Backlight source and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-11829028-B2
Application number	US-202017419787-A
Country	US
Kind code	B2
Filing date	Dec 23, 2020
Priority date	Jan 20, 2020
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

A backlight source and a manufacturing method thereof are provided. The backlight source includes a first substrate, a plurality of light sources, a driving circuit layer, and a conductive line. The light sources are distributed on an upper surface of the first substrate. The second substrate is disposed opposite to the first substrate. The driving circuit layer is disposed on a surface of a side of the second substrate away from the first substrate. An end of the conductive line is connected to one of the light sources, and another end of the conductive line is bonded to the driving circuit layer.

First claim

What is claimed is:

1. A backlight source, comprising:
a first substrate;
a second substrate arranged opposite to the first substrate;
a plurality of light sources distributed on a first surface of the first substrate away from the second substrate;
a driving circuit layer disposed on a second surface of the second substrate away from the first substrate; and
a conductive line,
wherein an end of the conductive line is connected to one of the light sources, and another end of the conductive line is bent and bound to the driving circuit layer; and
wherein the conductive line is arranged on the first surface, a first lateral surface of the first substrate and a second lateral surface of the second substrate between the first substrate and the second substrate, and the second surface.

2. The backlight source of claim 1 , further comprising:
a protective layer correspondingly disposed on a lateral edge of the first substrate and a lateral edge of the second substrate and covering the conductive line.

3. The backlight source of claim 1 , further comprising:
an adhesive layer disposed between the first substrate and the second substrate.

4. The backlight source according to claim 3 , wherein a thickness of the adhesive layer ranges from 200 μm to 2 mm.

5. The backlight source of claim 1 , wherein the driving circuit layer includes:
a circuit board;
a connector disposed on a surface of a side of the circuit board and close to a lateral edge of the first substrate and a lateral edge of the second substrate; and
a driving device disposed on the surface of the side of the circuit board and disposed on a same layer as the connector.

6. The backlight source of claim 1 , wherein the conductive line comprises a first bending portion and a second bending portion, the first bending portion warps a corner at a connection point of the first surface and the first lateral surface, and the second bending portion warps a corner at a connection point of the second surface and the second lateral surface.

7. The backlight source of claim 6 , further comprising a protective layer, wherein the protective layer is attached on an outer surface of the conductive line and completely warps the first bending portion.

8. The backlight source of claim 7 , the protective layer further warps the first lateral surface and the second lateral surface completely.

9. The backlight source of claim 1 , wherein the driving circuit layer is disposed adjacent to the second lateral surface, and a portion of the conductive line arranged on the second surface is arranged on a side surface of the driving circuit layer away from the second substrate.

10. A method of manufacturing a backlight source, comprising following steps:
providing a first substrate and a second substrate, wherein the second substrate and the first substrate are disposed opposite to each other;
disposing a plurality of light sources on a first surface of the first substrate away from the second substrate;
disposing a driving circuit layer on a second surface of the second substrate away from the first substrate, wherein the driving circuit layer is close to a lateral edge of the first substrate and a lateral edge of the second substrate; and
forming a conductive line, wherein an end of the conductive line is connected to one of the light sources, and another end of the conductive line is bent and bound to the driving circuit layer, and the conductive line is arranged on the first surface, a first lateral surface of the first substrate and a second lateral surface of the second substrate between the first substrate and the second substrate, and the second surface.

11. The method of claim 10 , further comprising a following step:
forming a protective layer on the lateral edge of the first substrate and the lateral edge of the second substrate and covering the conductive line.

12. The method of claim 10 , wherein in the step of providing the first substrate and the second substrate, a third surface of the second substrate facing the first substrate is attached to a fourth surface of the first substrate facing the second substrate by an adhesive layer.

Assignees

• Shenzhen China Star Optoelectronics Semiconductor Display Tech Co Ltd

Inventors

• Zhang Xin
• Qiu Yongyuan
• Fu Linlin
• Cheng Xi

Classifications

• G02F1/133603 Primary

  with LEDs · CPC title

• G02F1/133612

  Electrical details · CPC title

• G02F1/1336 Primary

  Illuminating devices · CPC title

• G02F1/133608

  including particular frames or supporting means · CPC title