bottom surface, the bottom surface being coupled to the cover; wherein the ingress protection element is coupled to the top surface of the shim assembly.

16. The sensor of claim 12 , wherein the first surface of the cover defines at least a portion of a front volume of the sensor, wherein the first surface of the cover includes an indented region around at least a portion of a periphery of the port, and wherein the ingress protection element is disposed on the indented region of the first surface of the cover.

17. The sensor of claim 12 , wherein the first surface of the cover defines at least a portion of a front volume of the sensor, wherein the second surface of the cover opposite the first surface of the cover includes an indented region around at least a portion of a periphery of the port, and wherein the ingress protection element is disposed on the indented region of the second surface of the cover.

18. The sensor of claim 12 , wherein a distance measured between the portion of the third surface and the plane is greater than the thickness of the ingress protection element.

19. The sensor of claim 12 , wherein a cross-section of the third surface has a sinusoidal shape.

20. The sensor of claim 12 , wherein a cross-section of the third surface has a rectangular shape.

21. The sensor of claim 12 , wherein a cross-section of the third surface has a triangular shape.

22. The sensor of claim 12 , wherein a cross-section of the third surface includes a curvilinear domed shape.

Assignees

• Knowles Electronics Llc

Inventors

• Albers John J

Classifications

• H04R1/02 Primary

  Casings; Cabinets {; Supports therefor;} Mountings therein (H04R1/28 takes precedence {; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075}) · CPC title

• B81B7/0032

  Packages or encapsulation (processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023) · CPC title

• B81B2201/0271

  Resonators; ultrasonic resonators · CPC title

• B81B2203/019

  characterized by their profile · CPC title

• H04R2201/003

  Mems transducers or their use · CPC title