Antenna structure and display device comprising same

US11815964B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11815964-B2
Application numberUS-202117154266-A
CountryUS
Kind codeB2
Filing dateJan 21, 2021
Priority dateJul 23, 2018
Publication dateNov 14, 2023
Grant dateNov 14, 2023

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. Signal efficiency and radiation reliability may be improved by adjusting a length of the bonding region.

First claim

Opening claim text (preview).

What is claimed is: 1. An antenna structure comprising: a film antenna comprising a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer; and a flexible circuit board comprising a power supply wiring electrically connected to the antenna electrode layer, wherein a bonding region is defined by a region in which the antenna electrode layer and the power supply wiring are overlapped with each other in a planar direction, and the bonding region has a length of 1.5 mm or less. 2. The antenna structure according to claim 1 , wherein the bonding region has a length of 1.1 mm or less. 3. The antenna structure according to claim 1 , wherein the bonding region has a length of 50 μm to 0.7 mm. 4. The antenna structure according to claim 1 , wherein the antenna electrode layer comprises a radiation pattern and a signal pad electrically connected to the radiation pattern, and the power supply wiring is electrically connected to the signal pad. 5. The antenna structure according to claim 4 , wherein the power supply wiring and the signal pad have the same bonding width as each other. 6. The antenna structure according to claim 5 , further comprising a conductive relay structure disposed between the power supply wiring and the signal pad, wherein the conductive relay structure has the same bonding width as that of the power supply wiring and the signal pad. 7. The antenna structure according to claim 1 , wherein the flexible circuit board further comprises a core layer and a power supply ground disposed on the upper surface of the core layer, wherein the power supply wiring is disposed on a lower surface of the core layer. 8. The antenna structure according to claim 7 , wherein the antenna electrode layer comprises a radiation pattern, a signal pad electrically connected to the radiation pattern, and ground pads disposed around the signal pad, and the power supply ground is electrically connected with the ground pads. 9. The antenna structure according to claim 1 , wherein the flexible circuit board is disposed on the antenna electrode layer of the film antenna. 10. The antenna structure according to claim 1 , wherein the flexible circuit board is disposed below a lower surface of the dielectric layer of the film antenna. 11. The antenna structure according to claim 10 , wherein the film antenna further comprises an antenna ground layer disposed on the lower surface of the dielectric layer. 12. The antenna structure according to claim 10 , wherein the antenna electrode layer is bent and extends on the lower surface of the dielectric layer. 13. The antenna structure according to claim 12 , wherein the flexible circuit board further comprises a power supply contact which electrically connects the antenna electrode layer and the power supply wiring. 14. The antenna structure according to claim 1 , further comprising a circuit structure disposed on the flexible circuit board to supply power to the antenna electrode layer through the power supply wiring. 15. The antenna structure according to claim 14 , wherein the antenna structure is driven at a frequency of 20 to 30 GHz, and is supplied with power corresponding to a range of 40 to 70Ω through the circuit structure. 16. The antenna structure according to claim 1 , wherein the antenna electrode layer comprises a mesh structure. 17. The antenna structure according to claim 16 , wherein the film antenna further comprises a dummy mesh layer disposed around the antenna electrode layer. 18. A display device comprising the antenna structure according to claim 1 .

Assignees

Inventors

Classifications

  • G06F1/1698Primary

    the I/O peripheral being a sending/receiving arrangement to establish a cordless communication link, e.g. radio or infrared link, integrated cellular phone (details of antennas disposed inside a computer H01Q1/2266) · CPC title

  • with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs] · CPC title

  • Power distribution · CPC title

  • H01Q1/22Primary

    by structural association with other equipment or articles · CPC title

  • using a particular conducting material, e.g. superconductor · CPC title

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What does patent US11815964B2 cover?
An antenna structure of an embodiment of the present invention includes a film antenna including a dielectric layer and an antenna electrode layer formed on an upper surface of the dielectric layer, and a flexible circuit board including a power supply wiring electrically connected to the antenna electrode layer. A bonding region is defined by a region in which the antenna electrode layer and t…
Who is the assignee on this patent?
Dongwoo Fine Chem Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06F1/1698. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 14 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).