Light emitting diode cooling with turbulent flow

US11804587B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11804587-B2
Application numberUS-202217704818-A
CountryUS
Kind codeB2
Filing dateMar 25, 2022
Priority dateApr 22, 2021
Publication dateOct 31, 2023
Grant dateOct 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cooling system for a light emitting diode (“LED”) assembly includes a fluid configured to absorb heat at the LED assembly, a heat exchanger coupled to one or more substrates of the LED assembly, where the heat exchanger is configured to exchange heat between the LED assembly and the fluid, and a pump configured to circulate the fluid along the LED assembly and the heat exchanger, where the fluid exhibits a turbulent flow at the LED assembly, the heat exchanger, or both, while circulated by the pump.

First claim

Opening claim text (preview).

The invention claimed is: 1. A cooling system for a light emitting diode (“LED”) assembly, comprising: a fluid configured to absorb heat at the LED assembly; a heat exchanger coupled to one or more substrates of the LED assembly, wherein the heat exchanger is configured to exchange heat between the LED assembly and the fluid; and a pump configured to circulate the fluid along an inner annular passage through the heat exchanger generally toward an end passage formed between the LED assembly and an enclosure, through the end passage, into an outer annular passage formed between the LED assembly and the enclosure, and along the outer annular passage generally away from the end passage, wherein the fluid exhibits a turbulent flow at the LED assembly, the heat exchanger, or both, while circulated by the pump. 2. The cooling system of claim 1 , comprising the LED assembly, wherein the LED assembly comprises at least one LED array configured to operate above a predetermined power density, wherein the predetermined power density is equal to or greater than 200 watts per square inch, and wherein the LED assembly has a surface area equal to or greater than 80 square inches. 3. The cooling system of claim 1 , wherein the fluid exhibits the turbulent flow with a Reynold's number greater than 2,000. 4. The cooling system of claim 1 , wherein the heat exchanger comprises: a base configured to couple to the LED assembly; and a plurality of baffles extending from the base, wherein the plurality of baffles are configured to generate the turbulent flow of the fluid. 5. The cooling system of claim 1 , comprising the LED assembly, wherein the LED assembly comprises a plurality of LED arrays, and each LED array of the plurality of LED arrays comprises: a substrate; and a plurality of LEDs coupled to the substrate. 6. The cooling system of claim 5 , wherein the heat exchanger comprises: a plurality of outer portions coupled to the plurality of LED arrays, wherein each outer portion of the plurality of outer portions is coupled to the substrate of a respective LED array of the plurality of LED arrays; an inner portion disposed in the plurality of outer portions; and a plurality of baffles extending from the plurality of outer portions and the inner portion, where the plurality of baffles are configured to generate the turbulent flow of the fluid. 7. The cooling system of claim 5 , wherein the heat exchanger comprises a plurality of fins extending from the substrate of each LED array of the plurality of LED arrays, and wherein the plurality of fins are configured to generate the turbulent flow of the fluid. 8. The cooling system of claim 7 , wherein the plurality of fins extend perpendicular to the substrate of each LED array of the plurality of LED arrays. 9. The cooling system of claim 7 , wherein the plurality of fins extend at an oblique angle relative to the substrate of each LED array of the plurality of LED arrays. 10. A light emitting diode (LED) device, comprising: an LED assembly; an inner annular passage formed within the LED assembly; an enclosure configured to house the LED assembly; an end passage formed between the LED assembly and the enclosure, wherein the end passage is fluidly coupled to the inner annular passage; and an outer annular passage formed between the LED assembly and the enclosure, wherein the outer annular passage is configured to enable circulation of a fluid along the LED assembly and through a heat exchanger to absorb heat from the LED assembly, wherein the LED assembly is configured to be immersively disposed within the fluid, wherein the LED assembly is configured to emit light through the fluid and through the enclosure, wherein the fluid exhibits a turbulent flow while circulating through the LED assembly, and wherein the fluid is configured to circulate along the inner annular passage through the heat exchanger generally toward the end passage, through the end passage, into the outer annular passage, and along the outer annular passage generally away from the end passage. 11. The LED device of claim 10 , wherein the LED assembly is configured to be immersively disposed within the fluid at the inner annular passage, the end passage, and the outer annular passage, and wherein the outer annular passage is fluidly coupled to the inner annular passage. 12. The LED device of claim 10 , wherein the fluid exhibits the turbulent flow with a Reynold's number greater than 2,000 while circulating through the inner annular passage. 13. The LED device of claim 10 , wherein the fluid exhibits a laminar flow with a Reynold's number less than 2,000 while circulating through the outer annular passage. 14. The LED device of claim 10 , wherein one or more LEDs of the LED assembly are configured to operate at 2 watts each for a duration greater than 1 minute. 15. The LED device of claim 10 , wherein a range of a diameter of the LED assembly is 1 inch to 3 inches. 16. A light emitting diode (“LED”) assembly, comprising: a plurality of LED arrays, wherein each LED array of the plurality of LED arrays comprises: a substrate; and a plurality of LEDs coupled to the substrate; and a heat exchanger coupled to the substrate of each LED array of the plurality of LED arrays, wherein the heat exchanger is configured to exchange heat between the plurality of LED arrays and a fluid, wherein the fluid exhibits a turbulent flow at the heat exchanger, and wherein the fluid is configured to circulate along an inner annular passage formed within the LED assembly through the heat exchanger generally toward an end passage formed between the LED assembly and an enclosure, through the end passage, into an outer annular passage formed between the LED assembly and the enclosure, and along the outer annular passage generally away from the end passage. 17. The LED assembly of claim 16 , wherein the heat exchanger comprises: a plurality of bases, wherein each base of the plurality of bases is coupled to the substrate of a respective LED array of the plurality of LED arrays; and a plurality of baffles extending from the plurality of bases, wherein the plurality of baffles are configured to generate the turbulent flow of the fluid. 18. The LED assembly of claim 16 , wherein the heat exchanger comprises a plurality of fins extending from the substrate of each LED array of the plurality of LED arrays, and wherein the plurality of fins are configured to generate the turbulent flow of the fluid. 19. The LED assembly of claim 16 , wherein the fluid exhibits the turbulent flow with a Reynold's number greater than 2,000 at the heat exchanger. 20. The LED assembly of claim 16 , wherein the fluid exhibits a laminar flow with a Reynold's number less than 2,000 while circulating across the plurality of LEDs of the plurality of LED arrays.

Assignees

Inventors

Classifications

  • comprising fluids, e.g. heat-pipes · CPC title

  • comprising fluids, e.g. heat-pipes · CPC title

  • H01L33/648Primary

    Electricity · mapped topic

  • F21V29/503Primary

    of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) · CPC title

  • with forced flow of the coolant · CPC title

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What does patent US11804587B2 cover?
A cooling system for a light emitting diode (“LED”) assembly includes a fluid configured to absorb heat at the LED assembly, a heat exchanger coupled to one or more substrates of the LED assembly, where the heat exchanger is configured to exchange heat between the LED assembly and the fluid, and a pump configured to circulate the fluid along the LED assembly and the heat exchanger, where the fl…
Who is the assignee on this patent?
Nbcuniversal Media Llc
What technology area does this patent fall under?
Primary CPC classification H10H29/8586. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).