Electromagnetic wave absorber and electromagnetic wave absorber-attached molded article

Patent metadata

Field	Value
Publication number	US-11806980-B2
Application number	US-201816621066-A
Country	US
Kind code	B2
Filing date	Mar 27, 2018
Priority date	Jun 13, 2017
Publication date	Nov 7, 2023
Grant date	Nov 7, 2023

Abstract

An electromagnetic wave absorber (1) includes a dielectric layer (10), a resistive layer (20), and an electrically conductive layer (30). The resistive layer (20) is disposed on one principal surface of the dielectric layer (10). The electrically conductive layer (30) is disposed on the other principal surface of the dielectric layer (10) and has a sheet resistance lower than a sheet resistance of the resistive layer (20). The resistive layer (20) has a sheet resistance of 200 to 600Ω/□. When the resistive layer (20) is subjected to an immersion treatment in which the resistive layer (20) is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer (20) before the immersion treatment and a sheet resistance of the resistive layer (20) after the immersion treatment is less than 100Ω/□.

First claim

The invention claimed is:

1. An electromagnetic wave absorber, comprising:
a dielectric layer;
a resistive layer that is disposed on one principal surface of the dielectric layer; and
an electrically conductive layer that is disposed on the other principal surface of the dielectric layer and has a sheet resistance lower than a sheet resistance of the resistive layer, wherein
the resistive layer has a sheet resistance of 200 to 600 Ω/□,
when the resistive layer is subjected to an immersion treatment in which the resistive layer is immersed in a 5 weight % aqueous solution of NaOH for 5 minutes, an absolute value of a difference between a sheet resistance of the resistive layer before the immersion treatment and a sheet resistance of the resistive layer after the immersion treatment is less than 100 Ω/□,
the resistive layer comprises indium tin oxide, and
the indium tin oxide has an amorphous structure that includes 25 weight % or more of tin oxide.

2. The electromagnetic wave absorber according to claim 1 , wherein the resistive layer has a specific resistance of 5×10 −4 Ω·cm or more.

3. The electromagnetic wave absorber according to claim 1 , wherein the resistive layer has a thickness of 15 to 500 nm.

4. The electromagnetic wave absorber according to claim 1 , wherein the resistive layer is laminated on a polymer film at an opposite surface to a surface at which the resistive layer is in contact with the dielectric layer.

5. The electromagnetic wave absorber according to claim 1 , wherein the dielectric layer has a relative permittivity of 1 to 10.

6. The electromagnetic wave absorber according to claim 1 , wherein the dielectric layer is made of a polymeric material.

7. The electromagnetic wave absorber according to claim 1 , wherein the electrically conductive layer has a sheet resistance of 0.001 to 30 Ω/□.

8. The electromagnetic wave absorber according to claim 1 , wherein the electrically conductive layer is made of at least one of aluminum, an aluminum alloy, aluminum nitride, copper, a copper alloy, copper nitride, and indium tin oxide.

Assignees

• Nitto Denko Corp

Inventors

• Yamagata Kazuto
• Machinaga Hironobu
• Ueda Eri
• Ukei Hiroichi
• Ui Takehiro

Classifications

• B32B7/025 Primary

  Electric or magnetic properties · CPC title

• B32B15/082

  comprising vinyl resins; comprising acrylic resins · CPC title

• B32B27/308

  comprising acrylic (co)polymers · CPC title

• B32B27/36

  comprising polyesters · CPC title

• C23C14/086

  of zinc, germanium, cadmium, indium, tin, thallium or bismuth · CPC title