Method and an apparatus for applying thin film material onto a substrate

Patent metadata

Field	Value
Publication number	US-11819864-B2
Application number	US-202217988874-A
Country	US
Kind code	B2
Filing date	Nov 17, 2022
Priority date	Nov 18, 2021
Publication date	Nov 21, 2023
Grant date	Nov 21, 2023

Abstract

A method for applying thin film material onto a substrate comprises: forming microdroplets of a solvent and a solute material forming the thin film material; depositing the microdroplets on an upper surface of a micro-structured mesh, wherein the microdroplets are deposited to allow coalescing into droplets extending into the micro-structured mesh; and arranging a surface of the substrate in close relation to a bottom surface of the micro-structured mesh such that a capillary force draws liquid of the droplets onto the surface of the substrate, whereby forced dynamic wetting of the surface of the substrate is provided to form a liquid film on the surface of the substrate.

First claim

The invention claimed is:

1. A method for applying thin film material onto a substrate, said method comprising:
forming microdroplets of a solvent and a solute material forming the thin film material;
depositing the microdroplets on an upper surface of a micro-structured mesh, wherein the microdroplets are deposited to allow coalescing of microdroplets on the micro-structured mesh into droplets extending at least into the micro-structured mesh and possibly protruding from a bottom surface of the micro-structured mesh; and
arranging a surface of the substrate in close relation to, but not touching, the bottom surface of the micro-structured mesh such that a capillary force draws liquid of the droplets extending at least into the micro-structured mesh and possibly protruding from the bottom surface of the micro-structured mesh onto the surface of the substrate, whereby forced dynamic wetting of the surface of the substrate is provided to form a uniform liquid film on the surface of the substrate.

2. The method according to claim 1 , further comprising, after the uniform liquid film has been formed on the surface of the substrate, separating the micro-structured mesh from the substrate.

3. The method according to claim 2 , further comprising, after the uniform liquid film has been formed on the surface of the substrate, allowing the solvent to evaporate to leave the solute material on the surface of the substrate for forming a thin film on the substrate.

4. The method according to claim 3 , wherein the thin film being formed on the substrate has a thickness smaller than 50 nm, such as smaller than 15 nm.

5. The method according to claim 3 , further comprising controlling a concentration of the solute material in the microdroplets being formed such that a thickness of the thin film being formed on the substrate is controlled.

6. The method according to claim 1 , wherein the microdroplets are deposited to allow coalescing of microdroplets on the micro-structured mesh into droplets protruding from the bottom surface of the micro-structured mesh and wherein arranging the surface of the substrate in close relation to the bottom surface of the micro-structured mesh comprises bringing the substrate in contact with the droplets protruding from the bottom surface of the micro-structured mesh.

7. The method according to claim 1 , wherein the micro-structured mesh is formed by interlaced threads defining spacings between the threads.

8. The method according to claim 7 , wherein a distance between adjacent threads is smaller than five times a diameter of the formed microdroplets.

9. The method according to claim 7 , wherein the micro-structured mesh comprises a regular mesh pattern.

10. The method according to claim 1 , wherein a diameter of the microdroplets is at least a factor 10 times smaller than a capillary length of the solvent.

11. The method according to claim 1 , wherein arranging the surface of the substrate in close relation to the bottom surface of the micro-structured mesh comprises exerting a force on the micro-structured mesh for bringing the micro-structured mesh in close relation to the surface of the substrate.

12. The method according to claim 11 , wherein the micro-structured mesh is flexible for bringing a portion of the micro-structured mesh in close relation to the surface of the substrate.

13. The method according to claim 1 , wherein forming and depositing of microdroplets is made using ultrasonic spray coating.

Assignees

• Imec Vzw
• Univ Hasselt

Inventors

• Shanivarasanthe Nithyananda Kumar Rachith
• Deferme Wim

Classifications

• H10K30/30

  comprising bulk heterojunctions, e.g. interpenetrating networks of donor and acceptor material domains · CPC title

• B05B17/06 Primary

  using ultrasonic {or other kinds of} vibrations · CPC title

• B05D1/02

  performed by spraying · CPC title

• H10K71/13 Primary

  using printing techniques, e.g. ink-jet printing or screen printing · CPC title

• B05C1/14

  using a travelling band · CPC title