Material for forming organic film, method for forming organic film, patterning process, and compound

Patent metadata

Field	Value
Publication number	US-11822247-B2
Application number	US-202117183946-A
Country	US
Kind code	B2
Filing date	Feb 24, 2021
Priority date	Mar 2, 2020
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

The present invention is a material for forming an organic film, including: a compound shown by the following general formula (1); and an organic solvent, where in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R 1 independently represents any of the following general formulae (2), where in the general formulae (2), broken lines represent attachment points to X, and Q 1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3), where in the general formulae (3), broken lines represent attachment points, X 1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R 2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point. An object of the present invention is to provide a material for forming an organic film for forming an organic film having dry etching resistance, and also having high filling and planarizing properties and adhesion to a substrate.

First claim

The invention claimed is:

1. A material for forming an organic film, comprising: a compound shown by the following general formula (1); and an organic solvent,

wherein in the general formula (1), X represents an organic group with a valency of “n” having 2 to 50 carbon atoms or an oxygen atom, “n” represents an integer of 1 to 10, and R 1 independently represents any of the following general formulae (2),

wherein in the general formulae (2), broken lines represent attachment points to X, and Q 1 represents a monovalent organic group containing a carbonyl group, at least a part of which is a group shown by the following general formulae (3),

wherein in the general formulae (3), broken lines represent attachment points, X 1 represents a single bond or a divalent organic group having 1 to 20 carbon atoms optionally having a substituent when the organic group has an aromatic ring, R 2 represents a hydrogen atom, a methyl group, an ethyl group, or a phenyl group, and ** represents an attachment point.

2. The material for forming an organic film according to claim 1 , wherein the compound of the general formula (1) is any of the following general formulae (4), (6), (7), (8), (9), (10), (11), (12), (13), and (14),

wherein in the general formula (4), n7 and n8 each independently represent 0 or 1, W represents a single bond or any structure shown by the following general formulae (5), R 1 has the same meaning as defined above, m1 and m2 each independently represent an integer of 0 to 4, and m1+m2 is 1 or more to 8 or less,

wherein in the general formulae (5), n9 represents an integer of 0 to 3, R a to R f each independently represent a hydrogen atom or an optionally fluorine-substituted alkyl group having 1 to 10 carbon atoms or phenyl group, and R a and R b are optionally bonded with each other to form a ring,

wherein in the general formula (6), R g represents a hydrogen atom, a methyl group, or a phenyl group,

wherein in the general formulae (7) to (11), R 1 has the same meaning as defined above, R h , R i , R j , R k , R l , R m , and R n each represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, or a benzyl group or a phenyl group optionally having a substituent on an aromatic ring, Y represents R 1 , a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkynyl group having 2 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms, and at least two of the four Ys in the general formula (11) represent R 1 ,

wherein in the general formulae (12) to (14), R 1 has the same meaning as defined above, R o in the general formula (12) represents a linear saturated or unsaturated divalent hydrocarbon group having 1 to 20 carbon atoms or a branched or cyclic saturated or unsaturated divalent hydrocarbon group having 3 to 20 carbon atoms, and R p in the general formula (13) represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms.

3. The material for forming an organic film according to claim 1 , wherein Q 1 in the general formula (2) comprises any one or more shown by the general formulae (3) and any one or more shown by the following general formulae (15) and (16),

wherein R q in the general formula (15) represents a linear saturated or unsaturated hydrocarbon group having 1 to 30 carbon atoms or a branched or cyclic saturated or unsaturated hydrocarbon group having 3 to 30 carbon atoms, a methylene group comprised in R q is optionally substituted with an oxygen atom or a carbonyl group, and in the general formula (16), R s represents a hydrogen atom, a linear hydrocarbon group having 1 to 10 carbon atoms, or a branched hydrocarbon group having 3 to 10 carbon atoms, R t represents a linear hydrocarbon group having 1 to 10 carbon atoms, a branched hydrocarbon group having 3 to 10 carbon atoms, a halogen atom, a nitro group, an amino group, a nitrile group, an alkoxycarbonyl group having 1 to 10 carbon atoms, or an alkanoyloxy group having 1 to 10 carbon atoms, n11 represents 0 to 2, n12 and n13 represent a number of substituents on the aromatic ring, n12 and n13 represent an integer of 0 to 7, and n12+n13 is 0 or more to 7 or less.

4. The material for forming an organic film according to claim 1 , wherein the organic solvent is a mixture of one or more organic solvents each having a boiling point of lower than 180° C. and one or more organic solvents each having a boiling point of 180° C. or higher.

5. A method for forming an organic film that functions as an organic flat film employed in a semiconductor device manufacturing process, the method comprising:
spin-coating a substrate to be processed with the material for forming an organic film according to claim 1 ; and
heating the substrate to be processed at a temperature of 100° C. or higher to 600° C. or lower for 10 to 600 seconds to form a cured film.

6. The method for forming an organic film according to claim 5 , wherein the substrate to be processed has a structure or a step with a height of 30 nm or more.

7. A method for forming an organic film that functions as an organic flat film employed in a semiconductor device manufacturing process, the method comprising:
spin-coating a substrate to be processed with the material for forming an organic film according to claim 1 ; and
heating the substrate to be processed in an atmosphere having an oxygen concentration of 0.1% or more to 21% or less to form a cured film.

8. The method for forming an organic film according to claim 7 , wherein the substrate to be processed has a structure or a step with a height of 30 nm or more.

9. A patterning process comprising:
forming a resist underlayer film by using the material for forming an organic film according to claim 1 on a body to be processed;
forming a resist middle layer film by using a resist middle layer film material containing a silicon atom on the resist underlayer film;
forming a resist upper layer film by using a resist upper layer film material being a photoresist composition on the resist middle layer film;
forming a circuit pattern in the resist upper layer film;
transferring the pattern to the resist middle layer film by etching while using the resist upper layer film having the formed circuit pattern as an etching mask;
transferring the pattern to the resist underlayer film by etching while using the resist middle layer film having the transferred circuit pattern as an etching mask; and
further forming the circuit pattern on the body to be processed by etching while using the resist underlayer film having the transferred circuit pattern as an etching mask.

10. The patterning process according to claim 9 , wher

Assignees

• Shinetsu Chemical Co

Inventors

• Nakahara Takayoshi
• Kori Daisuke
• Biyajima Yusuke

Classifications

• H10P76/2049

  Ion beam lithography processes · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/2043

  using an anti-reflective coating · CPC title

• H10P14/61

  using masks · CPC title