Resin composition for modeling material, light curing molding ink set, and method for manufacturing optically shaped article

US11795335B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11795335-B2
Application numberUS-202217701322-A
CountryUS
Kind codeB2
Filing dateMar 22, 2022
Priority dateSep 15, 2015
Publication dateOct 24, 2023
Grant dateOct 24, 2023

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more, and this resin composition for a modeling material 4 a can afford a light cured article having the good dimensional accuracy.

First claim

Opening claim text (preview).

The invention claimed is: 1. A light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material, and a resin composition for a supporting material used for shaping the supporting material, wherein the resin composition for modeling material contains (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, (C) a surface adjusting agent, and (D) an oligomer as a photocuring component, wherein the resin composition for a modeling material has surface tension Mt of 26.0 to 33.0 mN/m, and the resin composition for a modeling material has surface tension Mst represented by the following (i) expression of 33.0 mN/m or more, [ Mathematic ⁢ ⁢ 1 ] ⁢ Mst = Σ ⁢ ⁢ ( Surface ⁢ ⁢ tension ⁢ ⁢ of ⁢ ⁢ each ⁢ ⁢ photocuring ⁢ ⁢ component × content ⁢ ⁢ of ⁢ ⁢ each ⁢ ⁢ photocuring ⁢ ⁢ component ) Total ⁢ ⁢ content ⁢ ⁢ of ⁢ ⁢ photocuring ⁢ ⁢ components ( i ) and wherein the resin composition for a supporting material contains (E) a water-soluble monofunctional ethylenic unsaturated monomer, (F) polyalkylene glycol comprising an oxyethylene group and/or an oxypropylene group, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for modeling material in an uncured state and the resin composition for supporting material in an uncured state are directly in contact with each other. 2. The ink set according to claim 1 , wherein the (A) component comprises 70 parts by weight or less of a monofunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material. 3. The ink set according to claim 2 , wherein the content of the monofunctional ethylenic unsaturated monomer is 5 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material. 4. The ink set according to claim 1 , wherein the (A) component comprises 70 parts by weight or less of a polyfunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material. 5. The ink set according to claim 2 , wherein the (A) component comprises 70 parts by weight or less of a polyfunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material. 6. The ink set according to claim 3 , wherein the (A) component comprises 70 parts by weight or less of a polyfunctional ethylenic unsaturated monomer, based on 100 parts by weight of the whole resin composition for a modeling material. 7. The ink set according to claim 4 , wherein the content of the polyfunctional ethylenic unsaturated monomer is 20 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material. 8. The ink set according to claim 5 , wherein the content of the polyfunctional ethylenic unsaturated monomer is 20 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material. 9. The ink set according to claim 6 , wherein the content of the polyfunctional ethylenic unsaturated monomer is 20 to 70 parts by weight, based on 100 parts by weight of the whole resin composition for a modeling material.

Assignees

Inventors

Classifications

  • C09D11/101Primary

    Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing · CPC title

  • using individual droplets, e.g. from jetting heads · CPC title

  • Processes of additive manufacturing · CPC title

  • Materials specially adapted for additive manufacturing · CPC title

  • Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers · CPC title

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Frequently asked questions

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What does patent US11795335B2 cover?
There is provided a resin composition for a modeling material, used for shaping a modeling material by a manufacturing method for light curing molding using an ink-jet scheme, comprising (A) an ethylenic unsaturated monomer as a photocuring component, (B) a photopolymerization initiator, and (C) a surface adjusting agent, wherein the resin composition for a modeling material has surface tension…
Who is the assignee on this patent?
Maxell Ltd, Mimaki Eng Co Ltd
What technology area does this patent fall under?
Primary CPC classification C09D11/101. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Oct 24 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).