Electronic device

US11810485B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11810485-B2
Application numberUS-202218075434-A
CountryUS
Kind codeB2
Filing dateDec 6, 2022
Priority dateApr 19, 2018
Publication dateNov 7, 2023
Grant dateNov 7, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device, comprising: a substrate having a plurality of structures; a circuit layer disposed on the substrate; and a plurality of diodes disposed on the circuit layer; wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structures, a second spacing is defined as a distance between a center point of a third one of the structures and a center point of a fourth one of the structures, and an absolute value of a difference between the first spacing and the second spacing is less than 0.5 times radius of curvature of the electronic device when the electronic device is bent. 2. The electronic device as claimed in claim 1 , wherein the structures are connected to each other to form a mesh-shaped structure. 3. The electronic device as claimed in claim 1 , wherein one of the structures is one of a through hole, a recess, and a bump. 4. The electronic device as claimed in claim 1 , wherein two of the structures are different in width. 5. The electronic device as claimed in claim 1 , further comprises a shielding layer disposed on the circuit layer. 6. The electronic device as claimed in claim 5 , wherein the shielding layer overlaps the circuit layer but does not overlap the diodes. 7. The electronic device as claimed in claim 1 , wherein the substrate has a first surface and a second surface opposite to the first surface, and the circuit layer is disposed on the first surface and the second surface.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • Active-matrix LED displays · CPC title

  • Package substrates, e.g. submounts · CPC title

  • Interconnections (of active-matrix LED displays H10H29/49) · CPC title

  • H05K1/028Primary

    Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11810485B2 cover?
An electronic device is disclosed and includes a substrate, a circuit layer, and a plurality of diodes. The substrate has a plurality of structures. The circuit layer is disposed on the substrate. The diodes are disposed on the circuit layer, wherein a first spacing is defined as a distance between a center point of a first one of the structures and a center point of a second one of the structu…
Who is the assignee on this patent?
Innolux Corp
What technology area does this patent fall under?
Primary CPC classification H05K1/028. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).