Raised pathway heat sink

Patent metadata

Field	Value
Publication number	US-11800685-B2
Application number	US-202117400309-A
Country	US
Kind code	B2
Filing date	Aug 12, 2021
Priority date	Jul 12, 2018
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

Wireless electronic devices include one or more wireless antennas to provide for wireless communications. The antenna cables are routed internally within the device and typically noise from components located on a circuit board may couple to the antenna cables and cause a degradation in wireless performance, impact antenna sensitivity and cause packet loss. Utilizing raised pathways in a heat sink utilized for thermal transfer of heat to a housing enables tunnels to be formed between the housing and the heat sink. Routing the antenna cables through the tunnels improves noise isolation for the antenna cables while still maintaining the heat transfer. The raised pathways are configured to not interfere with components on the circuit board or components included in the housing. The wireless antennas may be mounted within the housing instead of on the board so no portion of the antenna cables are located on the circuit board.

First claim

The invention claimed is:

1. A heat sink apparatus comprising:
a main surface configured to be housed within a housing, said housing including a first cover and a second cover; and
one or more raised covered pathways defined by the main surface that include an antenna cable therethrough that releases radio-frequency interference (RFI), wherein the one or more raised covered pathways extend in a direction toward the first cover of the housing,
wherein the heat sink apparatus defines at least one hole therethrough, and components on the second cover of the housing pass through the at least one hole defined in the heat sink apparatus, and
wherein upon securing the heat sink apparatus to the second cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink apparatus and the housing.

2. The heat sink apparatus of claim 1 , wherein the heat sink apparatus provides noise isolation.

3. The heat sink apparatus of claim 1 , wherein the main surface provides heat transfer between the heat sink apparatus and the housing.

4. The heat sink apparatus of claim 1 , wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to a surface of the second cover.

5. The heat sink apparatus of claim 1 , wherein the heat sink apparatus is formed of aluminum.

6. The heat sink apparatus of claim 1 , wherein the heat sink apparatus is formed of a metal.

7. A device comprising:
a housing including a first cover and a second cover, said first cover and said second cover being configured to be secured together; and
a heat sink having a main surface configured to be housed within the housing,
wherein the heat sink defines at least one hole therethrough, and components on the second cover of the housing pass through the at least one hole defined in the heat sink,
wherein the main surface of the heat sink defines one or more raised covered pathways that include an antenna cable therethrough that releases radio-frequency interference (RFI), wherein the one or more raised covered pathways extend in a direction toward the first cover of the housing, and
wherein upon securing the heat sink to the second cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing.

8. The device of claim 7 , wherein the heat sink provides noise isolation.

9. The device of claim 7 , wherein the heat sink provides heat transfer to the housing.

10. The device of claim 7 , wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to a surface of the second cover.

11. The device of claim 7 , wherein the heat sink is formed of aluminum.

12. The device of claim 7 , wherein the heat sink is formed of a metal.

13. A wireless electronic device comprising:
a housing formed of a first cover and a second cover, wherein said first cover and said second cover and configured to be secured together;
a printed circuit board with a plurality of components mounted thereto including at least one integrated circuit;
an antenna cable that releases radio-frequency interference (RFI); and
a heat sink having a main surface configured to be secured proximate to a surface of the second cover of the housing,
wherein the heat sink defines at least one hole therethrough, and components on the second cover of the housing pass through the at least one hole defined in the heat sink,
wherein the main surface of the heat sink defines one or more raised covered pathways therein that are dimensioned to house the antenna cable therethrough, and wherein the one or more raised covered pathways extend in a direction toward the first cover of the housing,
wherein upon securing the heat sink to the second cover of the housing, the one or more raised covered pathways form one or more tunnels between the heat sink and the housing, and wherein the one or more tunnels route the antenna cable.

14. The wireless electronic device of claim 13 , wherein the one or more tunnels provide noise isolation for the antenna cable.

15. The wireless electronic device of claim 13 , wherein the heat sink extracts heat generated from the printed circuit board and transfers at least some of the extracted heat to the housing.

16. The wireless electronic device of claim 13 , wherein the main surface is configured to be secured in a position substantially parallel to and adjacent to the surface of the second cover.

17. The wireless electronic device of claim 13 , wherein the one or more raised covered pathways are configured so as to not interfere with the plurality of components on the printed circuit board or any other components within the housing.

18. The wireless electronic device of claim 13 , wherein the heat sink is formed of a metal.

19. The wireless electronic device of claim 13 , wherein the heat sink is formed of aluminum.

Assignees

• Arris Entpr Llc

Inventors

• Diep Justin
• Huang Chien-Cheng
• Hausman John
• Lin Hai

Classifications

• H05K7/2039 Primary

  characterised by the heat transfer by conduction from the heat generating element to a dissipating body (arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00) · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K7/1427

  Housings · CPC title

• H05K9/006

  specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier · CPC title