Thermally induced graphene sensing circuitry on intelligent valves, actuators, and pressure sealing applications

US11812561B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11812561-B2
Application numberUS-202016842852-A
CountryUS
Kind codeB2
Filing dateApr 8, 2020
Priority dateApr 8, 2020
Publication dateNov 7, 2023
Grant dateNov 7, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Thermally induced graphene sensing circuitry and methods for producing circuits from such thermally induced circuits are presented in conjunction with applications to hydrocarbon exploration and production, and related subterranean activities. The thermally induced graphene circuity advantageously brings electrically interconnections otherwise absent on oilfield service tools, enabling components and tools to become smart.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing thermally induced graphene sensing circuitry, comprising: preparing a surface of a component for placement of a coating on the surface; coating at least a portion of the surface of the component with a first polymeric material that includes carbon; applying a thermal scan to the coating of the first polymeric material to generate a pattern comprising graphene on the surface of the component, wherein the graphene is generated by the thermal scan, and wherein the pattern forms a printed circuit and comprises a zig-zag shape; coating at least a second portion of the surface of the component with an electrically-insulating second polymeric material; defining openings in the coating of the second polymeric material by leaving specific areas of the pattern uncovered when coating at least the second portion of the surface of the component with the electrically-insulating second polymeric material, wherein the openings provide access to the pattern; and adding electrical connections to the pattern, wherein the electrical connections include at least endpoints to the printed circuit. 2. The method according to claim 1 , wherein the pattern is created on to the surface of the component by projecting a photonic source on the coating of the first polymeric material. 3. The method according to claim 1 , wherein the pattern is created on to the surface of the component by applying a plasma source to the coating of the first polymeric material. 4. The method according to claim 1 , further comprising repeating one or more of the preparing, coating, applying, defining, and adding operations of claim 1 to form additional printed circuits on the surface of the component. 5. The method according to claim 1 , wherein the coating of the second polymeric material is formed by spraying. 6. The method according to claim 1 , wherein the coating of the second polymeric material is formed by an additive manufacturing process. 7. The method according to claim 1 , wherein the pattern is created on to the surface of the component by pyrolyzing the first polymeric material. 8. The method according to claim 1 , wherein the first polymeric material includes a polymer selected from the group consisting of polyimide, polytetrafluoroethylene, polyetheretherketone, and polyphenylene sulfide. 9. The method according to claim 1 , wherein the carbon of the first polymeric material is selected from the group consisting of oxides, nitrides, sulfides, phosphides, carbides, carbon nanotubes, fluorene, and graphene. 10. The method according to claim 1 , wherein the printed circuit is part of a strain gauge. 11. The method according to claim 1 , wherein the printed circuit is part of a pressure sensor. 12. The method according to claim 1 , wherein the printed circuit is part of a position sensor. 13. The method according to claim 1 , wherein the printed circuit is part of sensing circuity of an intelligent valve position sensor. 14. The method according to claim 1 , wherein the printed circuit is part of a button electrode. 15. The method according to claim 1 , wherein the component is a solid or hollow tube. 16. The method according to claim 1 , wherein the component is an elastomeric seal. 17. The method according to claim 1 , wherein the component is a casing. 18. The method according to claim 1 , wherein the component is a valve. 19. The method according to claim 1 , wherein the component is a button electrode.

Assignees

Inventors

Classifications

  • H05K3/0041Primary

    by plasma etching · CPC title

  • B33Y80/00Primary

    Products made by additive manufacturing · CPC title

  • by thermal decomposition · CPC title

  • of organic insulating material · CPC title

  • Processes of additive manufacturing · CPC title

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What does patent US11812561B2 cover?
Thermally induced graphene sensing circuitry and methods for producing circuits from such thermally induced circuits are presented in conjunction with applications to hydrocarbon exploration and production, and related subterranean activities. The thermally induced graphene circuity advantageously brings electrically interconnections otherwise absent on oilfield service tools, enabling componen…
Who is the assignee on this patent?
Schlumberger Technology Corp
What technology area does this patent fall under?
Primary CPC classification H05K3/0041. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).