Power adapter

Patent metadata

Field	Value
Publication number	US-11800677-B2
Application number	US-202217665225-A
Country	US
Kind code	B2
Filing date	Feb 4, 2022
Priority date	Feb 7, 2021
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component.

First claim

What is claimed is:

1. A power adapter, wherein the power adapter comprises: a housing, wherein the housing has an air inlet and an air outlet; a circuit board component, wherein the circuit board component is located inside the housing; a heat dissipation air duct, wherein the heat dissipation air duct is located in the housing, wherein the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and wherein the heat dissipation air duct is configured to dissipate heat from the housing, the circuit board component and the combination of the housing and the circuit board component; and wherein the housing comprises a first surface, a first accommodation groove for accommodating a first pin and a second accommodation groove for accommodating a second pin that are disposed on the first surface, and the first accommodation groove and the second accommodation groove are disposed at intervals, and wherein the air inlet is disposed on a groove wall of the first accommodation groove, and the air outlet is disposed on a groove wall of the second accommodation groove.

2. The power adapter according to claim 1 , wherein the housing comprises a first surface and a second surface that are disposed opposite to each other, a first accommodation groove for accommodating a first pin and a second accommodation groove for accommodating a second pin that are disposed on the first surface, and the first accommodation groove and the second accommodation groove are disposed at intervals, and wherein
the air inlet is disposed on the second surface, the air outlet comprises a first sub-air outlet and a second sub-air outlet, the first sub-air outlet is disposed on a groove wall of the first accommodation groove, and the second sub-air outlet is disposed on a groove wall of the second accommodation groove.

3. The power adapter according to claim 1 , wherein the power adapter further comprises a heat dissipation fan, and the heat dissipation fan is located in the heat dissipation air duct and is disposed close to the air inlet.

4. The power adapter according to claim 1 , wherein, while the heat dissipation air duct is located in a spacing area between the housing and the circuit board component, at least a part of the housing is in a double-layer housing structure, and wherein a gap area in the double-layer housing structure forms a sealing cavity, and the sealing cavity is filled with a cooling medium.

5. The power adapter according to claim 4 , wherein the housing comprises a middle housing, and a front cover and a rear cover that are respectively connected to two ends of the middle housing, and at least one of the middle housing, the front cover, or the rear cover each is in the double-layer housing structure.

6. The power adapter according to claim 5 , wherein the middle housing, the front cover, and the rear cover are in an integrated structure, or the middle housing and the front cover are in an integrated structure, or the middle housing and the rear cover are in an integrated structure.

7. The power adapter according to claim 1 , wherein the housing comprises an inner-layer housing, and an outer-layer housing disposed on a periphery of the inner-layer housing, wherein there is a gap between the inner-layer housing and the outer-layer housing, and wherein a gap area between the inner-layer housing and the outer-layer housing forms the heat dissipation air duct.

8. The power adapter according to claim 7 , wherein thermal conductivity of the inner-layer housing is greater than thermal conductivity of the outer-layer housing.

9. The power adapter according to claim 7 , wherein an inner wall of the housing is directly in contact with the circuit board component; or
the inner wall of the housing is connected to the circuit board component by using a thermally conductive medium; or
there is a gap between the inner wall of the housing and the circuit board component.

10. The power adapter according to claim 1 , wherein the power adapter comprises an antistatic structure, at least a part of the antistatic structure is located at at least one of the air inlet or the air outlet, and wherein the antistatic structure is electrically connected to the circuit board component.

11. A power adapter, wherein the power adapter comprises: a housing, wherein the housing has an air inlet and an air outlet; a circuit board component, wherein the circuit board component is located inside the housing; a heat dissipation air duct, wherein the heat dissipation air duct is located in a spacing area between the housing and the circuit board component, wherein the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and wherein the heat dissipation air duct is configured to dissipate heat from the housing, the circuit board component and the combination of the housing and the circuit board component; and wherein the housing comprises a first surface, a first accommodation groove for accommodating a first pin and a second accommodation groove for accommodating a second pin that are disposed on the first surface, and the first accommodation groove and the second accommodation groove are disposed at intervals, and wherein the air inlet is disposed on a groove wall of the first accommodation groove, and the air outlet is disposed on a groove wall of the second accommodation groove.

12. The power adapter according to claim 11 , wherein the housing comprises a first surface and a second surface that are disposed opposite to each other, a first accommodation groove for accommodating a first pin and a second accommodation groove for accommodating a second pin that are disposed on the first surface, and the first accommodation groove and the second accommodation groove are disposed at intervals, and wherein the air inlet is disposed on the second surface, the air outlet comprises a first sub-air outlet and a second sub-air outlet, the first sub-air outlet is disposed on a groove wall of the first accommodation groove, and the second sub-air outlet is disposed on a groove wall of the second accommodation groove.

13. The power adapter according to claim 11 , wherein the power adapter further comprises a heat dissipation fan, and the heat dissipation fan is located in the heat dissipation air duct and is disposed close to the air inlet.

14. The power adapter according to claim 11 , wherein at least a part of the housing is in a double-layer housing structure, and wherein a gap area in the double-layer housing structure forms a sealing cavity, and the sealing cavity is filled with a cooling medium.

15. The power adapter according to claim 14 , wherein the housing comprises a middle housing, and a front cover and a rear cover that are respectively connected to two ends of the middle housing, and at least one of the middle housing, the front cover, or the rear cover each is in the double-layer housing structure.

16. The power adapter according to claim 15 , wherein the middle housing, the front cover, and the rear cover are in an integrated structure, or the middle housing and the front cover are in an integrated structure, or the middle housing and the rear cover are in an integrated structure.

17. The power adapter according to claim 11 , wherein the housing comprises an inner-layer housing, and an outer-layer housing disposed on a periphery of the inner-layer housing, wherein there is a gap between the inner-layer housing and the outer-layer housing, and wherein a gap area between the inner-layer housing and the outer-layer housing fo

Assignees

• Huawei Digital Power Tech Co Ltd

Inventors

• Wu Hao
• Chen Jun
• Xu Chunxia
• Hui Xiaowei

Classifications

• H05K7/20145 Primary

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H01R13/665

  with built-in electronic circuit (H01R13/70, H01R13/719 take precedence) · CPC title

• H01R24/68

  mounted on directly pluggable apparatus · CPC title

• H05K7/20909 Primary

  Forced ventilation, e.g. on heat dissipaters coupled to components · CPC title

• H05K5/0213 Primary

  Venting apertures; Constructional details thereof · CPC title