Package structure of micro speaker and method for forming the same

Patent metadata

Field	Value
Publication number	US-11818563-B2
Application number	US-202217830448-A
Country	US
Kind code	B2
Filing date	Jun 2, 2022
Priority date	Jan 26, 2022
Publication date	Nov 14, 2023
Grant date	Nov 14, 2023

Abstract

A package structure of a micro speaker is provided. The package structure includes a substrate, a diaphragm, a coil, an etch stop layer, a carrier board, a permanent magnetic element, and package lid. The substrate has a hollow chamber. The diaphragm is suspended over the hollow chamber. The coil is embedded in the diaphragm. The etch stop layer is positioned below the coil and overlaps the coil in the direction that is perpendicular to the top surface of the diaphragm. The etch stop layer is made of a metal material. The carrier board is disposed on the bottom surface of the substrate. The permanent magnetic element is disposed on the carrier board and in the hollow chamber. The package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the top surface of the diaphragm.

First claim

What is claimed is:

1. A package structure of a micro speaker, comprising:
a substrate having a hollow chamber;
a diaphragm suspended over the hollow chamber;
a coil embedded in the diaphragm;
an etch stop layer positioned directly below the coil and overlapping the coil in a direction that is perpendicular to a top surface of the diaphragm, wherein the etch stop layer is made of a metal material;
a carrier board disposed on a bottom surface of the substrate;
a first permanent magnetic element disposed on the carrier board and in the hollow chamber; and
a package lid wrapped around the substrate and the diaphragm, wherein the package lid has a lid opening that exposes a portion of the top surface of the diaphragm.

2. The package structure of the micro speaker as claimed in claim 1 , wherein the diaphragm comprises polydimethylsiloxane (PDMS), phenolic epoxy resin, polyimide, or a combination thereof.

3. The package structure of the micro speaker as claimed in claim 1 , wherein a Young's modulus of the diaphragm is between 1 MPa and 100 GPa.

4. The package structure of the micro speaker as claimed in claim 1 , wherein a thickness of the diaphragm is between 0.1 μm and 20 μm.

5. The package structure of the micro speaker as claimed in claim 1 , wherein the metal material of the etch stop layer comprises aluminum, copper, aluminum-copper alloy, aluminum-silicon alloy, or aluminum-silicon-copper alloy.

6. The package structure of the micro speaker as claimed in claim 1 , wherein a thickness of the etch stop layer is greater than 100 μm.

7. The package structure of the micro speaker as claimed in claim 1 , wherein in a plan view, the etch stop layer is a continuous structure and has no openings in gaps between adjacent coil portions of the coil.

8. The package structure of the micro speaker as claimed in claim 1 , wherein in a plan view, the etch stop layer is a discontinuous structure and includes a plurality of solid portions corresponding to coil portions of the coil and a plurality of openings corresponding to gaps between adjacent coil portions of the coil.

9. The package structure of the micro speaker as claimed in claim 1 , wherein the etch stop layer is positioned between the coil and the hollow chamber.

10. The package structure of the micro speaker as claimed in claim 1 , wherein the coil comprises a first metal layer and a second metal layer, and the first metal layer is electrically connected to the second metal layer in an opening of the diaphragm.

11. The package structure of the micro speaker as claimed in claim 10 , wherein the first metal layer and the second metal layer are each made of aluminum silicon, aluminum, copper, or a combination thereof.

12. The package structure of the micro speaker as claimed in claim 10 , wherein a width of each of the first metal layer and the second metal layer is between 1 μm and 500 μm, and a thickness of each of the first metal layer and the second metal layer is between 0.1 μm and 20 μm.

13. The package structure of the micro speaker as claimed in claim 10 , wherein the first metal layer includes a spiral structure surrounding a central axis of the diaphragm, and the second metal layer crosses over the spiral structure of the first metal layer and is electrically connected to the first metal layer.

14. The package structure of the micro speaker as claimed in claim 1 , wherein the carrier board has at least one vent hole, and the at least one vent hole is configured to allow the hollow chamber to communicate with an external environment.

15. The package structure of the micro speaker as claimed in claim 1 , wherein the package lid is made of a metal material having a magnetic permeability lower than 1.25×10 −4 H/m.

16. The package structure of the micro speaker as claimed in claim 1 , further comprising a second permanent magnetic element disposed on the package lid, wherein the second permanent magnetic element is located below or above the lid opening.

17. A method for forming a package structure of a micro speaker, comprising:
forming an etch stop layer over a substrate, wherein the etch stop layer is made of a metal material;
forming a dielectric layer over the etch stop layer and the substrate;
forming a coil structure on the dielectric layer;
forming a diaphragm on the coil structure so that the coil structure is buried in the diaphragm;
forming a hollow chamber in the substrate by performing an etching process on a bottom surface of the substrate, wherein the coil structure is isolated from the hollow chamber by the etch stop layer after the etching process;
attaching a carrier board to the bottom surface of the substrate, wherein a first permanent magnetic element is mounted on the carrier board and positioned in the hollow chamber; and
mounting a package lid on the carrier board, wherein the package lid is wrapped around the substrate and the diaphragm, and has a lid opening that exposes a portion of the diaphragm.

18. The method as claimed in claim 17 , further comprising patterning the etch stop layer so that the etch stop layer has a discontinuous structure, wherein in a plan view, the discontinuous structure includes a plurality of solid portions corresponding to coil portions of the coil structure and a plurality of openings corresponding to gaps between adjacent coil portions of the coil structure.

19. The method as claimed in claim 17 , wherein the coil structure is a multi-layered structure including a first metal layer and a second metal layer over and electrically connected to the first metal layer, and the method further comprises:
patterning the dielectric layer to form an opening in the dielectric layer, wherein the first metal layer is electrically connected to the second metal layer in the opening.

20. The method as claimed in claim 17 , further comprising disposing a second permanent magnetic element on the package lid, wherein the diaphragm is located between the first and second permanent magnetic elements.

Assignees

• Fortemedia Inc

Inventors

• Chen Li-Jen
• Xu Yu-Xuan
• Cheng Yu-Ting
• Gong Shih-Chin

Classifications

• H04R9/06 Primary

  Loudspeakers · CPC title

• B81C1/00587

  Processes for avoiding or controlling over-etching not provided for in B81C1/00571 - B81C1/00579 · CPC title

• H04R1/025

  Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture · CPC title

• H04R7/04

  Plane diaphragms · CPC title

• H04R7/16

  Mounting or tensioning of diaphragms or cones · CPC title