Pre-conditioned self-destructing substrate

Patent metadata

Field	Value
Publication number	US-11810871-B2
Application number	US-202017125644-A
Country	US
Kind code	B2
Filing date	Dec 17, 2020
Priority date	Oct 20, 2016
Publication date	Nov 7, 2023
Grant date	Nov 7, 2023

Abstract

A self-destructing device includes a frangible substrate having at least one pre-weakened area. A heater is thermally coupled to the frangible substrate proximate to or at the pre-weakened area. When activated, the heater generates heat sufficient to initiate self-destruction of the frangible substrate by fractures that propagate from the pre-weakened area and cause the frangible substrate to break into many pieces.

First claim

The invention claimed is:

1. A method, comprising:
disposing a heater on or proximate to a frangible substrate such that the heater is thermally coupled to the frangible substrate, the frangible substrate comprising at least one pre-weakened area and a non-pre-weakened area; and
pre-conditioning the frangible substrate at or proximate to a location of the heater, wherein the pre-conditioning weakens the substrate at the pre-weakened area relative to the non-pre-weakened area without causing propagating fractures in the frangible substrate and wherein application of a predetermined level of energy to the heater initiates self-destruction of the frangible substrate by fractures propagating from the pre-weakened area and causing the frangible substrate to fracture;
wherein pre-conditioning the frangible substrate comprises activating the heater by an energy source at an energy lower than a threshold energy that initiates fractures in the pre-weakened area.

2. The method of claim 1 , wherein pre-conditioning the frangible substrate comprises applying to the frangible substrate less than 60% and more than 5% of the threshold energy that initiates fractures in the pre-weakened area.

3. The method of claim 1 , wherein pre-conditioning the frangible substrate comprises one or more of thermally, electrically, optically, chemically, and mechanically pre-conditioning the frangible substrate.

4. The method of claim 1 , wherein pre-conditioning the frangible substrate comprises forming one or more of pits, holes, and patterns on the substrate by one or more of chemical etching, plasma etching, ion milling, physical machining, and laser ablating the frangible substrate.

5. The method of claim 1 , further comprising activating the heater to initiate propagation of fractures in the pre-weakened area.

6. The method of claim 5 , wherein activating the heater comprises applying a predetermined amount of energy to the heater.

7. The method of claim 6 , wherein the predetermined amount of energy is less than 60% of a threshold energy that initiates fractures in the pre-weakened area.

8. The method of claim 6 , wherein the heater is a resistive heater and applying the predetermined amount of energy to the heater comprises applying current through the resistive heater.

9. The method of claim 1 , wherein the heater comprises one of a resistive conductive film, a microwave absorber, and an optical absorber.

10. The method of claim 1 , wherein one or more electronic circuits are disposed on the non-pre-weakened area of the frangible substrate such that the fractures in the frangible substrate also fracture the electronic circuits.

11. A method, comprising:
generating heat by a heater disposed on or proximate to a frangible substrate such that the heat is thermally coupled to the frangible substrate, the frangible substrate having at least one pre-weakened area and a non-pre-weakened area;
pre-conditioning the frangible substrate at or proximate to a location of the heater to weaken the substrate at the pre-weakened area relative to the non-pre-weakened area, wherein pre-conditioning the frangible substrate comprises activating the heater by an energy source at an energy lower than a threshold energy that initiates fractures in the pre-weakened area; and
applying a predetermined level of energy to the heater sufficient to initiate self-destruction of the frangible substrate by fractures propagating from the pre-weakened area and causing the frangible substrate to fracture.

12. The method of claim 11 , wherein the fractures cause the frangible substrate to break into pieces.

13. The method of claim 11 , wherein applying the predetermined level of energy to the heater results in applying less than 60% of a threshold energy to the frangible substrate that initiates fractures in the pre-weakened area.

14. The method of claim 11 , wherein the pre-weakened area comprises at least one of a thermally, optically, electrically, chemically, or mechanically pre-conditioned area.

15. The method of claim 11 , wherein the pre-weakened area comprises one or more of pits, holes, and patterns formed on the frangible substrate.

16. The method of claim 11 , wherein the frangible substrate comprises glass.

17. The method of claim 11 , wherein the frangible substrate comprises at least one tensile stress layer having a residual tensile stress and at least one compressive stress layer having a residual compressive stress and being mechanically coupled to the at least one tensile stress layer such that the at least one tensile stress layer and the at least one compressive stress layer are self-equilibrating.

18. The method of claim 11 , wherein the heater comprises one of a resistive conductive film, a microwave absorber, and an optical absorber.

19. The method of claim 11 , wherein one or more electronic circuits are disposed on the non-pre-weakened area of the frangible substrate such that the fractures in the frangible substrate also fracture the electronic circuits.

Assignees

• Palo Alto Res Ct Inc

Inventors

• Chua Christopher L
• Chang Norine
• Whiting Gregory

Classifications

• H10W20/493

  Fuses, i.e. interconnections changeable from conductive to non-conductive · CPC title

• H10W42/40 Primary

  protecting against tampering, e.g. unauthorised inspection or reverse engineering · CPC title

• H10F77/953

  for devices having potential barriers · CPC title

• H10F30/223

  the potential barrier being a PIN barrier · CPC title

• H01L23/573 Primary

  Electricity · mapped topic