Laser processing device for processing shielded conductors and method for operating a laser processing device for processing shielded conductors

Patent metadata

Field	Value
Publication number	US-11801571-B2
Application number	US-202016944187-A
Country	US
Kind code	B2
Filing date	Jul 31, 2020
Priority date	Aug 12, 2019
Publication date	Oct 31, 2023
Grant date	Oct 31, 2023

Abstract

A laser processing device for processing shielded conductors includes a processing chamber configured to process an end portion of a shielded conductor disposed therein using laser radiation. The processing chamber has a housing defining an opening. In a processing position of the laser processing device, the end portion of the shielded conductor is inserted along an insertion axis into the opening and extends into the processing chamber. A gripping device is configured to fix the shielded conductor in the opening in the processing position of the laser processing device. In the processing position of the laser processing device, the gripping device is positioned at the housing without contact therebetween. The gripping device includes a first projection portion which extends at least partially into the opening along the insertion axis in the processing position of the laser processing device.

First claim

What is claimed is:

1. A laser processing device for processing shielded conductors, the laser processing device comprising:
a processing chamber configured to process an end portion of a shielded conductor disposed therein using laser radiation, the processing chamber being surrounded by a housing defining an opening into the processing chamber, wherein, in a processing position of the laser processing device, the end portion of the shielded conductor is inserted along an insertion axis into the opening and extends into the processing chamber; and
a gripping device configured to fix the shielded conductor in the opening in the processing position of the laser processing device, the gripping device being movable along the insertion axis relative to the housing;
wherein, in the processing position of the laser processing device, the gripping device is positioned at the housing without contact therebetween, and
wherein the gripping device includes a first projection portion which extends at least partially into the opening along the insertion axis in the processing position of the laser processing device.

2. The laser processing device as recited in claim 1 , wherein the gripping device is configured to prevent laser radiation from escaping from the laser processing device in the processing position of the laser processing device.

3. The laser processing device as recited in claim 1 , wherein, in the processing position of the laser processing device, the gripping device completely covers the opening in a direction along the insertion axis.

4. The laser processing device as recited in claim 1 , wherein, in the processing position of the laser processing device, a sealing gap remaining between the housing and the gripping device forms a labyrinth seal for the laser radiation.

5. The laser processing device as recited in claim 1 , wherein the first projection portion has a radially symmetric basic shape with respect to the insertion axis.

6. The laser processing device as recited in claim 1 , wherein the gripping device has a second projection portion surrounding the first projection portion.

7. The laser processing device as recited in claim 1 , wherein the housing has a receiving groove which surrounds the opening and which, in the processing position of the laser processing device, is configured to receive at least a portion of the gripping device.

8. The laser processing device as recited in claim 7 , wherein the gripping device has a second projection portion surrounding the first projection portion, and wherein, in the processing position of the laser processing device, the second projection portion is at least partially received in the receiving groove.

9. The laser processing device as recited in claim 1 , wherein the gripping device includes at least two sections that are configured to be placed against each other to assume a gripping position in which the gripping device grips the shielded conductor.

10. The laser processing device as recited in claim 1 , wherein the gripping device comprises gripping jaws that are movable toward each other to a gripping position in which the shielded conductor is clamped between the gripping jaws.

11. The laser processing device as recited in claim 10 , wherein, in the processing position of the laser processing device, the gripping jaws are at least partially positioned within the opening.

12. The laser processing device as recited in claim 10 , wherein the gripping jaws are configured to mesh with each other as interleaved plates, and are movable beyond a gripping position with the shielded conductor inserted.

13. The laser processing device as recited in claim 1 , wherein, in the processing position of the laser processing device, the first projecting portion forms a sealing gap between the first projecting portion and a surrounding wall of the opening.

14. The laser processing device as recited in claim 13 , wherein the sealing gap has a thickness between the first projecting portion and the surrounding wall of the opening that is less than 5% of a diameter of the opening.

15. The laser processing device as recited in claim 13 , wherein the gripping device has a second projection portion surrounding the first projection portion, and wherein, in the processing position of the laser processing device, the second projection portion forms a second sealing gap between the second projection portion and an outer wall of the housing, the second sealing gap being connected with the sealing gap.

16. A method for operating the laser processing device according to claim 1 , the method comprising:
bringing the laser processing device into the processing position by positioning the gripping device at the housing without contact therebetween.

Assignees

• Md Elektronik Gmbh

Inventors

• Strauss Benedikt

Classifications

• B23K26/127 Primary

  in an enclosure · CPC title

• B23K26/38 Primary

  by boring or cutting · CPC title

• B23K37/0435

  Clamps · CPC title

• H01B13/003

  using irradiation · CPC title

• H01B13/228

  After-treatment · CPC title