Pluggable photonic transceiver and cooling modules including external heat sink assemblies and corresponding network system

US11809003B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11809003-B2
Application numberUS-202217706492-A
CountryUS
Kind codeB2
Filing dateMar 28, 2022
Priority dateSep 20, 2019
Publication dateNov 7, 2023
Grant dateNov 7, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming an elongated void from the backend position to one backend of the at least one fin. Additionally, the apparatus includes a cover member disposed over the multiple fins with a horizontal sheet, two vertical side sheets, and a flange bent vertically from a middle portion of backend of the horizontal sheet. Furthermore, the apparatus includes a spring loaded in the elongated void between the flange and the one backend of the at least one fin to minimize an air gap at the backend of the horizontal sheet.

First claim

Opening claim text (preview).

What is claimed is: 1. A pluggable photonic transceiver and cooling module comprising: a first end configured to connect to a network system, at least a portion of the first end configured to connect to the network system by pluggable insertion into a frame of the network system; a second end opposite the first end, the second end configured to be located external to the frame of the network system when the first end is inserted into the frame of the network system; and a heat sink assembly formed on the pluggable photonic transceiver and cooling module between the first end and the second end, the heat sink assembly being configured to dissipate heat away from the pluggable photonic transceiver and cooling module while the pluggable photonic transceiver and cooling module is receiving and transmitting data over an optical interface formed in the pluggable photonic transceiver and cooling module, the heat sink assembly being external to and abutting the frame when the first end of the pluggable photonic transceiver and cooling module is inserted into the frame. 2. The pluggable photonic transceiver and cooling module of claim 1 , wherein the heat sink assembly is formed on a top plate of the pluggable photonic transceiver and cooling module. 3. The pluggable photonic transceiver and cooling module of claim 2 , further comprising: a plurality of cooling fins disposed on the top plate and extending in a direction from the second end toward the first end and the frame of the network system; and a plurality of channels defined between adjacent ones of the plurality of cooling fins, the plurality of channels configured to facilitate a flow of air from the second end toward the first end and into the network system to cool the pluggable photonic transceiver and cooling module. 4. The pluggable photonic transceiver and cooling module of claim 3 , further comprising: a cover member configured to overlay the top plate and defining a volume containing the plurality of cooling fins and the plurality of channels, the cover member further configured i) to abut the frame of the network system at a back end of the cover member and ii) to facilitate, at a front end of the cover member, flow of air into the volume and between the plurality of channels, and a biasing member configured to bias the back end of the cover member against the frame of the network system. 5. The pluggable photonic transceiver and cooling module of claim 1 , wherein the heat sink assembly defines a volume above a top plate of the pluggable photonic transceiver and cooling module. 6. The pluggable photonic transceiver and cooling module of claim 5 , wherein: the heat sink assembly comprises a cover member spaced apart from the top plate; and the volume is defined by the cover member and the top plate. 7. The pluggable photonic transceiver and cooling module of claim 6 , wherein the cover member is configured to facilitate a flow of air through the volume from a front end toward a back end and into the network system to cool the pluggable photonic transceiver and cooling module. 8. The pluggable photonic transceiver and cooling module of claim 7 , wherein the heat sink assembly further comprises: a plurality of cooling fins disposed on the top plate within the volume and extending in a direction from the front end toward the back end; and a plurality of channels defined between adjacent ones of the plurality of cooling fins and configured to facilitate the flow of air from the front end toward the back end. 9. The pluggable photonic transceiver and cooling module of claim 8 , wherein the cover member is further configured to i) abut the frame of the network system at the back end and ii) facilitate, at the front end, the flow of air into the volume and between the plurality of channels. 10. The pluggable photonic transceiver and cooling module of claim 9 , wherein the heat sink assembly further comprises a biasing member configured to bias the cover member against the frame of the network system. 11. The pluggable photonic transceiver and cooling module of claim 10 , wherein the biasing member comprises a spring. 12. The pluggable photonic transceiver and cooling module of claim 11 , wherein the spring is disposed between i) an end of at least one of the plurality of cooling fins and ii) the cover member. 13. The pluggable photonic transceiver and cooling module of claim 12 , wherein: the cover member comprises a flange extending toward the top plate; and the spring is disposed between i) the end of the at least one of the plurality of cooling fins and ii) the flange. 14. The pluggable photonic transceiver and cooling module of claim 12 , wherein the at least one of the plurality of cooling fins is shorter than other ones of the plurality of cooling fins such that the spring extends from the at least one of the plurality of cooling fins and between the other ones of the plurality of cooling fins. 15. The pluggable photonic transceiver and cooling module of claim 12 , wherein the cover member comprises: a first side; a second side; a third side, the second side and the third side extending perpendicular to the first side; and a flange extending from the first side of the cover member toward the top plate and contacting an end of the spring. 16. The pluggable photonic transceiver and cooling module of claim 1 , wherein a back end of the heat sink assembly is external to and abuts the frame when the pluggable photonic transceiver and cooling module is at least one fully plugged into the frame and fully inserted into the frame. 17. A network system, comprising: a frame configured to house at least a portion of the network system; and a plurality of pluggable photonic transceiver and cooling modules, at least one of the plurality of pluggable photonic transceiver and cooling modules being configured to (i) convert a received optical signal to an electrical signal for transmission to the network system, (ii) convert an electrical signal to an optical signal for transmission from the network system, and (iii) dissipate, away from the at least one of the pluggable photonic transceiver and cooling modules, heat generated by a portion of the network system housed in the frame, each of the at least one of the plurality of pluggable photonic transceiver and cooling modules having a top plate, a first end configured to be inserted through the frame for interfacing with the network system, a second end opposite the first end, the second end configured to be located external to the frame of the network system when the first end is inserted through the frame, and a heat sink assembly formed on the top plate between the first end and the second end and external to and abutting the frame when the first end is inserted in the frame. 18. The network system of claim 17 , wherein the heat sink assembly is configured to dissipate heat away from the at least one of the plurality of pluggable photonic transceiver and cooling modules by directing a flow of air through the heat sink assembly and into the network system. 19. The network system of claim 18 , wherein the frame comprises a plurality of through-holes aligned with the heat sink assembly such that the flow of air passes through the heat sink assembly and into the network system through the plurality of through-holes. 20. The network system of claim 19 , the heat sink assembly comprising: a cover member spaced apart from the top plate, a volume being defined between the cover member and the top plate;

Assignees

Inventors

Classifications

  • G02B6/4269Primary

    with heat sinks or radiation fins · CPC title

  • and extending longitudinally (F28F1/38 takes precedence) · CPC title

  • Pressing means used to urge contact, e.g. springs · CPC title

  • with openings, e.g. louvers · CPC title

  • by using form fitting connection, e.g. with tongue and groove · CPC title

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What does patent US11809003B2 cover?
An apparatus for dissipating heat from a photonic transceiver module. The apparatus includes a top-plate member disposed in a length direction of a package for the photonic transceiver module. The apparatus further includes multiple fins formed on the top-plate member along the length direction from a backend position to a frontend position except at least one fin with a shorter length, forming…
Who is the assignee on this patent?
Marvell Asia Pte Ltd
What technology area does this patent fall under?
Primary CPC classification G02B6/4269. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Nov 07 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).