Circuit card assembly (CCA) module thermal interface devices

Patent metadata

Field	Value
Publication number	US-11825633-B2
Application number	US-202217674035-A
Country	US
Kind code	B2
Filing date	Feb 17, 2022
Priority date	Feb 17, 2022
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

An assembly includes a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components. A chassis including an electrical interface is included. The connector of the CCA module is electrically connected to the electrical interface. The chassis includes a removable cover. A heat transfer element is included between the cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the cover of the chassis.

First claim

What is claimed is:

1. An assembly comprising:
a circuit card assembly (CCA) module including a CCA with heat generating electronic components and a connector electrically connected to the heat generating electronic components;
a chassis including an electrical interface, wherein the connector of the CCA module is electrically connected to the electrical interface, wherein the chassis includes a removable cover; and
a heat transfer element between the removable cover of the chassis and an edge of the CCA module for heat sinking heat from the heat generating electronic components through the heat transfer element to the removable cover of the chassis, wherein the heat transfer element is metallic, wherein the heat transfer element is resiliently compressed between the CCA module and the removable cover, wherein the heat transfer element includes undulations in a direction away from the connector, and wherein the undulations in an uncompressed state are larger than a gap between the CCA module and the removable cover so as to compress between the CCA module and the removable cover.

2. The assembly as recited in claim 1 , wherein the removable cover is on an opposite side of the chassis from the electrical interface.

3. The assembly as recited in claim 1 , wherein the edge of the CCA module is opposite the connector.

4. The assembly as recited in claim 1 , wherein the heat transfer element is affixed to the CCA module for removal and installation from the chassis together with the CCA module.

5. The assembly as recited in claim 1 , wherein the heat transfer element is affixed to the removable cover for removal and installation from the chassis together with the removable cover.

6. The assembly as recited in claim 1 , wherein the heat transfer element is in thermal contact with an interior surface of the removable cover, and wherein an exterior surface of the removable cover includes heat transfer fins.

Assignees

• Hamilton Sundstrand Corp Hsc
• Hamilton Sundstrand Corp

Inventors

• Trotman Alexander
• Kamp Josh
• Schwartz Judy
• Defelice Robert
• Doe Jr Michael
• Delugan Anthony Matthew

Classifications

• H05K7/205 Primary

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• H05K7/1404

  by edge clamping, e.g. wedges · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H05K7/20454 Primary

  with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste · CPC title

• H05K7/20445

  the coupling element being an additional piece, e.g. thermal standoff · CPC title