Module structure and electronic apparatus

US11798930B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11798930-B2
Application numberUS-202117384511-A
CountryUS
Kind codeB2
Filing dateJul 23, 2021
Priority dateJul 24, 2020
Publication dateOct 24, 2023
Grant dateOct 24, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure provides a module structure and an electronic apparatus. The module structure includes: a sensing component, a sensing surface and a display component disposed between the sensing component and the sensing surface; an air layer disposed between the display component and the sensing component; and a scattering layer disposed between the air layer and the display component; wherein light generated by the display component is reflected or refracted on the sensing surface to form signal light carrying an information, and the signal light is transmitted through the scattering layer and the air layer and received by the sensing component. The present disclosure can realize decoupling between the sensing component and the display component, reduce the influence of a bonding stress on a display effect of the display component, and avoid the influence of the air layer on the realization of the function of the sensing component.

First claim

Opening claim text (preview).

The invention claimed is: 1. A module structure, comprising: a sensing component, a sensing surface and a display component disposed between the sensing component and the sensing surface; an air layer, disposed between the display component and the sensing component; and a scattering layer, disposed between the air layer and the display component; wherein light generated by the display component is reflected or refracted on the sensing surface to form signal light carrying an information, and the signal light is transmitted through the scattering layer and the air layer and received by the sensing component. 2. The module structure according to claim 1 , wherein the scattering layer comprises a random scattering layer or a microstructure layer. 3. The module structure according to claim 2 , wherein the scattering layer is a transmission random scattering layer; a surface of the scattering layer far away from the display component is a rough surface; and/or the scattering layer is made of a material having a non-uniform refractive index distribution. 4. The module structure according to claim 3 , wherein the scattering layer comprises a first substrate and scattering structures randomly distributed in the first substrate, and the first substrate has a refractive index different from that of the scattering structures. 5. The module structure according to claim 4 , wherein the scattering structures are distributed in the first substrate to achieve uniform optical scattering. 6. The module structure according to claim 4 , wherein the display component comprises a second substrate, and the refractive index of the first substrate is equal to that of the second substrate of the display component. 7. The module structure according to claim 4 , wherein the scattering structures comprise bubbles or particles. 8. The module structure according to claim 7 , wherein the particles comprise at least one of particles made of a high-refractive-index dielectric material and metal particles. 9. The module structure according to claim 4 , wherein the first substrate is made of glass, polyimide, polyethylene terephthalate or silica gel. 10. The module structure according to claim 4 , wherein a diameter of each of the scattering structures is in a range from ⅕ of a wavelength of visible light to 100 times of the wavelength of the visible light. 11. The module structure according to claim 4 , wherein a density of the scattering structures in the scattering layer is in a range from 1 particle/cm 3 to 10 12 particles/cm 3 . 12. The module structure according to claim 3 , wherein a surface roughness of the rough surface of the scattering layer is in a range from 1/10 of a wavelength of visible light to 100 times of the wavelength of the visible light. 13. The module structure according to claim 2 , further comprising a periodic or aperiodic microstructure disposed on a surface of the microstructure layer far away from the display component; wherein the signal light transmitted through the microstructure layer is at least partially refracted on the microstructure. 14. The module structure according to claim 13 , wherein the microstructure is at least one of an inclined surface, a convex surface and a concave surface. 15. The module structure according to claim 1 , wherein the display component comprises a substrate, and the scattering layer and the substrate of the display component are formed in one piece. 16. The module structure according to claim 1 , wherein the scattering layer is a thin film formed on the display component. 17. The module structure according to claim 1 , wherein the sensing component comprises a photosensitive element configured for performing photoelectric conversion on the signal light. 18. The module structure according to claim 17 , further comprising: a converging module, disposed between the air layer and the sensing component to converge the signal light. 19. The module structure according to claim 18 , wherein the converging module comprises a single lens, and the sensing component comprises a CMOS image sensor. 20. The module structure according to claim 18 , wherein the converging module comprises a lens group, and the sensing component comprises a CMOS image sensor or a TFT sensor. 21. The module structure according to claim 1 , wherein a thickness of the air layer is less than or equal to 1 mm. 22. The module structure according to claim 1 , further comprising: at least one spacer, disposed between the scattering layer and the sensing component to form the air layer. 23. The module structure according to claim 22 , further comprising: a plurality of spacers, evenly distributed in a plane parallel to a surface of the sensing component. 24. The module structure according to claim 22 , wherein further comprising: a plurality of spacers, wherein the plurality of spacers comprise a first spacer and a second spacer, and the first spacer and the second spacer have different heights. 25. The module structure according to claim 1 , wherein the display component comprises a display panel, and the sensing component comprises an image sensor panel. 26. The module structure according to claim 1 , wherein the display component comprises a light-transmitting cover plate and a display layer, and the sensing surface is a surface of the light-transmitting cover plate. 27. An electronic apparatus, comprising the module structure according to claim 1 . 28. The electronic apparatus according to claim 27 , wherein the electronic apparatus comprises a mobile phone, a tablet computer, or a smart watch.

Assignees

Inventors

Classifications

  • Package configurations · CPC title

  • OLEDs integrated with inorganic image sensors · CPC title

  • comprising scattering means · CPC title

  • using electro-optical elements or layers, e.g. electroluminescent sensing · CPC title

  • directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title

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What does patent US11798930B2 cover?
The present disclosure provides a module structure and an electronic apparatus. The module structure includes: a sensing component, a sensing surface and a display component disposed between the sensing component and the sensing surface; an air layer disposed between the display component and the sensing component; and a scattering layer disposed between the air layer and the display component;…
Who is the assignee on this patent?
Shanghai Harvest Intelligence Tech Co Ltd
What technology area does this patent fall under?
Primary CPC classification G06V40/1318. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Oct 24 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).