Thermosetting Epoxy Resin Composition and Production Method for Same
US-2019203087-A1 · Jul 4, 2019 · US
Latent curing agent and method for manufacturing same, composition for forming coating film, and cation-curable composition
US11795264B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11795264-B2 |
| Application number | US-202017429984-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 31, 2020 |
| Priority date | Feb 15, 2019 |
| Publication date | Oct 24, 2023 |
| Grant date | Oct 24, 2023 |
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- Title
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Abstract
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Provided is a latent curing agent, including: porous particles supporting an aluminum chelate compound; and a coating film over surfaces of the porous particles, the coating film containing an aluminum chelate compound and a polymer that contains at least one of a urea bond and an urethane bond, wherein a content of an active aluminum chelate compound is 20% by mass or greater.
First claim
Opening claim text (preview).
The invention claimed is: 1. A latent curing agent, comprising: porous particles supporting an aluminum chelate compound; and a coating film over surfaces of the porous particles, the coating film containing an aluminum chelate compound and a polymer that contains at least one of a urea bond and an urethane bond, wherein a content of an active aluminum chelate compound is 20% by mass or greater. 2. The latent curing agent according to claim 1 , wherein the porous particles are formed of a poly urea resin. 3. The latent curing agent according to claim 1 , wherein the coating film contains a nitrogen element by 5 atm % or greater. 4. The latent curing agent according to claim 1 , wherein the coating film contains an oxygen atom by 25 atm % or less. 5. A method for producing a latent curing agent, the method comprising: heating and stirring a coating film forming composition and porous particles supporting an aluminum chelate compound in presence of a non-aqueous solvent, wherein the coating film forming composition comprises an isocyanate compound; and an aluminum chelate compound, wherein a content of the isocyanate compound is 10% by mass or less. 6. The method for producing a latent curing agent according to claim 5 , wherein a content of the aluminum chelate compound is 5% by mass or greater but 50% by mass or less. 7. A canonically curable composition, comprising: a latent curing agent; and a canonically curable compound, wherein the latent curing agent comprises: porous particles supporting an aluminum chelate compound; and a coating film over surfaces of the porous particles, the coating film containing an aluminum chelate compound and a polymer that contains at least one of a urea bond and an urethane bond, wherein a content of an active aluminum chelate compound in the latent curing agent is 20% by mass or greater. 8. The canonically curable composition according to claim 7 , wherein the cationically curable compound is air epoxy compound or an oxetane compound. 9. The canonically curable composition according to claim 7 , further comprising: an aryl silanol compound.
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Classifications
- C08G18/3893Primary
containing silicon · CPC title
the dispersing or dispersed phase being an aqueous medium · CPC title
metal compounds not provided for in groups C08G18/225 - C08G18/26 · CPC title
creating amino end groups · CPC title
containing at least one isocyanate or isothiocyanate group linked to an aromatic ring by means of an aliphatic group · CPC title
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- What does patent US11795264B2 cover?
- Provided is a latent curing agent, including: porous particles supporting an aluminum chelate compound; and a coating film over surfaces of the porous particles, the coating film containing an aluminum chelate compound and a polymer that contains at least one of a urea bond and an urethane bond, wherein a content of an active aluminum chelate compound is 20% by mass or greater.
- Who is the assignee on this patent?
- Dexerials Corp
- What technology area does this patent fall under?
- Primary CPC classification C08G18/3893. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Oct 24 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).