Optical modulator, optical modulator module, and optical transmitter module
US-2020041824-A1 · Feb 6, 2020 · US
Multi-channel light emitting module including lithium niobate modulator
US11799555B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11799555-B2 |
| Application number | US-202217725631-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 21, 2022 |
| Priority date | Nov 15, 2021 |
| Publication date | Oct 24, 2023 |
| Grant date | Oct 24, 2023 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the light emitting unit is provided outside the encapsulation structure. The optical transmission component is optically coupled with the thin film LiNbOx modulator.
First claim
Opening claim text (preview).
What is claimed is: 1. A multi-channel light emitting module, comprising: a base; at least one light emitting unit provided on the base; an optical modulation chip provided on the base, wherein the optical modulation chip comprises an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure, the thin film LiNbOx modulator is optically coupled with the at least one light emitting unit, and the at least one light emitting unit is provided outside the optical modulation chip; and an optical transmission component optically coupled with the thin film LiNbOx modulator. 2. The multi-channel light emitting module according to claim 1 , further comprising a driver chip electrically connected with the optical modulation chip, and the driver chip is provided in the base. 3. The multi-channel light emitting module according to claim 1 , wherein the optical modulation chip further comprises an optical splitter, and the optical splitter is provided at an optical input end of the thin film LiNbOx modulator. 4. The multi-channel light emitting module according to claim 3 , wherein the optical transmission component comprises a fiber array provided on the base, and the fiber array is provided outside the encapsulation structure. 5. The multi-channel light emitting module according to claim 1 , further comprising a wavelength division multiplexer (WDM) provided in the base, wherein the WDM is optically coupled with the thin film LiNbOx modulator of the optical modulation chip, and the WDM is provided outside the encapsulation structure. 6. The multi-channel light emitting module according to claim 1 , wherein the optical modulation chip further comprises a WDM optically coupled with the thin film LiNbOx modulator, and the WDM is provided in the encapsulation structure. 7. The multi-channel light emitting module according to claim 1 , wherein the at least one light emitting unit comprises a plurality of light emitting units, and the plurality of light emitting units emit light with different wavelengths. 8. The multi-channel light emitting module according to claim 1 , wherein the at least one light emitting unit emits an infrared light. 9. The multi-channel light emitting module according to claim 1 , wherein the optical transmission component comprises a single core fiber optically coupled with the thin film LiNbOx modulator of the optical modulation chip. 10. The multi-channel light emitting module according to claim 1 , wherein the base is made of metal. 11. The multi-channel light emitting module according to claim 1 , wherein each channel of the multi-channel light emitting module has a multi-channel light emitting module data rate of 100 Gbps or more. 12. The multi-channel light emitting module according to claim 1 , wherein the encapsulation structure is an airtight casing. 13. The multi-channel light emitting module according to claim 1 , wherein the encapsulation structure comprises an electrically insulated dielectric layer. 14. The multi-channel light emitting module according to claim 3 , wherein the optical splitter is accommodated in the encapsulation structure.
Assignees
Inventors
Classifications
- H04B10/506Primary
Multiwavelength transmitters · CPC title
- G02F1/25Primary
as to hue or predominant wavelength · CPC title
Bidirectional transmission · CPC title
Wavelength control · CPC title
Broadcast and select arrangements, e.g. with an optical splitter at the input before adding or dropping · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11799555B2 cover?
- A multi-channel light emitting module includes a base, at least one light emitting unit provided on the base, an optical modulation chip provided on the base, and an optical transmission component. The optical modulation chip includes an encapsulation structure and a thin film lithium niobate (LiNbOx) modulator provided in the encapsulation structure. The thin film LiNbOx modulator is optically…
- Who is the assignee on this patent?
- Global Tech Inc
- What technology area does this patent fall under?
- Primary CPC classification H04B10/506. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 24 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).