Surrogate supports in additive manufacturing

US11826953B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11826953-B2
Application numberUS-201916568188-A
CountryUS
Kind codeB2
Filing dateSep 11, 2019
Priority dateSep 12, 2018
Publication dateNov 28, 2023
Grant dateNov 28, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

3-D build jobs having surrogate supports, 3-D printers using surrogate supports, and techniques to support vulnerable regions of build pieces using surrogate supports are disclosed. The surrogate supports are generated in a first material configuration and are offset via a gap from the vulnerable regions. The gap comprises a second material configuration, such as loose or partially fused powder on which the build piece can be supported during 3-D printing. In alternative embodiments, the gap instead includes thin manual ties or a solid body using material that is stronger but more amenable to breaking off without damaging the build piece. Post-processing steps are dramatically reduced as the surrogate supports and gaps facilitate virtually error-free separation from the build piece. In an embodiment, the surrogate supports include a support structure extending to a fixed base underneath, the fixed base being a build plate or a global surrogate.

First claim

Opening claim text (preview).

The invention claimed is: 1. A build job, comprising: one or more vulnerable regions requiring support during a three-dimensional (3-D) print; and at least one surrogate support offset from the vulnerable regions by a gap, wherein the surrogate support comprises at least one feature-based surrogate support in a first material configuration, the at least one feature-based surrogate support configured to support a vulnerable region in the one or more vulnerable regions, wherein the gap comprises a second material configuration. 2. The build job of claim 1 , wherein the first material configuration comprises fused powder. 3. The build job of claim 1 , wherein the second material configuration comprises partially sintered powder. 4. The build job of claim 1 , wherein the at least one feature-based surrogate support further comprises a support structure extending underneath the feature-based surrogate support to a fixed base. 5. The build job of claim 4 , wherein the fixed base comprises one of a build plate, or a global surrogate support configured to separate the at least one feature-based surrogate support from the build plate. 6. The build job of claim 4 , wherein the support structure comprises a lattice. 7. The build job of claim 1 , wherein the surrogate support is segmented into a plurality of supports.

Assignees

Inventors

Classifications

  • B29C64/153Primary

    using layers of powder being selectively joined, e.g. by selective laser sintering or melting · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • characterised by structural features · CPC title

  • Means for applying layers · CPC title

  • Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

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Frequently asked questions

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What does patent US11826953B2 cover?
3-D build jobs having surrogate supports, 3-D printers using surrogate supports, and techniques to support vulnerable regions of build pieces using surrogate supports are disclosed. The surrogate supports are generated in a first material configuration and are offset via a gap from the vulnerable regions. The gap comprises a second material configuration, such as loose or partially fused powder…
Who is the assignee on this patent?
Divergent Tech Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/153. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Nov 28 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).