Printed circuit board, display device, and manufacturing method of display device

Patent metadata

Field	Value
Publication number	US-11825600-B2
Application number	US-202117410436-A
Country	US
Kind code	B2
Filing date	Aug 24, 2021
Priority date	Sep 11, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

Provided are a printed circuit board, a display device and a method of manufacturing a display device. The printed circuit board includes a base film including a first surface and a second surface, lead lines disposed on the first surface of the base film, and a first cover layer that covers at least a part of the lead lines and includes fill-in portions disposed between the lead lines. Each of the fill-in portions has a surface height less than a surface height of each of the lead lines with respect to the first surface of the base film.

First claim

What is claimed is:

1. A printed circuit board comprising:
a base film including a first surface and a second surface;
a plurality of lead lines disposed on the first surface of the base film; and
a first cover layer that covers at least a part of the plurality of lead lines and includes a plurality of fill-in portions disposed between the plurality of lead lines, each of the plurality of fill-in portions having a surface height less than a surface height of each of the plurality of lead lines with respect to the first surface of the base film, wherein
the first cover layer includes a cover portion having a surface height greater than the surface height of each of the plurality of lead lines,
the plurality of fill-in portions expose an end portion of each of the plurality of lead lines, and
the cover portion covers a middle portion of each of the plurality of lead lines.

2. The printed circuit board of claim 1 , wherein the plurality of fill-in portions expose a surface of each of the plurality of lead lines and cover at least a part of side surfaces of each of the plurality of lead lines, the side surfaces of each of the plurality of lead lines being connected to the surface of each of the plurality of lead lines.

3. The printed circuit board of claim 2 , wherein the plurality of fill-in portions directly contact the first surface of the base film and the side surfaces of each of the plurality of lead lines.

4. The printed circuit board of claim 1 , wherein the cover portion covers a surface of each of the plurality of lead lines and side surfaces which are connected to the surface.

5. The printed circuit board of claim 1 , wherein the cover portion and the plurality of fill-in portions are integral with each other and include a same material.

6. The printed circuit board of claim 1 , wherein the first cover layer includes a photosensitive insulating material.

7. The printed circuit board of claim 6 , wherein the photosensitive insulating material includes photosensitive polyimide.

8. The printed circuit board of claim 1 , wherein the plurality of fill-in portions and the plurality of lead lines form an uneven structure.

9. The printed circuit board of claim 1 , wherein the first cover layer is disposed directly on the first surface of the base film.

10. The printed circuit board of claim 1 , further comprising a second cover layer disposed on the second surface of the base film.

11. The printed circuit board of claim 10 , wherein the first cover layer and the second cover layer include a same material.

12. A printed circuit board comprising:
a base film including a first surface and a second surface;
a plurality of lead lines disposed on the first surface of the base film; and
a first cover layer that covers at least a part of the plurality of lead lines and includes a plurality of fill-in portions disposed between the plurality of lead lines, each of the plurality of fill-in portions having a surface height less than a surface height of each of the plurality of lead lines with respect to the surface of the base film, wherein
the first cover layer includes a stepped portion that exposes an end portion of each of the plurality of lead lines.

13. A display device comprising:
a display panel including a plurality of signal lines; and
a printed circuit board disposed on the display panel and including:
a base film;
a plurality of lead lines disposed on a surface of the base film and electrically connected to the plurality of signal lines;
a cover layer covering at least a part of the plurality of lead lines; and
a plurality of fill-in portions disposed between the plurality of lead lines, each of the plurality of fill-in portions having a surface height less than a surface height of each of the plurality of lead lines with respect to the surface of the base film, wherein
the cover layer includes a stepped portion that exposes an end portion of each of the plurality of lead lines.

14. The display device of claim 13 , wherein the cover layer includes a photosensitive insulating material.

Assignees

• Samsung Display Co Ltd

Inventors

• Park Tae Jin
• Ko Gyung Hyun
• Ma Hee Ju
• Lee Woo Jin
• Cho Yeon Je

Classifications

• H05K1/0296 Primary

  Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 (H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18) · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K2201/10128

  Display · CPC title

• H05K1/02 Primary

  Details · CPC title

• H05K3/287 Primary

  Photosensitive compositions · CPC title