Method for manufacturing near-infrared sensor cover

Patent metadata

Field	Value
Publication number	US-11802332-B2
Application number	US-202217674033-A
Country	US
Kind code	B2
Filing date	Feb 17, 2022
Priority date	Mar 19, 2021
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

A method for manufacturing a near-infrared sensor cover includes arranging a mask in a region of an undercoating layer formed on a rear surface of a base, the region being different from a heater formation region in which a heater is to be formed and different from a belt-shaped separation region extending along an edge of the heater formation region, forming a heat-generating film on the mask and the undercoating layer, the heat-generating film being made of the conductive heat-generating material, peeling, using a laser, the heat-generating film formed in the separation region, and removing the mask and the heat-generating film formed on the mask. The separation region has a width that is set to be smaller than a beam diameter of each of near-infrared rays transmitted from the transmitting portion.

First claim

The invention claimed is:

1. A method for manufacturing a near-infrared sensor cover, wherein
the near-infrared sensor cover includes a cover body configured to cover a near-infrared ray transmitting portion and a near-infrared ray receiving portion, the cover body facing a transmission surface of the transmitting portion, the transmitting portion and the receiving portion being included in a near-infrared sensor,
the cover body includes:
a base made of a plastic material;
an undercoating layer formed on a first surface of the base facing the transmitting portion, the undercoating layer permitting passage of the near-infrared rays; and
a heater made of a conductive heat-generating material, the heater being formed on a part of a first surface of the undercoating layer facing the transmitting portion, the heater being in close contact with the base with the undercoating layer located between the heater and the base,

the method comprises:
arranging a mask in a region of the undercoating layer formed on the first surface of the base, the region being different from a heater formation region in which the heater is to be formed and different from a separation region extending along an edge of the heater formation region;
forming a heat-generating film on the mask and the undercoating layer, the heat-generating film being made of the conductive heat-generating material;
peeling, using a laser, the heat-generating film formed in the separation region; and
removing the mask and the heat-generating film formed on the mask,

the removing of the mask and the heat-generating film formed on the mask is performed subsequent to the peeling of the heat-generating film formed in the separation region, and
the separation region has a width that is set to be smaller than a beam diameter of each of the near-infrared rays transmitted from the transmitting portion.

2. The method for manufacturing the near-infrared sensor cover according to claim 1 , further comprising forming a protective layer performed subsequent to the removing the mask, the protective layer covering a first surface of the heater facing the transmitting portion and the first surface of the undercoating layer so as to protect and insulate the heater.

3. The method for manufacturing the near-infrared sensor cover according to claim 2 , further comprising forming an anti-reflective layer performed subsequent to the forming the protective layer,
wherein the forming the anti-reflective layer includes forming the anti-reflective layer on a first surface of the protective layer facing the transmitting portion, the anti-reflective layer limiting reflection of the near-infrared rays transmitted from the transmitting portion.

Assignees

• Toyoda Gosei Kk

Inventors

• Hirano Risa
• Okumura Koji
• Fukagawa Koji
• Hirano Katsuyuki

Classifications

• C23C14/042 Primary

  using masks · CPC title

• C23C14/34

  Sputtering · CPC title

• G01J5/048

  Protective parts · CPC title

• G01J5/041 Primary

  Mountings in enclosures or in a particular environment · CPC title

• G01S7/4813

  Housing arrangements · CPC title