Antenna and electronic device including the same

Patent metadata

Field	Value
Publication number	US-11831071-B2
Application number	US-202217984662-A
Country	US
Kind code	B2
Filing date	Nov 10, 2022
Priority date	Mar 15, 2019
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing a direction opposite to the first plate, and a lateral member surrounding a space between the first and second plates and connected to or integrally formed with the second plate. The electronic device further includes a display disposed in the space so as to be visible from outside through at least a part of the first plate, and at least one antenna structure disposed in the space, including a first surface and a second surface facing a direction opposite to the first surface, and including a first area and a second area surrounded by the first area when viewed from above the first surface. The antenna structure may also include a plurality of insulating layers disposed between the first and second surfaces, first conductive patches disposed in the first area, when viewed from above the first surface, and disposed on the first surface or on a first insulating layer closer to the first surface than the second surface, a second conductive patch overlapped at least in part with the second area, when viewed from above the first surface, and disposed on a second insulating layer between the first insulating layer and the second surface, a ground layer disposed on a third insulating layer between the second insulating layer and the second surface or on the second surface, and one or more conductive walls formed along at least a portion of an outer periphery of the first area, when viewed from above the first surface, and extended from the first insulating layer to the ground layer. The electronic device includes at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal having a frequency between about 3 GHz and about 100 GHz.

First claim

What is claimed is:

1. An electronic device comprising:
a housing;
at least one antenna structure disposed in a space of the housing, including a first surface and a second surface facing a direction opposite to the first surface, including a first area and a second area surrounded by the first area when viewed from above the first surface, and including:
a plurality of insulating layers disposed between the first surface and the second surface,
first conductive patches overlapped with the first area, when viewed from above the first surface, and disposed on the first surface or disposed on first insulating layer of the plurality of insulating layers disposed between the first surface and the second surface closer to the first surface than the second surface,
a second conductive patch overlapped with the second area, when viewed from above the first surface,
one or more conductive walls overlapped with the first area, when viewed from above the first surface, which are disposed at a position between the first surface and the second surface, and
at least one ground layer disposed on the second surface or on second insulating layer of the plurality of insulating layers disposed between the second conductive patch and the second surface; and

at least one wireless communication circuit electrically connected to the second conductive patch and configured to at least one of transmit or receive a signal,
wherein the one or more conductive walls are electrically connected to the at least one ground layer, and
wherein when viewed from above the first surface, the one or more conductive walls are overlapped at least in part with at least one of the first conductive patches.

2. The electronic device of claim 1 , wherein the one or more conductive walls are capacitively coupled with the first conductive patches.

3. The electronic device of claim 1 , wherein the one or more conductive walls are disposed at least in part in a same plane as the first conductive patches.

4. The electronic device of claim 1 , wherein a first end of the one or more conductive walls is electrically connected to the at least one ground layer, and a second end of the one or more conductive walls is capacitively coupled with the first conductive patches, the first end facing a direction opposite to the second end.

5. The electronic device of claim 4 , wherein the first end of the one or more conductive walls is physically connected to the at least one ground layer.

6. The electronic device of claim 1 , wherein the one or more conductive walls are disposed in at least a portion of an outer periphery of the first area, when viewed from above the first surface.

7. The electronic device of claim 1 , wherein the one or more conductive walls are disposed along an outer perimeter of the first conductive patches, when viewed from above the first surface.

8. The electronic device of claim 1 , wherein the one or more conductive walls are formed through conductive vias that are electrically connected to and penetrate a plurality of conductive members disposed on at least two adjacent insulating layers of the plurality of insulating layers.

9. The electronic device of claim 2 , wherein the first conductive patches are indirectly grounded to the at least one ground layer, at least in part, through the capacitive coupling with the one or more conductive walls.

10. The electronic device of claim 2 , wherein the one or more conductive walls are disposed in a direction perpendicular to the first surface and a distance away from the second conductive patch.

11. The electronic device of claim 1 , wherein the first conductive patches do not overlap with the second conductive patch, when viewed from above the first surface.

12. The electronic device of claim 1 , wherein the first conductive patches surround the second conductive patch, when viewed from above the first surface.

13. The electronic device of claim 1 ,
wherein the at least one antenna structure includes a first layer region and a second layer region adjoining the first layer region,
wherein the first layer region includes the first conductive patches, the second conductive patch, and at least one of the plurality of insulating layers, and
wherein the second layer region includes the at least one ground layer and at least another one of the plurality of insulating layers.

14. The electronic device of claim 1 , wherein the second conductive patch is formed in a shape having a four-direction symmetrical structure.

15. The electronic device of claim 1 , wherein the first conductive patches and the second conductive patch are disposed at different positions respectively corresponding to different insulating layers of the plurality of insulating layers.

16. The electronic device of claim 1 ,
wherein the at least one antenna structure includes a third conductive patch overlapped with the second area, when viewed from above the first surface, and
wherein the second conductive patch and the third conductive patch are disposed at different positions respectively corresponding to different insulating layers of the plurality of insulating layers.

17. The electronic device of claim 1 , wherein the signal has a frequency between 3 gigahertz (GHz) and 100 GHz.

18. The electronic device of claim 1 , wherein the second conductive patch is capacitively coupled with at least one of the first conductive patches.

19. The electronic device of claim 1 , further comprising:
a display disposed in the space of the housing so as to be visible from outside the housing through at least a part of the housing.

20. The electronic device of claim 1 , wherein the at least one antenna structure includes four of the at least one antenna structure arranged linearly as a single structure.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Yun Sumin
• Kim Dongyeon
• Park Seongjin
• Jang Woomin
• Jeong Myunghun
• Jong Jehun
• Jo Jaehoon

Classifications

• H01Q1/523 Primary

  between antennas of an array · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H01Q1/38

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title

• H01Q1/48

  Earthing means; Earth screens; Counterpoises · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title