Laser pulse shaping for additive manufacturing

US11801635B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11801635-B2
Application numberUS-202217984786-A
CountryUS
Kind codeB2
Filing dateNov 10, 2022
Priority dateOct 14, 2015
Publication dateOct 31, 2023
Grant dateOct 31, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D optical pattern in which only select portions of the second beam components can irradiate the powder particles. The first beam component heats the powder particles close to a melting point, where the particles experience surface tension forces relative to the interface layer. While the particles are heated, the second beam component further heats the particles and also melts the interface layer before the surface tension forces can act on and distort the particles, enabling the particles and the interface layer are able to bond together.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using particles of powdered feedstock material deposited on an interface layer of a substrate, the apparatus comprising: a laser system configured to generate: a first beam component providing a first power flux level; a second beam component providing a second power flux level which is greater than said first power flux level; the first beam component being operable to heat the powdered feedstock material to a first level short of a melting point of the powdered feedstock material, at which point the particles of powdered feedstock material begin to experience surface tension forces relative to said interface layer of the substrate, wherein the interface layer forms only an upper surface portion of the substrate; and after the particles of powdered feedstock material are heated to the first level short of the melting point, the second beam component being operable to further heat the particles of powdered feedstock material to a second level to melt the particles of powdered feedstock material and also to melt the interface layer of the substrate before the surface tension forces can act on the particles of powdered feedstock material to distort the particles of powdered feedstock material, wherein the interface layer of the substrate comprises a layer having a thickness less than a full thickness of the substrate, such that a portion of the interface layer remains unmelted by the second beam component as the particles of powdered feedstock material and the interface layer are bonded together; and the laser further being configured such that the second beam component has a duration less than the first beam component by a factor of at least 1×10 −3 , and a power controlled to be sufficient only to melt the interface layer of the substrate. 2. The apparatus of claim 1 , wherein the first and second beam components comprise temporally varying laser beam pulses. 3. The apparatus of claim 1 , wherein the laser system includes a diode laser array for generating the first beam component. 4. The apparatus of claim 1 , wherein the laser system includes a pulsed solid state laser for generating the second beam component. 5. The apparatus of claim 1 , wherein: the laser system includes a laser diode array configured to generate the first beam component, wherein the first beam component forms a first laser pulse having a duration of milliseconds; and the laser system includes a pulsed laser configured to generate the second beam component, wherein the second beam component forms a second laser pulse. 6. The apparatus of claim 5 , wherein: the first beam component has a power level on an order of kilowatts; and the beam component has a power level on an order of milli-Joules to Joules of energy. 7. The apparatus of claim 1 , further comprising a mask disposed between the laser system and the powdered feedstock material for irradiating the feedstock material with a 2D optical pattern using the first and second beam components. 8. The apparatus of claim 7 , wherein the mask enables first portions of the first and second beam components to pass through the mask to irradiate the powdered feedstock material, and second portions of the first and second beam components are not allowed to pass through to the powdered feedstock material. 9. The apparatus of claim 8 , wherein the mask comprises a digitally controllable mask. 10. The apparatus of claim 7 , further comprising a computer for controlling the mask. 11. The apparatus of claim 10 , wherein the computer is configured to use 2D data files for controlling the mask to construct each layer of the product. 12. The apparatus of claim 8 , wherein the mask comprises a dynamically controllable, optically addressable light valve enabling selected portions of the first and second beam components to pass therethrough to reach the particles of powdered feedstock material, while preventing non-selected portions of the first and second beam components from reaching the particles of powdered feedstock material. 13. The apparatus of claim 10 , wherein the computer is configured to control the laser system such that the second beam component is applied after the first beam component has heated the particles of powdered feedstock material to the first level short of the melting point. 14. The apparatus of claim 7 , wherein the computer is configured to control the laser system such that the second beam component is applied while the first beam component is still being used to heat the particles of powdered feedstock material to the first level short of the melting point. 15. The apparatus of claim 1 , further comprising a static mask interposed between the laser system and the powdered feedstock material, for patterning the first and second beam components on the powdered feedstock material. 16. An apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using particles of powdered feedstock material deposited on an interface layer of a substrate, the apparatus comprising: a laser system including a diode laser array and a solid state Q-switched laser, and being configured to generate: a first beam component, using the diode laser array, providing a first power flux level through a first laser pulse having a millisecond duration; a second beam component, using the solid state Q-switched laser, providing a second power flux level through a second laser pulse which has a second power flux level greater than said first power flux level, but which has a time duration on a nanosecond level and a resolution on a nanometer scale; the first beam component being operable to heat the particles of powdered feedstock material at least to a first level short of a melting point of the particles of powdered feedstock material, at which point the particles of powdered feedstock material begin to experience surface tension forces relative to said interface layer of the substrate, wherein the interface layer forms only an upper surface portion of the substrate; and while the particles of powdered feedstock material are heated at least to the first level short of the melting point, the second beam component being operable to further heat the particles of powdered feedstock material and melt both the particles of powdered feedstock material and the interface layer of the substrate before the surface tension forces can act on the particles of powdered feedstock material to distort the particles of powdered feedstock material, and such that the particles of powdered feedstock material and the interface layer are able to bond together, and while a portion of the interface layer is not melted by the second beam component. 17. The apparatus of claim 16 , wherein: the first power flux level of the first beam component is in kilowatts; and the second power flux level of the second beam component is in milli-Joules or Joules of energy. 18. The apparatus of claim 16 , wherein the laser system is configured such that at least one of the following conditions is applied: the second beam component is applied after the first beam component has heated the particles of powdered feedstock to the first level short of the melting point, and immediately after the first beam component has been removed; or the second beam component is applied a predetermined time interval after the first beam component has heated the particles of powdered feedstock material to the first level short

Assignees

Inventors

Classifications

  • B29C64/273Primary

    pulsed; frequency modulated · CPC title

  • Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM] · CPC title

  • Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices · CPC title

  • by using masks · CPC title

  • by shaping pulses · CPC title

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What does patent US11801635B2 cover?
The present disclosure relates to an apparatus for additively manufacturing a product in a layer-by-layer sequence, wherein the product is formed using powder particles deposited on an interface layer of a substrate. A laser generates first and second beam components. The second beam component has a higher power level and a shorter duration than the first beam component. A mask creates a 2D opt…
Who is the assignee on this patent?
L Livermore Nat Security Llc
What technology area does this patent fall under?
Primary CPC classification B29C64/273. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 31 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 10 related publications on this page (citations in our corpus or others sharing the same primary CPC).