Coil component and method of manufacturing the same

Patent metadata

Field	Value
Publication number	US-11804327-B2
Application number	US-202117552855-A
Country	US
Kind code	B2
Filing date	Dec 16, 2021
Priority date	Jul 26, 2016
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

A coil component includes: a body including a magnetic material and a coil of which both ends are externally exposed; intermetallic compounds disposed on the exposed both ends of the coil; and external electrodes disposed on the body to cover the intermetallic compounds. The external electrodes include: conductive resin layers disposed on outer surfaces of the body to contact the exposed both ends of the coil and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding the plurality of metal particles and contacting the intermetallic compounds. The coil component further includes electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts.

First claim

What is claimed is:

1. A coil component comprising:
a body including a coil, of which both ends are externally exposed;
intermetallic compounds disposed on the exposed both ends of the coil; and
external electrodes disposed on the body to cover the intermetallic compounds,
wherein the external electrodes include:
conductive resin layers disposed on outer surfaces of the body, and including base resins, a plurality of metal particles disposed in the base resins, and conductive connecting parts surrounding at least a portion of the plurality of metal particles and contacting the intermetallic compounds; and
electrode layers disposed on the conductive resin layers and contacting the conductive connecting parts,

wherein the intermetallic compounds have smaller lengths than those of the exposed both ends of the coil in the thickness direction of the coil.

2. The coil component of claim 1 , wherein one of the conductive connecting parts contacting one of the intermetallic compounds continuously extends to contact one of the electrode layer.

3. The coil component of claim 1 , wherein the conductive connecting parts and the intermetallic compounds include a common metal.

4. The coil component of claim 1 , wherein the intermetallic compounds have a form of a plurality of islands.

5. The coil component of claim 4 , wherein the plurality of islands have a layer form.

6. The coil component of claim 1 , wherein the conductive connecting parts have a melting point lower than a hardening temperature of the base resins.

7. The coil component of claim 1 , wherein a melting point of the conductive connecting parts is 300° C. or less.

8. The coil component of claim 1 , wherein the intermetallic compounds are formed of one of copper-tin, silver-tin, and nickel-tin, and
the metal particles of the conductive resin layers are formed of at least one selected from the group consisting of copper, nickel, silver, copper coated with silver, and copper coated with tin.

9. The coil component of claim 8 , wherein the conductive connecting parts of the conductive resin layers include Ag 3 Sn.

10. The coil component of claim 1 , wherein the metal particles of the conductive resin layers are metal particles having spherical shapes, metal particles having flake shapes, or mixtures of metal particles having spherical shapes and metal particles having flake shapes.

11. The coil component of claim 1 , wherein a content of one of copper-tin, silver-tin, and nickel-tin included in the intermetallic compounds is 30 to 70 volume %.

12. The coil component of claim 1 , wherein the body includes first and second surfaces opposing each other, third and fourth surfaces opposing each other and connecting front ends of the first and second surfaces to each other, and fifth and sixth surfaces opposing each other, and connecting front ends of the first and second surfaces to each other and connecting front ends of the third and fourth surfaces to each other,
the both ends of the coil are exposed through the third and fourth surfaces of the body, respectively, and
the conductive resin layers are formed on the third and fourth surfaces of the body, respectively.

13. The coil component of claim 12 , wherein the external electrodes include connection parts formed on the third and fourth surfaces of the body and band parts extended from the connection parts to portions of the first and second surfaces of the body, respectively.

14. The coil component of claim 13 , wherein, in the conductive resin layer, when a thickness of a central portion of the connection part is t1, a thickness of a corner portion is t2, and a thickness of a central portion of the band part is t3, t2/t1≥0.05 and t3/t1≤0.5.

15. The coil component of claim 1 , wherein the coil is formed of copper, and the intermetallic compounds are formed of copper-tin.

16. The coil component of claim 1 , wherein the intermetallic compounds include 10 volume % or less of metal particles and 10 volume % or less of bismuth.

17. The coil component of claim 1 , wherein a content of tin-bismuth (Sn—Bi) in all the metal in the conductive resin layers is 20 to 80 wt %.

18. The coil component of claim 1 , wherein intermetallic compounds formed on one of the both ends of the coil have an area equal to or greater than 30% of a total contact area between the one end and one of the conductive resin layers contacting the one end.

19. The coil component of claim 1 , wherein a thickness of the intermetallic compound is 2.0 to 5.0 μm.

20. The coil component of claim 1 , wherein each intermetallic compound is formed of double layers, a layer positioned adjacent to one of the both ends is formed of Cu 3 Sn, and a layer positioned adjacent to the one of the electrode layers is formed of Cu 6 Sn 5 .

Assignees

• Samsung Electro Mech

Inventors

• Lee Yoon Hee
• Koo Bon Seok
• Kim Yeon Tae
• Choi Chang Hak
• Kim Jung Min

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F17/0013 Primary

  with stacked layers · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F27/323

  Insulation between winding turns, between winding layers · CPC title

• H01F41/041

  Printed circuit coils (apparatus or processes for manufacturing printed circuits in general H05K3/00) · CPC title