Light source module including light-emitting diode

Patent metadata

Field	Value
Publication number	US-11811008-B2
Application number	US-202117154632-A
Country	US
Kind code	B2
Filing date	Jan 21, 2021
Priority date	May 25, 2020
Publication date	Nov 7, 2023
Grant date	Nov 7, 2023

Abstract

A light source module includes a light-emitting cell, a wiring structure provided on the light-emitting cell and connected to the light-emitting cell, a support structure that is apart from the light-emitting cell with the wiring structure therebetween in a vertical direction, a printed circuit board (PCB) that is apart from the wiring structure with the support substrate therebetween in the vertical direction and overlapping the light-emitting cell in the vertical direction, and at least one insulating film that is apart from the wiring structure in the vertical direction and covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the PCB.

First claim

What is claimed is:

1. A light source module comprising:
a light-emitting cell;
a wiring structure provided on the light-emitting cell and connected to the light-emitting cell;
a support substrate that is apart from the light-emitting cell with the wiring structure provided between the support substrate and the light-emitting cell in a vertical direction;
a printed circuit board that is apart from the wiring structure with the support substrate provided between the printed circuit board and the wiring structure in the vertical direction, the printed circuit board overlapping the light-emitting cell in the vertical direction, and the printed circuit board being adhered onto the support substrate; and
at least one insulating film that is apart from the wiring structure in the vertical direction, the at least one insulating film covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the printed circuit board.

2. The light source module of claim 1 , further comprising an adhesive layer provided between the support substrate and the wiring structure,
wherein the at least one insulating film is apart from the wiring structure with the adhesive layer provided between the at least one insulating film and the wiring structure in the vertical direction.

3. The light source module of claim 1 , wherein the at least one insulating film comprises an upper insulating film in contact with the first surface of the support substrate.

4. The light source module of claim 1 , wherein the at least one insulating film comprises a lower insulating film in contact with the second surface of the support substrate.

5. The light source module of claim 1 , wherein the at least one insulating film comprises:
an upper insulating film in contact with the first surface of the support substrate; and
a lower insulating film in contact with the second surface of the support substrate.

6. The light source module of claim 1 , wherein the at least one insulating film comprises SiO 2 , Si 3 N 4 , Al 2 O 3 , HfSiO 4 , Y 2 O 3 , ZrSiO 4 , HfO 2 , ZrO 2 , Ta 2 O 5 , La 2 O 3 , or a combination thereof.

7. The light source module of claim 1 , wherein the support substrate consists of only an insulating substrate.

8. The light source module of claim 1 , wherein the support substrate comprises a conductive substrate.

9. The light source module of claim 1 , wherein the support substrate comprises doped silicon, undoped silicon, Al 2 O 3 , tungsten (W), copper (Cu), a bismaleimide triazine (BT) resin, an epoxy resin, polyimide, a liquid crystal (LC) polymer, a copper clad laminate, or a combination thereof.

10. The light source module of claim 1 , further comprising a plurality of conductive pads provided on the support substrate at positions apart from the light-emitting cell in a lateral direction, the plurality of conductive pads being connected to the wiring structure,
wherein the wiring structure comprises at least one conductive line, and the at least one conductive line is configured to carry a current in the lateral direction.

11. The light source module of claim 1 , wherein a sheet resistivity of the at least one insulating film is at least 50 Megaohms per square.

12. The light source module of claim 1 , further comprising an electrode,
wherein the at least one insulating film comprises a buried insulating film, and a portion of the buried insulating film is at a same height in the vertical direction as the electrode, and the electrode is in contact with a conductive semiconductor layer of the light-emitting cell.

13. A light source module comprising:
a plurality of light-emitting cells that are apart from each other in a lateral direction;
a wiring structure provided on the plurality of light-emitting cells and configured to electrically connect the plurality of light-emitting cells to each other;
a support structure provided opposite the plurality of light-emitting cells with the wiring structure provided between the support structure and the plurality of light-emitting cells, the support structure extending in the lateral direction; and
a printed circuit board overlapping the plurality of light-emitting cells with the wiring structure and the support structure provided between the printed circuit board and the plurality of light-emitting cells in a vertical direction,
wherein the support structure comprises:
a support substrate; and
at least one insulating film covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the printed circuit board, and

wherein the printed circuit board is adhered onto the support substrate.

14. The light source module of claim 13 , further comprising a first adhesive layer provided between the support structure and the wiring structure,
wherein the at least one insulating film comprises an upper insulating film provided between the first adhesive layer and the support substrate.

15. The light source module of claim 13 , further comprising a second adhesive layer provided between the support structure and the printed circuit board,
wherein the at least one insulating film comprises a lower insulating film between the second adhesive layer and the support substrate.

16. The light source module of claim 13 , further comprising:
a first adhesive layer provided between the support structure and the wiring structure; and
a second adhesive layer provided between the support structure and the printed circuit board,
wherein the at least one insulating film comprises an upper insulating film provided between the first adhesive layer and the support substrate and a lower insulating film provided between the second adhesive layer and the support substrate.

17. The light source module of claim 13 , further comprising a plurality of conductive pads positioned on the support structure at positions apart from the plurality of light-emitting cells in the lateral direction, the plurality of conductive pads being connected to the wiring structure,
wherein the wiring structure comprises a plurality of conductive lines, and the plurality of conductive lines are configured to carry a corresponding plurality of conductive currents in the lateral direction.

18. A light source module comprising:
a plurality of light-emitting cells comprising a plurality of light-emitting stack structures, each light-emitting stack structure of the plurality of light-emitting stack structures comprising a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, which are sequentially stacked in a vertical direction, the plurality of light-emitting stack structures being apart from each other in a lateral direction;
a wiring structure comprising a plurality of conductive lines configured to connect the plurality of light-emitting cells to each other;
a buried insulating film covering the wiring structure;
an adhesive layer covering the buried insulating film;
a support structure that is apart from the buried insulating film with the adhesive layer provided between the support structure and the buried insulating film in the vertical direction; and
a printed circuit board overlapping the plurality of light-emitting stack structures in the vertical direction with the wiring structure and the support structure provided between the printed circuit board and the plurality of light-emitting stack structures,
wherein the suppor

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Inho
• Kwon Yongmin
• Kim Sanghyun
• Park Jinwoo
• Lee Dongyeoul
• Lee Dongju
• Lee Sangbum
• Lee Jonghyun
• Choi Dahyun

Classifications

• H10H20/82

  Roughened surfaces, e.g. at the interface between epitaxial layers · CPC title

• H10H20/822

  Materials of the light-emitting regions · CPC title

• H10H20/8506 Primary

  Containers · CPC title

• H10H20/0364

  of interconnections · CPC title

• H10H20/0361

  of wavelength conversion means · CPC title