Methods and systems for improving transfer efficiency of an automated material handling system

US11804394B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11804394-B2
Application numberUS-202117460390-A
CountryUS
Kind codeB2
Filing dateAug 30, 2021
Priority dateAug 30, 2021
Publication dateOct 31, 2023
Grant dateOct 31, 2023

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port while a second work-in-progress is transferred to the load port from an AMHS vehicle along a second direction that is perpendicular to the first direction, and transferring the first work-in-progress to an AMHS vehicle along the second direction. The methods and systems may be used for loading and unloading wafer storage containers, such as front opening unified pods (FOUPs), in a semiconductor fabrication facility.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of processing semiconductor wafers, comprising: removing a first wafer storage container from a load port using a positioning apparatus operatively coupled to the load port, the first wafer storage container containing semiconductor wafers processed by a wafer processing apparatus associated with the load port, and the positioning apparatus comprises a support element configured to engage a wafer storage container and support the wafer storage container above a surface of the load port; moving the first wafer storage container, using the positioning apparatus, along a first direction with respect to the load port to displace the first wafer storage container from the load port and to enable a second wafer storage container containing semiconductor wafers for processing by the wafer processing apparatus to be transferred from a vehicle of an automated material handling system onto the load port along a second direction that is perpendicular to the first direction; transferring the first wafer storage container from the positioning apparatus to a vehicle of the automated material handling system along the second direction; after the first wafer storage container is transferred to the vehicle of the automated material handling system, moving the support element of the positioning apparatus to engage with the second wafer storage container located on the load port, wherein the support element of the positioning apparatus comprises a pair of retractable hooks, and the pair of retractable hooks retract as the pair of retractable hooks are translated along the second direction adjacent to a pair of handles of the second wafer storage container located on the load port; and removing the second wafer storage container from the load port using the positioning apparatus when the semiconductor wafers of the second wafer storage container have been processed by the wafer processing apparatus. 2. The method of claim 1 , wherein the vehicle of the automated material handling system that transfers the second wafer storage container to the load port is the same vehicle to which the first wafer storage container is transferred from the positioning apparatus. 3. The method of claim 1 , wherein the first direction is a vertical direction and the second direction is a horizontal direction. 4. The method of claim 3 , wherein the first wafer storage container is lifted from a surface of the load port by the positioning apparatus to remove the first wafer storage container from the load port. 5. The method of claim 3 , further comprising moving the first wafer storage container using the positioning apparatus to position the first wafer storage container over an upper surface of the second wafer storage container on the load port prior to transferring the first wafer storage container to the vehicle of the automated material handling system. 6. The method of claim 1 , wherein the pair of retractable hooks extend after the retractable hooks are translated beyond the pair of handles of the second wafer storage container such that upper surfaces of each of the retractable hooks are located directly beneath a respective handle of the second wafer storage container. 7. A positioning apparatus operatively coupled to a load port that is configured to receive a wafer storage container containing semiconductor wafers for processing by a wafer processing apparatus, the positioning apparatus comprising: at least one vertical support member; a support element coupled to the at least one vertical support member and configured to support the wafer storage container above a surface of the load port; a vertical translation mechanism coupled to the support element that is configured to translate the support element in a vertical direction with respect to the load port; and a horizontal positioning mechanism coupled to the support element that is configured to move the support element in a horizontal direction with respect to the load port, wherein; the at least one vertical support member comprises a pair of support rods and the support element comprises a pair of hooks configured to lift the wafer storage container from the load port, and each hook is coupled to a respective support rod of the pair of support rods, the pair of support rods and the pair of hooks are pivotable with respect to the load port, and the horizontal positioning mechanism moves the pair of hooks in a horizontal direction by pivoting the support rods and the pair of hooks with respect to the load port, the pair of hooks are configured to lift the wafer storage container by engaging a pair of handles of the wafer storage container as the pair of hooks are translated in a vertically upward direction by the vertical translation mechanism, and each hook of the pair of hooks is a retractable hook that retracts as the pair of hooks are translated vertically downward below a height of the pair of handles of the wafer storage container located on the load port. 8. The positioning apparatus of claim 7 , wherein the wafer storage container is a front opening unified pod (FOUP). 9. The positioning apparatus of claim 7 , wherein each hook of the pair of hooks is coupled to a respective support rod by a pivot joint that enables the hook to pivot between an extended position and a retracted position. 10. The positioning apparatus of claim 9 , wherein each of the hooks is biased into the extended position by a spring mechanism. 11. The positioning apparatus of claim 10 , wherein as the pair of hooks are translated vertically downward a force exerted on the retractable hooks by the handles of the wafer storage container located on the load port is sufficient to cause the retractable hooks to pivot to the retracted position. 12. The positioning apparatus of claim 11 , wherein the bias force of the spring mechanism causes the retractable hooks to return to the extended position once the hooks are lowered beneath the handles of the wafer storage container such that upper surfaces of each of the retractable hooks are located directly beneath a respective handle of the wafer storage container. 13. The positioning apparatus of claim 9 , further comprising a motorized system configured to pivot each of the hooks between the extended position and the retracted position. 14. A positioning apparatus operatively coupled to a load port that is configured to receive a wafer storage container containing semiconductor wafers for processing by a wafer processing apparatus, the positioning apparatus comprising: at least one vertical support member; a support element coupled to the at least one vertical support member and configured to support the wafer storage container above a surface of the load port; a vertical translation mechanism coupled to the support element that is configured to translate the support element in a vertical direction with respect to the load port; and a horizontal positioning mechanism coupled to the support element that is configured to move the support element in a horizontal direction with respect to the load port, wherein the support element comprises a support tray and the horizontal positioning mechanism moves the support tray in a horizontal direction relative to the at least one vertical support member, the support tray includes a flat portion that supports the wafer storage container and an open region interior of the flat portion that enables the support tray to lower the wafer storage container onto an upper surface of the load port, and the flat portion of the support tray is moveable in a horizontal direction between the upper surface of the load port and a lower su

Assignees

Inventors

Classifications

  • Loading to or unloading from a conveyor · CPC title

  • Storage means · CPC title

  • Overhead conveying · CPC title

  • the substrate being handled substantially vertically · CPC title

  • Vertical transfer of a single workpiece · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US11804394B2 cover?
Methods and systems for improving the efficiency of an automated material handling system (AMHS) include providing an apparatus operatively coupled to a load port of a processing apparatus, where the apparatus is configured to remove a first work-in-process from the load port and to move the first work-in-process along a first direction to displace the first work-in-progress from the load port …
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10P72/3221. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Oct 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).