IEC zone 1 rated LED light engine using pre-molded optic

Patent metadata

Field	Value
Publication number	US-11828440-B2
Application number	US-202217686937-A
Country	US
Kind code	B2
Filing date	Mar 4, 2022
Priority date	Mar 23, 2021
Publication date	Nov 28, 2023
Grant date	Nov 28, 2023

Abstract

An encapsulated LED engine having a printed circuit board, a plurality of LED arrays, each of said LED arrays mounted on said printed circuit board, and electrically connected to each other, an encapsulation layer comprising a pre-molded optic positioned over and adhered to the printed circuit board, and a frame positioned over the LED arrays and secured to the printed circuit board. A method of forming an encapsulated LED engine is also provided.

First claim

We claim:

1. An encapsulated LED engine comprising:
a printed circuit board;
a plurality of LED arrays, each of said LED arrays mounted on said printed circuit board, and electrically connected to each other;
a flexible encapsulation layer comprising a pre-molded optic positioned over and adhered to the printed circuit board using an adhesive; and
a frame, separate from the pre-molded optic, positioned over the LED arrays and secured to the printed circuit board;
wherein the underside of the frame includes a plurality of ribs that abut the pre-molded optic; and;
wherein the plurality of ribs extend toward the center of the LED arrays.

2. The encapsulated LED engine as claimed in claim 1 , wherein the ribs are positioned in a star-like pattern.

3. The encapsulated LED engine as claimed in claim 1 , wherein the flexible encapsulation layer comprises silicone.

4. An encapsulated LED engine comprising:
a printed circuit board;
a plurality of LED arrays, each of said LED arrays mounted on said printed circuit board, and electrically connected to each other;
an encapsulation layer comprising a pre-molded optic positioned over and adhered to the printed circuit board;
a frame positioned over the LED arrays and secured to the printed circuit board;
wherein the frame includes a vertical first end and a vertical second end and a vertical member extending between the vertical first end and the vertical second end; and
wherein a plurality of ribs are positioned on an underside of the vertical first end, vertical second end, and vertical member.

5. The encapsulated LED engine as claimed in claim 4 , wherein the vertical first end, vertical second end, and vertical member are attached to both a horizontal top member and horizontal bottom member.

6. The encapsulated LED engine as claimed in claim 5 , wherein a plurality of ribs are positioned on an underside of the horizontal top member and horizontal bottom member.

7. The encapsulated LED engine as claimed in claim 6 , wherein the plurality of ribs abut the pre-molded optic.

8. The encapsulated LED engine as claimed in claim 7 , wherein the plurality of ribs extend toward a center of the LED arrays.

9. The encapsulated LED engine as claimed in claim 8 , wherein the ribs are positioned in a star-like pattern.

10. A method of forming an encapsulated LED engine including:
providing a printed circuit board having a plurality of LED arrays mounted on said printed circuit board, and electrically connected to each other, a flexible encapsulation layer comprising a pre-molded optic, and a frame, separate from the pre-molded optic, positionable over the pre-molded optic;
adhering the pre-molded optic onto the LED arrays;
securing the frame to the printed circuit board;
wherein an underside of the frame includes a plurality of ribs that abut the pre-molded optic; and;
wherein the plurality of ribs extend toward a center of the LED arrays.

11. The method of claim 10 , wherein the flexible encapsulation layer comprises silicone.

12. The method of claim 10 , wherein the frame includes a vertical first end, a vertical second end and a vertical member that extends between the vertical first end and the vertical second end that are each secured to a horizontal top member and a horizontal bottom member.

13. The method of claim 12 , wherein the plurality of ribs are positioned on an underside of the vertical first end, vertical second end, vertical member, horizontal top member, and horizontal bottom member.

14. The method of claim 10 , including positioning a jig over the pre-molded optic and pressing down on the jig as an adhesive used to adhere the pre-molded optic to the LED arrays is cured.

Assignees

• Appleton Grp Llc

Inventors

• Graff Timothy E
• Monteil Jean-Francois
• Sav Marius
• Kumar Sumit

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H20/855

  Optical field-shaping means, e.g. lenses · CPC title

• F21V19/002 Primary

  the fastening means engaging the encapsulation or the packaging of the semiconductor device · CPC title

• F21V5/007

  Array of lenses or refractors for a cluster of light sources, e.g. for arrangement of multiple light sources in one plane (combination of two or more refractors F21V5/008) · CPC title

• F21V19/003

  Fastening of light source holders, e.g. of circuit boards or substrates holding light sources · CPC title