Transducer system with configurable acoustic overload point

Patent metadata

Field	Value
Publication number	US-11800299-B2
Application number	US-202217747454-A
Country	US
Kind code	B2
Filing date	May 18, 2022
Priority date	Mar 16, 2018
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

A MEMS transducer system has a transducer configured to convert a received signal into an output signal for forwarding by a transducer output port, and an integrated circuit having an IC input in communication with the transducer output port. The IC input is configured to receive an IC input signal produced as a function of the output signal. The system also has a dividing element coupled between the IC input and the transducer output port. The dividing element is configured to selectively attenuate one or more signals into the IC input to at least in part produce the IC input signal. Other implementations may couple a feedback loop to the ground of the transducer (similar to bootstrapping), or pick off voltages at specific portions of the transducer.

First claim

What is claimed is:

1. A MEMS transducer system comprising:
a transducer comprising a plurality of sense members configured to move in response to a pressure signal to produce a plurality of member signals, the transducer further including an output port for forwarding at least one of the member signals;
an integrated circuit having an IC input in electric communication with the transducer output port, the IC input being configured to receive an attenuated IC input signal produced as a function of the at least one of the member signals; and
an attenuator coupled between the IC input and the transducer output port, the attenuator being electrically coupled with at least one of the sense members, the attenuator being configured to selectively attenuate one or more member signals into the IC input to at least in part produce the attenuated IC input signal, the attenuator being integral with the integrated circuit or separate from the integrated circuit.

2. The MEMS transducer system of claim 1 wherein the attenuator comprises a dividing element coupled between the IC input and the transducer output port, the dividing element being selectably actuatable.

3. The MEMS transducer system of claim 2 wherein the dividing element includes at least one attenuation branch, each attenuation branch having a switch and
a capacitance
in series with the switch.

4. The MEMS transducer system of claim 2 wherein the dividing
element includes a
plurality of attenuation branches that each have a switch and a capacitance in series with the switch.

5. The MEMS transducer system of claim 4 wherein the integrated circuit has a mode pin configured to actuate at least one attenuation branch in response to receipt of a first signal, and to disable the at least one attenuation branch in response to receipt of a second signal.

6. The MEMS transducer system of claim 4 further comprising
memory storing
information for selectably actuating prescribed attenuation branches.

7. The MEMS transducer system of claim 1 wherein the transducer comprises at least one of a microphone, speaker, accelerometer, gyroscope, inertial sensor, tilt sensor, chemical sensor, pressure sensor, and/or ultrasonic transducer.

8. The MEMS transducer system of claim 1 wherein the transducer comprises a piezoelectric MEMS microphone.

9. The MEMS transducer system of claim 1 wherein the integrated circuit comprises
an application specific integrated circuit with an operational amplifier having a non-inverting input and an op-amp output, the IC input being coupled with the non-inverting input, the IC having an output coupled with the op-amp output.

10. The MEMS transducer system of claim 1 wherein a node connects the IC input
and transducer output port, the attenuator being coupled with the node and electrically in parallel with the transducer output port.

11. The MEMS transducer system of claim 1 wherein the transducer and integrated circuit each are formed on different dies.

Assignees

• Qualcomm Technologies Inc

Inventors

• Littrell Robert
• Gagnon Ronald

Classifications

• H04R19/04 Primary

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R1/04

  Structural association of microphone with electric circuitry therefor (in electric hearing aids H04R25/00) · CPC title

• H04R3/00

  Circuits for transducers (arrangements for producing a reverberation or echo sound G10K15/08; amplifiers H03F) · CPC title

• H04R17/02 Primary

  Microphones · CPC title

• H04R19/005

  using semiconductor materials · CPC title