Method and apparatus for forming three-dimensional curved surface on laminated substrate, and three-dimensional curved laminated substrate

Patent metadata

Field	Value
Publication number	US-11833800-B2
Application number	US-201816220084-A
Country	US
Kind code	B2
Filing date	Dec 14, 2018
Priority date	Dec 18, 2017
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

A method for forming a three-dimensional curved surface on a laminated substrate is provided. In the method, the laminated substrate is brought into close contact with an elastic sheet. Here, the laminated substrate comprises a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin. The elastic sheet is deformed while the laminated substrate is in close contact with the elastic sheet. The laminated substrate is brought into close contact with a temperature-controlled mold to soften the resin substrate.

First claim

The invention claimed is:

1. A method for forming, using a forming apparatus including a temperature-controlled mold and an elastic sheet, a three-dimensional curved surface on a laminated substrate, comprising:
arranging a laminated substrate on a top surface of the elastic sheet that faces away from a concave surface of the mold, the concave surface having the three-dimensional curved surface, the mold comprising a first hole connecting a back side of the mold and the concave surface, the elastic sheet having a second hole penetrating front and back surfaces thereof in a thickness direction and disposed on a flat surface around the three-dimensional curved surface so as to form a closed space to close the three-dimensional curved surface, the laminated substrate completely covering the second hole of the elastic sheet, the laminated substrate comprising a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin and a base layer on the resin substrate, the base layer having a hardness of 180 MPa or more, which is higher than a hardness of the resin substrate;
deforming the elastic sheet while the laminated substrate is arranged on the top surface of the elastic sheet by pumping through the first hole to exhaust air in the closed space between the concave surface of the mold and the elastic sheet; and
bringing the elastic sheet into direct contact with the temperature-controlled mold to soften the resin substrate.

2. The method of claim 1 , wherein the deforming step includes deforming the elastic sheet due to a difference in atmospheric pressure between air above and below the elastic sheet.

3. The method of claim 1 , wherein the mold has the three- dimensional curved surface to be brought into close contact with the laminated substrate, the three-dimensional curved surface being larger than the laminated substrate.

4. The method of claim 3 , wherein the mold is a concave mold.

5. The method of claim 1 , wherein a surface of the support substrate has a hardness of 180 MPa or more.

6. The method of claim 1 , wherein the laminated substrate further comprises an organic electronic material layer on the conductive layer.

7. The method of claim 1 , wherein the laminated substrate further comprises a processing resin substrate on one surface of the support substrate to be brought into close contact with the mold.

8. The method of claim 7 , wherein the processing resin substrate is bonded to the support substrate with a detachable adhesive layer.

9. The method of claim 1 , further comprising:
bonding the laminated substrate to another support after the three-dimensional curved surface has been formed on the laminated substrate.

10. The method of claim 9 , wherein the laminated substrate further comprises a protective sheet bonded to the support substrate via an adhesive layer, the protective sheet being detachable while the adhesive layer remains on the support substrate.

11. The method of claim 1 , wherein, in the deforming step, the elastic sheet deforms isotropically.

12. A method for forming, using a forming apparatus including a temperature-controlled mold and an elastic sheet, a three-dimensional curved surface on a laminated substrate, comprising:
arranging a laminated substrate on a substrate-holding sheet so that the laminated substrate is vertically suspended between the elastic sheet and a surface of the temperature-controlled mold, the surface of the temperature-controlled molded being a concave surface having the three-dimensional curved surface, the temperature-controlled mold comprising a first hole connecting a back side of the mold and the concave surface, the substrate-holding sheet having a second hole penetrating front and back surfaces thereof in a thickness direction and disposed on a flat surface around the three-dimensional curved surface to form a closed space to close the three-dimensional curved surface, and the laminated substrate completely covering the second hole of the substrate-holding sheet, the laminated substrate comprising a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin and a base layer on the resin substrate, the base layer having a hardness of 180 MPa or more, which is higher than a hardness of the resin substrate; and
deforming the elastic sheet while the laminated substrate is arranged on the substrate-holding sheet by pumping through the first hole to exhaust air in the closed space between the concave surface of the mold and the elastic sheet so as to force the laminated substrate into direct contact with the concave surface of the temperature-controlled mold, to soften the resin substrate.

13. The method of claim 1 , further comprising:
stopping the pumping to open the first hole to an atmosphere so that the elastic sheet returns to its original shape, and
releasing the laminated substrate from the mold.

14. The method of claim 12 , further comprising:
stopping the pumping to open the first hole to an atmosphere so that the elastic sheet returns to its original shape, and
releasing the laminated substrate from the mold.

Assignees

• Ricoh Co Ltd

Inventors

• Yashiro Tohru
• Takeuchi Kohji
• Takahashi Yasuhiro
• Kim Sukchan

Classifications

• B32B38/1866 Primary

  conforming the layers or laminate to a convex or concave profile · CPC title

• B29C51/14

  using multilayered preforms or sheets · CPC title

• B29C51/28

  for applying pressure through the wall of an inflated bag or diaphragm · CPC title

• B29C51/428

  of moulds or mould parts · CPC title

• B32B37/003

  to avoid air inclusion · CPC title