Mems devices and processes
US-2019047847-A1 · Feb 14, 2019 · US
US11808654B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11808654-B2 |
| Application number | US-201917279263-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 17, 2019 |
| Priority date | Sep 26, 2018 |
| Publication date | Nov 7, 2023 |
| Grant date | Nov 7, 2023 |
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An integrated optical transducer for detecting dynamic pressure changes comprises a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side, and an application-specific integrated circuit, ASIC, die having an optical interferometer assembly. The interferometer assembly comprises a beam splitting element for receiving a source beam from a light source and for splitting the source beam into a probe beam in a first beam path and a reference beam in a second beam path, a beam combining element for combining the probe beam with the reference beam to a superposition beam, and a detector configured to generate an electronic interference signal depending on the superposition beam. The MEMS die is arranged with respect to the ASIC die such that a gap is formed between the second side of the diaphragm and the ASIC die, with the gap defining a cavity and having a gap height. The first beam path of the probe beam comprises coupling into the cavity, reflection off of a deflection point or a deflection surface ( 16 ) of the diaphragm and coupling out of the cavity.
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The invention claimed is: 1. An integrated optical transducer for detecting dynamic pressure changes, the transducer comprising: a micro-electro-mechanical system, MEMS, die having a MEMS diaphragm with a first side exposed to the dynamic pressure changes and a second side; and an application-specific integrated circuit, ASIC, die having an optical interferometer assembly comprising: a beam splitting element for receiving a source beam from a light source and for splitting the source beam into a probe beam in a first beam path and a reference beam in a second beam path; a beam combining element for combining the probe beam with the reference beam to a superposition beam; and a detector configured to receive the superposition beam and to generate an electronic interference signal depending on the superposition beam; wherein the MEMS die is arranged with respect to the ASIC die such that a gap is formed between the second side of the diaphragm and the ASIC die, with the gap defining a cavity and having a gap height; and the first beam path of the probe beam comprises coupling into the cavity, reflection off of a deflection point or a deflection surface of the diaphragm and coupling out of the cavity. 2. The integrated optical transducer according to claim 1 , wherein the ASIC die further comprises the light source for emitting the source beam. 3. The integrated optical transducer according to claim 1 , wherein the first beam path deviates from the second beam path in terms of effective length by less than a coherence length of the light source. 4. The integrated optical transducer according to claim 1 , wherein the gap height is equal to or larger than 100 μm, in particular equal to or larger than 200 μm. 5. The integrated optical transducer according to claim 1 , wherein the optical interferometer assembly further comprises a waveguide structure for guiding the probe beam, the reference beam and the superposition beam; and at least one coupling element, such as a grating coupling element, for coupling light from the waveguide structure into the cavity and/or for coupling light from the cavity into the waveguide structure. 6. The integrated optical transducer according to claim 5 , wherein the beam splitting element and/or the beam combining element are integrated in the waveguide structure. 7. The integrated optical transducer according to claim 5 , wherein the optical interferometer assembly further comprises in the first beam path a lens element, in particular a multi-focal Fresnel lens element or an axicon lens element, wherein the lens element is configured to receive the probe beam from the beam splitting element; create a modified probe beam with a modified spatial intensity profile; and couple the modified probe beam into the cavity such that the probe beam is reflected off of multiple deflection points or one or more deflection surfaces of the diaphragm. 8. The integrated optical transducer according to claim 7 , wherein the coupling element is shaped according to the modified spatial intensity profile and is configured to couple the probe beam from the cavity into the waveguide structure. 9. The integrated optical transducer according to claim 7 , wherein the lens element is a multi-focal Fresnel lens element or an axicon lens element. 10. The integrated optical transducer according to claim 1 , wherein the optical interferometer assembly further comprises a phase adjusting element in the first beam path and/or in the second beam path. 11. The integrated optical transducer according to claim 1 , wherein the second beam path comprises coupling into the cavity, reflection off of a stationary point or a stationary surface of the MEMS die and coupling out of the cavity. 12. The integrated optical transducer according to claim 1 , wherein the optical interferometer assembly further comprises a further beam splitting element and a further beam combining element, wherein the further beam splitting element is configured to generate a further probe beam in a third beam path and a further reference beam in a fourth beam path; and the further beam combining element is configured to combine the further reference beam with the further probe beam to a further superposition beam. 13. The integrated optical transducer according to claim 12 , wherein the third beam path comprises coupling into the cavity, reflection off of a further deflection point or a further deflection surface of the diaphragm and coupling out of the cavity. 14. The integrated optical transducer according to claim 12 , wherein the fourth beam path comprises coupling into the cavity, reflection off of a further stationary point or a further stationary surface of the MEMS die and coupling out of the cavity. 15. An electronic device, such as an audio device or a communication device, comprising an integrated optical transducer according to claim 1 , wherein the transducer is configured to omnidirectionally detect dynamic pressure changes in an environment of the transducer, in particular dynamic pressure changes at rates corresponding to audio frequencies. 16. The electronic device according to claim 15 , wherein the transducer is configured to omnidirectionally detect dynamic pressure changes at rates corresponding to audio frequencies. 17. A method for detecting dynamic pressure changes using an integrated optical transducer according to claim 1 , the method comprising providing the MEMS diaphragm with the first side exposed to the dynamic pressure changes and the second side; splitting the source beam into the probe beam in the first beam path and the reference beam in the second beam path; reflecting the probe beam off of the deflection point or the deflection surface of the MEMS diaphragm; combining the probe beam and the reference beam into the superposition beam; and generating the electronic interference signal depending on the superposition beam. 18. The integrated optical transducer according to claim 1 , wherein the gap height is equal to or larger than 200 μm.
of a diaphragm · CPC title
containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title
operating by reflection only · CPC title
using optical signals for detecting or generating sound · CPC title
Pressure sensors · CPC title
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