Multi-layer ceramic electronic component and method of producing the same

Patent metadata

Field	Value
Publication number	US-11798748-B2
Application number	US-202318184583-A
Country	US
Kind code	B2
Filing date	Mar 15, 2023
Priority date	Dec 20, 2018
Publication date	Oct 24, 2023
Grant date	Oct 24, 2023

Abstract

A multi-layer ceramic electronic component includes (I) a ceramic body including (i) a protective portion that includes an end surface facing in a first direction, circumferential surfaces, and a ridge including a recess extending along the first direction and connects the circumferential surfaces, and (ii) a functional portion including internal electrodes laminated in a second direction, and (II) an external electrode including (i) a base film covering the end surface and including a first, second, and third covering portions formed on the end surface, on the circumferential surfaces, and on the recess, respectively, (ii) an intermediate film formed on the base film and continuously covering the first, second, and third covering portions, and (iii) a surface film formed on the intermediate film, wherein the recess is disposed outside end portions of the internal electrodes in a third direction orthogonal to the first and second directions.

First claim

What is claimed:

1. A multi-layer ceramic electronic component, comprising:
a ceramic body including
a protective portion including
an end surface facing in a first direction,
circumferential surfaces connected to the end surface and extending in the first direction, and
a ridge that includes a recess and an outer edge and connects the circumferential surfaces, the recess extending along the first direction, the outer edge including an edge, the edge being formed at the outer edge and bulging outward, and

a functional portion disposed inside the protective portion, and including internal electrodes laminated in a second direction orthogonal to the first direction; and

an external electrode including
a base film covering the end surface,
an intermediate film formed on the base film, and
a surface film formed on the intermediate film,
wherein the base film includes
a first covering portion formed on the end surface,
second covering portions formed on the respective circumferential surfaces, and
a third covering portion formed on the recess and spaced apart from at least one of the second covering portions at the edge,

the intermediate film continuously covers the first covering portion, the second covering portions, and the third covering portion, and
the recess is disposed outside end portions of the plurality of internal electrodes in a third direction orthogonal to the first direction and the second direction.

2. The multi-layer ceramic electronic component according to claim 1 , wherein
positions of the end portions of the internal electrodes in the third direction are aligned with one another within a range of 0.5 μm in the third direction.

3. A method of producing a multi-layer ceramic electronic component, comprising steps of:
producing a ceramic body, the ceramic body including
a protective portion including
an end surface facing in a first direction,
circumferential surfaces connected to the end surface and extending in the first direction, and
a ridge that includes a recess and an outer edge and connects the circumferential surfaces, the recess extending along the first direction, the outer edge including an edge, the edge being formed at the outer edge and bulging outward, and

a functional portion disposed inside the protective portion, and including internal electrodes laminated in a second direction orthogonal to the first direction;

forming an electrically conductive base film, the base film including
a first covering portion formed on the end surface,
second covering portions formed on the respective circumferential surfaces, and
a third covering portion formed on the recess and spaced apart from at least one of the second covering portions at the edge;

forming an intermediate film that continuously covers the first covering portion, the second covering portions, and the third covering portion, and
forming a surface film on the intermediate film,
wherein the recess is disposed outside end portions of the plurality of internal electrodes in a third direction orthogonal to the first direction and the second direction.

4. The method of producing a multi-layer ceramic electronic component according to claim 3 , wherein
the step of producing a ceramic body includes
producing a ceramic multi-layer chip, the internal electrodes being exposed from a side surface of the ceramic multi-layer chip, the side surface facing in the third direction,
forming
a first side margin laminated on the side surface, and
a second side margin laminated on the first side margin and having a heat shrinkage rate larger than a heat shrinkage rate of the first side margin, and

sintering the ceramic multi-layer chip, the first side margin, and the second side margin.

5. The method of producing a multi-layer ceramic electronic component according to claim 4 , wherein
the first side margin is formed by attaching a first ceramic sheet to the side surface, and
the second side margin is formed by attaching a second ceramic sheet to the first ceramic sheet, the second ceramic sheet having a heat shrinkage rate larger than a heat shrinkage rate of the first ceramic sheet.

Assignees

• Taiyo Yuden Kk

Inventors

• Ono Ryo
• Fukuoka Tetsuhiko
• Kusumoto Shoji
• Kono Akihiko

Classifications

• H01G4/30 Primary

  Stacked capacitors (H01G4/33 takes precedence) · CPC title

• H01G2/08

  Cooling arrangements; Heating arrangements; Ventilating arrangements · CPC title

• H01G4/012

  Form of non-self-supporting electrodes · CPC title

• H01G4/1227

  based on alkaline earth titanates · CPC title

• H01G4/248

  the terminals embracing or surrounding the capacitive element, e.g. caps (H01G4/252 takes precedence) · CPC title