Semiconductor device comprising a buffer layer including a complex defect of interstice carbon and interstice oxygen

Patent metadata

Field	Value
Publication number	US-11799022-B2
Application number	US-202117242587-A
Country	US
Kind code	B2
Filing date	Apr 28, 2021
Priority date	Oct 8, 2020
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

A semiconductor device includes: a drift layer of a first conduction type provided in a semiconductor substrate having a first principal plane and a second principal plane opposed to the first principal plane; a first semiconductor layer of a second conduction type provided between the first principal plane of the semiconductor substrate and the drift layer and having impurity concentration higher than impurity concentration of the drift layer; a first buffer layer of a first conduction type provided between the second principal plane of the semiconductor substrate and the drift layer and having hydrogen-induced donors with impurity concentration higher than impurity concentration of the drift layer; and a second semiconductor layer of a first conduction type or a second conduction type provided between the second principal plane of the semiconductor substrate and the first buffer layer and having impurity concentration higher than impurity concentration of the drift layer, wherein the first buffer layer includes a complex defect of interstice carbon and interstice oxygen having density decreasing from the second principal plane side toward the first principal plane side.

First claim

The invention claimed is:

1. A semiconductor device comprising:
a drift layer of a first conduction type provided in a semiconductor substrate having a first principal plane and a second principal plane opposed to the first principal plane;
a first semiconductor layer of a second conduction type provided between the first principal plane of the semiconductor substrate and the drift layer and having an impurity concentration higher than an impurity concentration of the drift layer;
a first buffer layer of the first conduction type provided between the second principal plane of the semiconductor substrate and the drift layer and having hydrogen-induced donors with an impurity concentration higher than the impurity concentration of the drift layer; and
a second semiconductor layer of the first conduction type or the second conduction type provided between the second principal plane of the semiconductor substrate and the first buffer layer and having an impurity concentration higher than the impurity concentration of the drift layer,
wherein the first buffer layer includes a complex defect of interstice carbon and interstice oxygen having a density decreasing from a second principal plane side toward a first principal plane side.

2. The semiconductor device according to claim 1 , wherein the density of the complex defect of interstice carbon and interstice oxygen in the first buffer layer is larger than a density of a complex defect of interstice carbon and lattice position carbon in the first buffer layer.

3. The semiconductor device according to claim 1 , wherein the complex defect of interstice carbon and interstice oxygen is a lifetime killer which reduces a recombination life time of a carrier.

4. The semiconductor device according to claim 1 , wherein the first buffer layer includes a complex defect of interstice silicon having a density decreasing from the second principal plane side toward the first principal plane side, and
the first buffer layer includes a region where a decreasing rate of density of the complex defect of interstice carbon and interstice oxygen increases and a decreasing rate of density of the complex defect of interstice silicon decreases from the second principal plane side toward the first principal plane side.

5. The semiconductor device according to claim 1 , wherein the first buffer layer has at least one concentration peak of the hydrogen-induced donors, and
the complex defect of interstice carbon and interstice oxygen is present further on the first principal plane side than the concentration peak closest to the first principal plane among the concentration peaks of the hydrogen-induced donors.

6. The semiconductor device according to claim 1 , further comprising a second buffer layer of the first conduction type provided between the second semiconductor layer and the first buffer layer, having phosphorus as impurities and having an impurity concentration higher than the impurity concentration of the first buffer layer,
wherein the second buffer layer includes the complex defect of interstice carbon and interstice oxygen, and
a density of the complex defect of interstice carbon and interstice oxygen of the second buffer layer is smaller than a maximum density of the complex defect of interstice carbon and interstice oxygen of the first buffer layer.

7. The semiconductor device according to claim 1 , wherein the second semiconductor layer is a collector layer of the second conduction type.

8. The semiconductor device according to claim 1 , wherein the second semiconductor layer is a cathode layer of the first conduction type.

9. The semiconductor device according to claim 1 , wherein the semiconductor substrate includes an IGBT region in which the second semiconductor layer is a collector layer of the second conduction type, and a diode region in which the second semiconductor layer is a cathode layer of the first conduction type.

10. The semiconductor device according to claim 1 , wherein the complex defect of interstice carbon and interstice oxygen is formed by charged particle irradiation, and
a heat treatment step after the charged particle irradiation is:
at a temperature of 250° C. or higher and 350° C. or lower, and
for a time of ten minutes or higher and two hours or lower,
such that the density of the complex defect of interstice carbon and interstice oxygen in the first buffer layer is larger than a density of the complex defect of interstice carbon and lattice position carbon in the first buffer layer.

11. The semiconductor device according to claim 10 , wherein the hydrogen-induced donors are formed by another heat treatment step performed before the charged particle irradiation, the another heat treatment step being:
at a temperature of 380° C. or higher and 525° C. or lower, and
for a time of 0.5 hours or higher and four hours or lower.

Assignees

• Mitsubishi Electric Corp

Inventors

• Otsuka Kakeru
• Okamoto Hayato
• Nakamura Katsumi
• Tanaka Koji
• Nishi Koichi

Classifications

• H10D84/811

  Combinations of field-effect devices and one or more diodes, capacitors or resistors · CPC title

• H10D62/129

  Cathode regions of diodes · CPC title

• H10D84/403

  Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors · CPC title

• H10D12/038

  having a recessed gate, e.g. trench-gate IGBTs · CPC title

• H10D8/422

  PN diodes having the PN junctions in mesas · CPC title