Temporary removable module lid

Patent metadata

Field	Value
Publication number	US-11800666-B2
Application number	US-202117304856-A
Country	US
Kind code	B2
Filing date	Jun 28, 2021
Priority date	Jun 28, 2021
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

An electronic module assembly is provided. The electronic module assembly may include one or more processors mounted to a laminate, a top frame mounted to the laminate and surrounding the one or more processors, and a removable lid covering the one or more processors. The removable lid includes latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the module assembly, and the removable lid can only be removed from the module assembly by releasing all of the latches.

First claim

What is claimed is:

1. An electronic module assembly comprising:
one or more processors mounted to a laminate;
a top frame mounted to the laminate and surrounding the one or more processors;
a removable lid covering the one or more processors,
wherein the removable lid comprises a first set of latches arranged on opposite sides of the removable lid, and a second set of latches arranged on opposite ends of the removable lid, both the first set of latches and the second set of latches engage with a lip of the top frame and secure the removable lid to the electronic module assembly, the removable lid can only be removed from the electronic module assembly by releasing all latches, and the first set of latches are releasable only upon closing of a wire bale used to secure the module assembly to a processor board and the second set of latches are releasable by human fingers.

2. The electronic module assembly according to claim 1 , wherein the first set of latches comprises six latches three on each of the opposite sides of the removable lid, and the second set of latches comprises two latches one on each of the opposite ends of the removable lid.

3. The electronic module assembly according to claim 1 , wherein the removable lid comprises at least one latch on each side of the removable lid.

4. The electronic module assembly according to claim 1 , wherein the removable lid comprises two or more latches on each side of the removable lid.

5. The electronic module assembly according to claim 1 , wherein all latches of the removable lid cannot be simultaneously released by the human fingers.

6. The electronic module assembly according to claim 1 , wherein the latches are integrated into the design of the removable lid and both are made from the same continuous material.

7. An electronic module assembly comprising:
one or more processors mounted to a laminate;
a top frame mounted to the laminate and surrounding the one or more processors;
a removable lid covering the one or more processors,
wherein the removable lid comprises latches arranged along a perimeter of the removable lid, the latches engage with a lip of the top frame and secure the removable lid to the electronic module assembly, the removable lid can only be removed from the module assembly by releasing all latches, and some, but not all, of the latches of the removable lid are releasable only upon closing of a wire bale used to secure the electronic module assembly to a processor board.

8. The electronic module assembly according to claim 7 , wherein the latches of the removable lid are arranged on all four sides of the removable lid.

9. The electronic module assembly according to claim 7 , wherein the removable lid comprises at least one latch on each side of the removable lid.

10. The electronic module assembly according to claim 7 , wherein the removable lid comprises two or more latches on each side of the removable lid.

11. The electronic module assembly according to claim 7 , wherein all latches of the removable lid cannot be simultaneously released by human fingers.

12. The electronic module assembly according to claim 7 , wherein the latches are integrated into the design of the removable lid and both are made from the same continuous material.

13. An electronic module assembly comprising:
one or more processors mounted to a laminate;
a top frame mounted to the laminate and surrounding the one or more processors;
a removable lid entirely covering top surfaces of the one or more processors,
wherein the removable lid comprises integral spring-loaded latches arranged on opposite sides of the removable lid, the integral spring-loaded latches engage with a lip of the top frame and secure the removable lid to the electronic module assembly, and the integral spring-loaded latches are releasable only upon closing of a wire bale used to secure the electronic module assembly to a processor board.

14. The electronic module assembly according to claim 13 , wherein the latches of the removable lid are arranged on all four sides of the removable lid.

15. The electronic module assembly according to claim 13 , wherein the removable lid comprises at least one latch on each side of the removable lid.

16. The electronic module assembly according to claim 13 , wherein the removable lid comprises two or more latches on each side of the removable lid.

17. The electronic module assembly according to claim 13 , wherein latches arranged along the perimeter of the removable lid comprise a first set of latches arranged on opposite sides of the removable lid, and a second set of latches arranged on opposite ends of the removable lid.

18. The electronic module assembly according to claim 13 , wherein all latches of the removable lid cannot be simultaneously released by human fingers.

19. The electronic module assembly according to claim 13 , wherein the latches are integrated into the design of the removable lid and both are made from the same continuous material.

Assignees

• IBM

Inventors

• Singer Noah
• Zitz Jeffrey Allen
• Schultz Mark D
• Torok John
• Yu Yuet-Ying
• Brodsky William L
• Canfield Shawn

Classifications

• H05K5/0221 Primary

  Locks; Latches · CPC title

• H05K5/03

  Covers · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• G06F1/20

  Cooling means · CPC title

• G06F1/182

  with special features, e.g. for use in industrial environments; grounding or shielding against radio frequency interference [RFI] or electromagnetical interference [EMI] · CPC title