Method of preparing an electrode for use in forming a honeycomb extrusion die

Patent metadata

Field	Value
Publication number	US-11833604-B2
Application number	US-202017613822-A
Country	US
Kind code	B2
Filing date	May 21, 2020
Priority date	May 23, 2019
Publication date	Dec 5, 2023
Grant date	Dec 5, 2023

Abstract

Methods for forming an electrode for use in forming a honeycomb extrusion die. The method includes forming, by means of an additive manufacturing process, an electrode includes a base having a web extending from the base. The web defines a matrix of cellular openings. The method further includes forming a secondary electrode having a plurality of pins. The plurality of pins are shaped and arranged so as to mate with the matrix of cellular openings defined by the web of the electrode. The method further includes machining the electrode using the secondary electrode to smooth surfaces of the electrode formed by the additive manufacturing process.

First claim

What is claimed is:

1. A method for additively manufacturing a copper-tungsten electrode, the method comprising:
forming an electrode as a series of layers, wherein each layer is formed by:
depositing a layer of powder on a manufacturing platform or a previous layer in the series, wherein the layer of powder comprises a tungsten powder and a copper powder; and
fusing the layer of powder using a laser to apply a laser energy of about 1 to about 10 J/mm2 to the layer of powder;

wherein the electrode is comprised of an interconnected network of tungsten infiltrated by copper formed by the series of layers fused together; and
smoothing the electrode using a secondary electrode in a plunge electrical discharge machining process.

2. The method of claim 1 , wherein the electrode has a relative density of at least about 75%.

3. The method of claim 2 , wherein the electrode has a relative density of at least about 90%.

4. The method of claim 1 , wherein each of the tungsten powder and the copper powder has a particle size distribution of about 15 μm to about 55 μm.

5. The method of claim 1 , wherein each of the tungsten powder and the copper powder has a particle size distribution of about 25 μm or less.

6. The method of claim 1 , wherein the tungsten powder is present in the layer of powder in an amount of about 70 wt. % to about 90 wt. %.

7. The method of claim 1 , wherein the tungsten powder is present in the layer of powder in an amount of 75 wt. % and the copper powder is present in an amount of 25 wt. %.

8. The method of claim 1 , wherein depositing the layer of powder comprises depositing one of the tungsten powder or the copper powder, and subsequently depositing the other of the tungsten powder or the copper powder.

9. The method of claim 1 , wherein depositing the layer of powder comprises depositing a mixture of the copper powder and the tungsten powder.

10. The method of claim 1 , wherein forming the electrode comprises forming an electrode comprising a base having a web extending from the base, wherein the web defines a matrix of cellular openings.

11. The method of claim 10 , wherein forming the electrode further comprises forming one or more internal passages in the base of the electrode.

12. The method of claim 1 , wherein smoothing the electrode comprises smoothing the electrode such that the surface roughness of the electrode is about 1 to about 50 μm.

13. A method for manufacturing an electrode, comprising:
forming a porous tungsten structure in a layer-by-layer manner, wherein each layer is formed by:
depositing a layer of a tungsten powder; and
selectively fusing the tungsten powder prior to depositing a subsequent layer using a laser having a laser energy of about 1 to about 10 J/mm 2 ;

infiltrating the porous tungsten structure with molten copper so as to form an electrode comprising a porous tungsten structure infiltrated by copper; and
smoothing the electrode using a secondary electrode in a plunge electrical discharge machining process.

14. The method of claim 13 , wherein the porous tungsten structure has a relative density level of at least about 75%.

15. The method of claim 13 , wherein the tungsten powder has a particle size distribution of about 15 μm to about 55 μm.

16. The method of claim 13 , wherein infiltrating the porous tungsten structure with molten copper is performed by one of spontaneous or pressure infiltration, centrifugal infiltration, ultrasound-driven or aided infiltration, or Lorenz force infiltration.

17. The method of claim 13 , the electrode comprises a base having a web extending from the base, wherein the web defines a matrix of cellular openings configured to form a honeycomb pattern in an extrusion die corresponding to the matrix of cellular openings.

Assignees

• Corning Inc

Inventors

• Antesberger Timothy Eugene
• Bookbinder Dana Craig
• Coots Dana Eugene
• Farzadfar Seyed Amir
• Forenz Dominick John
• Grohsmeyer Ryan Joseph
• Humphrey Mark Lee
• Khayat Zakariya Radwan
• Miller Kenneth Richard
• Peterson Richard Curwood
• Rector John Charles

Classifications

• B23H7/24 Primary

  Electrode material · CPC title

• B22F10/28

  Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

• B22F10/66

  by mechanical means · CPC title

• B28B3/269

  For multi-channeled structures, e.g. honeycomb structures · CPC title

• B29C48/3001

  characterised by the material or their manufacturing process · CPC title