High thermal conductivity heat shield

US11802603B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11802603-B2
Application numberUS-202016896859-A
CountryUS
Kind codeB2
Filing dateJun 9, 2020
Priority dateJun 9, 2020
Publication dateOct 31, 2023
Grant dateOct 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A heat shield for an aircraft wheel assembly is made of a heat shield material evenly distributed across the heat shield along both the circumferential and the axial directions. The heat shield material has a high thermal conductivity greater than 30 W/mK. In various embodiments, the thermal conductivity is greater than 85 W/mK. In this manner, thermal flux is maximized throughout the heat shield to distribute heat evenly across the heat shield in both circumferential and axial directions.

First claim

Opening claim text (preview).

What is claimed is: 1. A wheel assembly, comprising: a wheel having a rim and configured to rotate about an axis; a torque bar disposed radially inward of the rim; a heat shield disposed between the wheel and the torque bar, wherein the heat shield comprises a cylindrical structure extending circumferentially about an axis of the wheel and around an inner diameter of the rim; wherein the heat shield comprises a heat shield material, and a thermal conductivity of the heat shield material is greater than 85 W/mK; and wherein the cylindrical structure comprises: an outer layer; an inner layer; a middle layer between the outer layer and the inner layer and spaced apart from the outer layer by an air gap; a foil layer between the middle layer and the inner layer, the foil layer including dimples to maintain its position between the inner layer and the middle layer; and the inner layer defines an external inner diameter surface of the heat shield and the outer layer defines an external outer diameter surface of the heat shield. 2. The wheel assembly of claim 1 , wherein the thermal conductivity of the heat shield material is greater than 160 W/mK. 3. The wheel assembly of claim 1 , further comprising a heat shield retainer comprising a retainer material, wherein a thermal conductivity of the retainer material is greater than 85 W/mK. 4. The wheel assembly of claim 3 , wherein the heat shield comprises a first end and a second end spaced apart from the second end, wherein the first end of the heat shield includes a first hook member and the second end of the heat shield includes a second hook member, wherein the heat shield retainer includes a first clip member configured to engage the first hook member and a second clip member configured to engage the second hook member. 5. The wheel assembly of claim 1 , further comprising a chin ring comprising a chin ring material, wherein a thermal conductivity of the chin ring material is greater than 85 W/mK. 6. The wheel assembly of claim 1 , wherein the heat shield material is evenly distributed throughout the heat shield. 7. The wheel assembly of claim 1 , further comprising a brake stack disposed within the heat shield. 8. A heat shield for an aircraft wheel assembly, comprising an outer layer; an inner layer spaced apart from the outer layer; a middle layer disposed between the outer layer and the inner layer, the middle layer being spaced apart from the outer layer by an air gap, wherein the middle layer is made from at least one of an aluminum or an aluminum alloy; and a dimpled foil layer disposed between the middle layer and the inner layer, wherein the dimpled foil layer is configured to provide a radiant heat barrier between the inner layer and the middle layer; wherein at least one of the outer layer and the inner layer comprises a heat shield material evenly distributed across the heat shield, wherein a thermal conductivity of the heat shield material is greater than 30 W/mK. 9. The heat shield of claim 8 , wherein the thermal conductivity of the heat shield material is greater than 70 W/mK. 10. The heat shield of claim 9 , wherein the thermal conductivity of the heat shield material is greater than 85 W/mK. 11. The heat shield of claim 10 , wherein the thermal conductivity of the heat shield material is greater than 160 W/mK. 12. The heat shield of claim 8 , wherein the dimpled foil layer comprises a first plurality of dimples configured to contact the inner layer and a second plurality of dimples configured to contact the middle layer. 13. The heat shield of claim 8 , wherein the dimpled foil layer comprises a first material and the middle layer comprises a second material different from the first material.

Assignees

Inventors

Classifications

  • F16D65/847Primary

    with open cooling system, e.g. cooled by air · CPC title

  • Arrangements or adaptations of wheels, tyres or axles in general · CPC title

  • Arrangement or adaptation of brakes · CPC title

  • Actuating mechanisms · CPC title

  • Disc wheels, i.e. wheels with load-supporting disc body (non- metallic B60B5/00; wheel cover discs B60B7/00 {; disc wheels comprising rail-engaging elements B60B17/0006}) · CPC title

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What does patent US11802603B2 cover?
A heat shield for an aircraft wheel assembly is made of a heat shield material evenly distributed across the heat shield along both the circumferential and the axial directions. The heat shield material has a high thermal conductivity greater than 30 W/mK. In various embodiments, the thermal conductivity is greater than 85 W/mK. In this manner, thermal flux is maximized throughout the heat shie…
Who is the assignee on this patent?
Goodrich Corp
What technology area does this patent fall under?
Primary CPC classification F16D65/847. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Oct 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).