MEMS encapsulation employing lower pressure and higher pressure deposition processes

Patent metadata

Field	Value
Publication number	US-11834331-B2
Application number	US-202117514282-A
Country	US
Kind code	B2
Filing date	Oct 29, 2021
Priority date	Apr 7, 2021
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A micro-electromechanical system (MEMS) device includes a moveable element within a cavity. The MEMS device also includes a first layer over the cavity, the first layer having a first hole and a second hole. The first hole has a first diameter. The second hole has a second diameter. The second diameter is larger than the first diameter, and the second hole is farther from the moveable element than the first hole. The first hole is sealed with a first dielectric material. The second hole is sealed with a second dielectric material. The cavity filled with a gas at a pressure of at least approximately 10 torr.

First claim

What is claimed is:

1. A method comprising:
forming a first hole through a layer on a micro-electromechanical system (MEMS) device, the first hole having a first diameter;
forming a second hole through the layer, the second, hole having a second diameter larger than the first diameter;
performing a first sealing process with a first gas at a first pressure to seal the first hole; and
performing a second sealing process with a second gas at a second pressure to seal the second hole.

2. The method of claim 1 , wherein the first sealing process includes a plasma enhanced chemical vapor deposition process.

3. The method of claim 2 , wherein the second sealing process includes an atmospheric pressure chemical vapor deposition process.

4. The method of claim 1 , wherein the second sealing process includes an atmospheric pressure chemical vapor deposition process.

5. The method of claim 1 , wherein forming the first and second holes comprises forming the second hole farther away from a movable element of the MEMS device than the first hole.

6. The method of claim 1 , wherein:
performing the first sealing process with the first gas at the first pressure includes performing a plasma enhanced chemical vapor deposition process at a pressure in a range of 50 mtorr to 1 torr; and
performing the second sealing process with the second gas at the second pressure includes performing an atmospheric chemical vapor deposition process at a pressure in a range of 300 torr to 760 torr.

7. The method of claim 1 , wherein the MEMS device includes a relay.

8. A micro-electromechanical system (MEMS) device, comprising:
a moveable element within a cavity;
a layer over the cavity, the layer having a first hole and a second hole, the first hole having a first diameter, the second hole having a second diameter, the second diameter larger than the first diameter, and the second hole farther from the moveable element than the first hole;
a first dielectric material on the layer covering the first hole; and
a second dielectric material on the first dielectric material covering the second hole.

9. The MEMS device of claim 8 , wherein the layer is a first layer, the MEMS device further comprises a second layer in the cavity, and the movable element is on an end of the second layer.

10. The MEMS device of claim 9 , wherein the second layer and the movable element is part of a relay, and the movable element includes a metal contact.

11. The MEMS device of claim 10 , wherein the metal contact is a first metal contact, and the MEMS device further comprises a second metal contact extending from a side of the cavity, the first metal contact movable towards or away from the second metal contact.

12. The MEMS device of claim 8 , wherein the first dielectric material covers a first part of the second hole, and the second dielectric material covers a second part of the second hole.

13. The MEMS device of claim 8 , wherein the first dielectric material and the second dielectric material are different.

14. The MEMS device of claim 8 , wherein the first dielectric material and the second dielectric material include at least one of: Silicon Dioxide, Silicon Nitride, Aluminum Oxide, silicon oxy-nitride, silicon carbide, or amorphous silicon.

15. The MEMS device of claim 8 , wherein the first hole has a diameter in a range of 0.4 to 0.8 microns, and the second hole has a diameter in a range of 1 to 1.5 microns.

16. The MEMS device of claim 8 , wherein the cavity is filled with a gas having a pressure of 10 Torr or above.

17. The method of claim 1 , wherein the first hole has a diameter in a range of 0.4 to 0.8 microns, and the second hole has a diameter in a range of 1 to 1.5 microns.

18. The method of claim 1 , wherein performing a first sealing process with a first gas at a first pressure comprises performing the first sealing process to covering a first part of the second hole; and
wherein performing a second sealing process with a second gas at a second pressure comprises performing the second sealing process to cover a second part of the second hole.

19. The method of claim 1 , further comprising: performing an undercut process using at least one of the first or second holes.

20. The method of claim 1 , wherein the layer is on a cavity, and the method further comprises removing sacrificial materials from the cavity using at least one of the first or second holes.

Assignees

• Texas Instruments Inc

Inventors

• Summerfelt Scott Robert
• Fruehling Adam Joseph

Classifications

• B81C1/00333 Primary

  Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325 · CPC title

• B81B7/0077

  Other packages not provided for in groups B81B7/0035 - B81B7/0074 · CPC title

• H01H45/02

  Bases; Casings; Covers (frames for mounting two or more relays or for mounting a relay and another electric component H02B1/01, H04Q1/08, H05K) · CPC title

• B81B2203/0315

  Cavities · CPC title

• B81C2203/019

  characterised by the material or arrangement of seals between parts · CPC title