Electronic device console with natural draft cooling

Patent metadata

Field	Value
Publication number	US-11825592-B2
Application number	US-202017062926-A
Country	US
Kind code	B2
Filing date	Oct 5, 2020
Priority date	Jul 18, 2012
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

An electronic device console includes a console body that houses a chip package, and a duct extending from the console body. An interior volume of the duct is in fluid communication with an interior volume of the console body. A first vent is at a distal end of the duct. A second vent is in a wall of the console body. The console may be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

First claim

What is claimed:

1. An electronic device console, comprising:
a console body that comprises a hollow interior volume that houses a chip package;
a duct extending from the console body;
a first vent at a distal end of the duct; and
a second vent in a wall of the console body,
wherein the electronic device console is structured and arranged to be oriented in a first orientation and a second orientation,
the electronic device comprises a slide mechanism positioned at a top orientation of the console body such that a proximate end of the duct is moveable into the console body through the slide mechanism that allows translational movement of the duct relative to the console body when the electronic device console is oriented in the first orientation, and the slide mechanism allows a portion of the duct to be moved within the console body,
the duct comprises a hollow body which is in fluid communication with the hollow interior volume of the console body,
the first vent is an outlet and the second vent is an inlet in the first orientation, and
the first vent is an inlet and the second vent is an outlet in the second orientation.

2. The electronic device console of claim 1 , wherein the electronic device console is devoid of a fan.

3. The electronic device console of claim 1 , wherein a length of the duct is greater than a width of the duct.

4. The electronic device console of claim 1 , wherein:
the first vent is vertically aligned with the chip package in the first orientation; and
the second vent is vertically aligned with the chip package in the second orientation.

5. The electronic device console of claim 1 , wherein the chip package comprises: a chip, a printed circuit board, a lid, and a heat sink.

6. The electronic device console of claim 1 , wherein:
the electronic device console is a gaming console;
the gaming console comprises a system structured and arranged to receive a disc; and
the chip package comprises a gaming processor that executes a gaming application based on data obtained from the disc.

7. The electronic device console of claim 1 , wherein a length of the duct is adjustable.

8. The electronic device console of claim 1 , wherein a length of the duct outside of the console body is less than an extended length of the duct.

9. The electronic device console of claim 8 , wherein the electronic device console comprises a fan to supplement convection cooling of the chip package.

10. The electronic device console of claim 1 , wherein the chip package comprises a wirebond package.

11. The electronic device console of claim 10 , wherein the duct is detachable from the console body.

12. The electronic device console of claim 1 , wherein the duct functions as a chimney for natural convection cooling of the chip package when the electronic device console is oriented in the first orientation.

13. The electronic device console of claim 12 , wherein the console body functions as a chimney for natural convection cooling of the chip package when the electronic device console is oriented in the second orientation.

14. The electronic device console of claim 1 , wherein the chip package is spatially located within the console body such that a first straight vertical line intersects the chip package and the first vent when the electronic device console is oriented in the first orientation.

15. The electronic device console of claim 14 , wherein the chip package is spatially located within the console body such that a second straight vertical line intersects the chip package and the second vent when the electronic device console is oriented in the second orientation.

16. The electronic device console of claim 15 , further comprising a plurality of feet which is located on a bottom side and a lateral side of the electronic device console.

17. The electronic device console of claim 16 , wherein the first vent and the second vent comprises a slot design.

18. An electronic device console, comprising:
a console body that comprises a hollow interior volume that houses a chip package;
a duct connected to the console body;
a first vent at a distal end of the duct; and
a second vent in a wall at a lateral side of the console body;
wherein the electronic device console is structured and arranged to be oriented in a first orientation and a second orientation,
the electronic device further comprises a slide mechanism positioned at a top of the console body and which allows translational movement of the duct relative to the console body when the electronic device console is oriented in the first orientation such that a proximate end of the duct is moveable into the console body through the slide mechanism,
the first vent is vertically aligned with a chip package in the first orientation, and
the second vent is vertically aligned with the chip package in the second orientation.

19. The electronic device console of claim 18 , wherein:
in the first orientation, the first vent is an outlet and the second vent is an inlet of a first flow path of the natural convection cooling; and
in the second orientation, the first vent is an inlet and the second vent is an outlet of a second flow path of the natural convection cooling.

Assignees

• IBM

Inventors

• Sikka Kamal K
• Lian Chenzhou
• Rivera Kathryn C
• Bodenweber Paul F
• Casey Jon A

Classifications

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20127 Primary

  Natural convection · CPC title

• Y10T29/49002

  Electrical device making · CPC title