Ultrasound transducer with curved transducer stack
US-2019366384-A1 · Dec 5, 2019 · US
US11813640B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11813640-B2 |
| Application number | US-201916687324-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 18, 2019 |
| Priority date | Nov 18, 2019 |
| Publication date | Nov 14, 2023 |
| Grant date | Nov 14, 2023 |
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Planar phased ultrasound transducer including a first layer including a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an epoxy material placed between the piezo frame and the sheet of piezoelectric material. The transducer includes a flex frame secured to a back side of the first layer.
Opening claim text (preview).
The invention claimed is: 1. A planar phased ultrasound transducer, comprising: a first layer including: a sheet of piezoelectric material, a piezo frame surrounding an outer perimeter of the sheet of piezoelectric material, and an adhesive material placed between the piezo frame and the sheet of piezoelectric material; a flex frame secured to a back side of the first layer; a first pair of alignment features secured to a first side of the flex frame; and a second pair of alignment features coupled to a second side of the flex frame. 2. The ultrasound transducer of claim 1 , wherein the sheet of piezoelectric material includes a number of kerf cuts therein to define a number of individual transducer elements. 3. The ultrasound transducer of claim 1 , wherein the piezo frame comprises alumina. 4. The ultrasound transducer of claim 1 , wherein the piezo frame comprises first and second vias, each via having silver epoxy disposed therein. 5. The ultrasound transducer of claim 1 , wherein the flex frame comprises alumina. 6. The ultrasound transducer of claim 1 , further comprising a conductive grounding layer secured to a front side of the first layer. 7. The ultrasound transducer of claim 6 , further comprising at least one matching layer secured to the conductive grounding layer. 8. The ultrasound transducer of claim 7 , further comprising a lens secured to the at least one matching layer. 9. The ultrasound transducer of claim 1 , further comprising a first flex circuit secured to the first pair of alignment features and a second flex circuit coupled to the second pair of alignment features, each flex circuit comprising copper traces. 10. The ultrasound transducer of claim 9 , further comprising a flex overmold secured to the first and second flex circuits, the first and second pairs of alignment features, the flex frame, and the back side of the first layer, wherein the copper traces of the first and second flex circuits are exposed through the flex overmold. 11. The ultrasound transducer of claim 10 , further comprising a plurality of conductive electrodes secured to the flex overmold and each coupled to at least one copper trace of the first and second flex circuits. 12. The ultrasound transducer of claim 1 , further comprising a backing fixed to the flex frame. 13. The ultrasound transducer of claim 1 , wherein: the first pair of alignment features comprises a first pair of alignment tabs; and the second pair of alignment features comprises a second pair of alignment tabs.
with multiple active layers · CPC title
with a plurality of electrodes on both sides · CPC title
on one surface · CPC title
using phase variation · CPC title
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