Memory module socket for an information handling system

Patent metadata

Field	Value
Publication number	US-11837828-B2
Application number	US-202117451696-A
Country	US
Kind code	B2
Filing date	Oct 21, 2021
Priority date	Oct 21, 2021
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A memory module socket, including a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including: a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point; a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins; a plurality of first ribs separating each of the first groupings of first contact pins; wherein when the first contact pins are in a first position, the second contact points of the first contact pins are in contact with respective first resistive coatings to complete a termination to ground.

First claim

What is claimed is:

1. A memory module socket, comprising:
a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including:
a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point, each of the first contact pins extending between a top side and a bottom side of the memory module socket, the top side opposite to the bottom side, the second contact point of each of the first contact pins positioned proximate to the top side of the memory module socket and the first contact point of each of the first contact pins positioned between the top side and the bottom side of the memory module socket;
a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins, the first resistive coatings positioned at an exposed surface of the memory module socket at the top side of the memory module socket;
a plurality of first ribs separating each of the first groupings of first contact pins;
wherein when the first contact pins are in a first position, the second contact points, at the top side of the memory module, of the first contact pins are in contact with respective first resistive coatings, at the top side of the memory module, to complete a termination to ground.

2. The memory module socket of claim 1 , further comprising:
a second member extending between the first end and the second end of the socket, the second member positioned along a second side of the socket, the second side of the socket opposite to the first side of the socket, the second member including:
a plurality of second contact pins, each of the second contact pins including a first contact point and a second contact point;
a plurality of second resistive coatings connecting two or more of the second contact pins to define second groupings of contact pins; and
a plurality of second ribs separating each of the second groupings of second contact pins.

3. The memory module socket of claim 2 , wherein when the second contact pins are in the first position, the second contact points of the second contact pins are in contact with respective second resistive coatings to complete a termination to ground.

4. The memory module socket of claim 3 , wherein when the first and the second contact pins are in the first position, a memory module is decoupled from the socket.

5. The memory module socket of claim 4 , wherein when the first and the second contact pins are in a second position, the first contact points of the first and the second contact pins contact the memory module, and the second contact points of the first and the second contact pins are disconnected from termination.

6. The memory module socket of claim 5 , wherein when the first and the second contact pins are in the second position, the memory module is coupled to the socket.

7. The memory module socket of claim 1 , wherein a first contact pin of the first grouping of contact pins is a ground pin.

8. The memory module socket of claim 7 , wherein a second contact pin of the first grouping of contact pins is a data pin.

9. The memory module socket of claim 8 , wherein a third contact pin of the first grouping of contact is a data pin.

10. An information handling system, comprising:
a processor;
memory media storing instructions executable by the processor to perform operations;
a memory module socket, including:
a first member extending between a first end and a second end of the socket, the second end of the socket opposite to the first end of the socket, the first member positioned along a first side of the socket, the first member including:
a plurality of first contact pins, each of the first contact pins including a first contact point and a second contact point, each of the first contact pins extending between a top side and a bottom side of the memory module socket, the top side opposite to the bottom side, the second contact point of each of the first contact pins positioned proximate to the top side of the memory module socket and the first contact point of each of the first contact pins positioned between the top side and the bottom side of the memory module socket;
a plurality of first resistive coatings connecting two or more of the first contact pins to define first groupings of contact pins, the first resistive coatings positioned at an exposed surface of the memory module socket at the top side of the memory module socket;
a plurality of first ribs separating each of the first groupings of first contact pins;
wherein when the first contact pins are in a first position, the second contact points at the top side of the memory module, of the first contact pins are in contact with respective first resistive coatings, at the top side of the memory module, to complete a termination to ground.

11. The information handling system of claim 10 , wherein the memory module socket further comprising:
a second member extending between the first end and the second end of the socket, the second member positioned along a second side of the socket, the second side of the socket opposite to the first side of the socket, the second member including:
a plurality of second contact pins, each of the second contact pins including a first contact point and a second contact point;
a plurality of second resistive coatings connecting two or more of the second contact pins to define second groupings of contact pins; and
a plurality of second ribs separating each of the second groupings of second contact pins.

12. The information handling system of claim 11 , wherein when the second contact pins are in the first position, the second contact points of the second contact pins are in contact with respective second resistive coatings to complete a termination to ground.

13. The information handling system of claim 12 , wherein when the first and the second contact pins are in the first position, a memory module is decoupled from the socket.

14. The information handling system of claim 13 , wherein when the first and the second contact pins are in a second position, the first contact points of the first and the second contact pins contact the memory module, and the second contact points of the first and the second contact pins are disconnected from termination.

15. The information handling system of claim 14 , wherein when the first and the second contact pins are in the second position, the memory module is coupled to the socket.

16. The information handling system of claim 10 , wherein a first contact pin of the first grouping of contact pins is a ground pin.

17. The information handling system of claim 16 , wherein a second contact pin of the first grouping of contact pins is a data pin.

18. The information handling system of claim 17 , wherein a third contact pin of the first grouping of contact is a data pin.

Assignees

• Dell Products Lp

Inventors

• Mutnury Bhyrav M
• Smith Mark A
• Farkas Sandor

Classifications

• H01R33/765 Primary

  the terminal pins having a non-circular disposition · CPC title

• H01R12/721 Primary

  cooperating directly with the edge of the rigid printed circuits · CPC title

• H01R33/96

  with switch operated by engagement or disengagement of coupling · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H01R12/737

  Printed circuits being substantially perpendicular to each other (for printed connections H05K3/366) · CPC title