Laser module for optical data communication system within silicon interposer

Patent metadata

Field	Value
Publication number	US-11799554-B2
Application number	US-202217866482-A
Country	US
Kind code	B2
Filing date	Jul 16, 2022
Priority date	Jul 14, 2016
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

An interposer device includes a substrate that includes a laser source chip interface region, a silicon photonics chip interface region, an optical amplifier module interface region. A fiber-to-interposer connection region is formed within the substrate. A first group of optical conveyance structures is formed within the substrate to optically connect a laser source chip to a silicon photonics chip when the laser source chip and the silicon photonics chip are interfaced to the substrate. A second group of optical conveyance structures is formed within the substrate to optically connect the silicon photonics chip to an optical amplifier module when the silicon photonics chip and the optical amplifier module are interfaced to the substrate. A third group of optical conveyance structures is formed within the substrate to optically connect the optical amplifier module to the fiber-to-interposer connection region when the optical amplifier module is interfaced to the substrate.

First claim

What is claimed is:

1. A multi-chip module, comprising:
a polarization rotator;
a silicon photonics chip, wherein the silicon photonics chip and the polarization rotator are formed as separate components; and
an interposer, the polarization rotator attached to the interposer, the silicon photonics chip attached to the interposer, the interposer including a fiber-to-interposer connection region, the interposer including a first set of optical waveguides configured to optically connect the fiber-to-interposer connection region to the polarization rotator, the interposer including a second set of optical waveguides configured to optically connect the polarization rotator to the silicon photonics chip.

2. The multi-chip module as recited in claim 1 , wherein the polarization rotator is electrically connected to a first set of electrical conductors formed within the interposer.

3. The multi-chip module as recited in claim 2 , wherein the polarization rotator is flip-chip bonded to the interposer.

4. The multi-chip module as recited in claim 2 , wherein the silicon photonics chip is electrically connected to a second set of electrical conductors formed within the interposer.

5. The multi-chip module as recited in claim 4 , wherein the silicon photonics chip is flip-chip bonded to the interposer.

6. The multi-chip module as recited in claim 1 , wherein the polarization rotator is configured to receive incoming light from the first set of optical waveguides, the polarization rotator configured to split the incoming light into a first portion of light having a first polarization and a second portion of light having a second polarization, the polarization rotator configured to rotate the second portion of light from the second polarization to the first polarization, the polarization rotator optically connected to convey the first portion of light having the first polarization into a first optical waveguide of the second set of optical waveguides, the polarization rotator optically connected to convey the second portion of light having the first polarization into a second optical waveguide of the second set of optical waveguides.

7. The multi-chip module as recited in claim 1 , wherein at least a portion of the polarization rotator is integrated within the interposer.

8. The multi-chip module as recited in claim 1 , further comprising:
a set of optical amplifiers respectively optically coupled to the second set of optical waveguides, the set of optical amplifiers configured to amplify light signals traveling through the second set of optical waveguides.

9. The multi-chip module as recited in claim 1 , wherein the silicon photonics chip is recessed into the interposer.

10. The multi-chip module as recited in claim 9 , wherein the second set of optical waveguides is edge coupled to respective optical waveguides within the silicon photonics chip.

11. The multi-chip module as recited in claim 9 , wherein a recess formed within the silicon photonics chip to receive the interposer is formed to have a side protrusion, such that the silicon photonics chip does not cover the side protrusion.

12. The multi-chip module as recited in claim 11 , further comprising:
an epoxy material disposed within the side protrusion.

13. The multi-chip module as recited in claim 1 , wherein the polarization rotator is recessed into the interposer.

14. The multi-chip module as recited in claim 13 , wherein the first set of optical waveguides is edge coupled to respective optical waveguides within the polarization rotator, or the second set of optical waveguides is edge coupled to respective optical waveguides within the polarization rotator, or both the first set of optical waveguides and the second set of optical waveguides are edge coupled to respective optical waveguides within the polarization rotator.

15. The multi-chip module as recited in claim 13 , wherein a recess formed within the silicon photonics chip to receive the polarization rotator is formed to have a side protrusion, such that the polarization rotator does not cover the side protrusion.

16. The multi-chip module as recited in claim 15 , further comprising:
an epoxy material disposed within the side protrusion.

17. The multi-chip module as recited in claim 1 , wherein the interposer includes a third set of optical waveguides configured to optically connect the fiber-to-interposer connection region to the silicon photonics chip.

18. The multi-chip module as recited in claim 17 , further comprising:
a set of optical amplifiers respectively optically coupled to the third set of optical waveguides, the set of optical amplifiers configured to amplify light signals traveling through the third set of optical waveguides.

19. The multi-chip module as recited in claim 1 , further comprising:
an electronic device attached to the interposer, wherein the interposer includes at least one through-glass-via configured to provide electrical connectivity between the silicon photonics chip and the electronic device.

20. The multi-chip module as recited in claim 19 , wherein the electronic device and the silicon photonics chip are attached to opposite sides of the interposer.

Assignees

• Ayar Labs Inc

Inventors

• Sun Chen
• Meade Roy Edward
• Wade Mark
• Wright Alexandra
• Stojanovic Vladimir
• Ram Rajeev
• Popovic Milos
• Van Orden Derek
• Davenport Michael

Classifications

• H04B10/504 Primary

  using direct modulation · CPC title

• H01S5/0268

  Integrated waveguide grating router, e.g. emission of a multi-wavelength laser array is combined by a "dragon router" · CPC title

• H01S5/02325 Primary

  Mechanically integrated components on mount members or optical micro-benches · CPC title

• H01S5/4012

  Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms · CPC title

• H01S5/4087

  emitting more than one wavelength · CPC title