Method for applying a structured coating to a component
US-9556022-B2 · Jan 31, 2017 · US
US11795116B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11795116-B2 |
| Application number | US-202017080906-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 27, 2020 |
| Priority date | Dec 21, 2016 |
| Publication date | Oct 24, 2023 |
| Grant date | Oct 24, 2023 |
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Ceramic assembly can comprise a ceramic article comprising a thickness defined between a first major surface and a second major surface. The thickness can be about 100 micrometers or less. The ceramic assembly can comprise a polymer coating deposited over at least an outer peripheral portion of the first major surface of the ceramic article. The polymer coating can comprise a thickness of about 30 micrometers or less. An edge strength of the ceramic assembly can be greater than an edge strength of the ceramic article by about 50 MegaPascals or more. Methods of forming a ceramic assembly can comprise depositing a polymer coating on an outer peripheral portion of a first major surface of a ceramic article. Methods can further comprise curing the polymer coating.
Opening claim text (preview).
What is claimed is: 1. A ceramic assembly, comprising: a body comprising ceramic grains sintered to one another, wherein a thickness of the body, between first and second major surfaces thereof, is in a range from 3 μm to 1 mm, and the first and second major surfaces of the body have an unpolished granular profile such that the unpolished granular profile includes grains protruding outward from a respective major surface with a height of at least 25 nm and no more than 150 μm relative to recessed portions of the respective major surface at boundaries between respective grains; a coating overlaying the unpolished granular profile of the first major surface, wherein an outward facing surface of the coating is less rough than the unpolished granular profile of the first major surface, the coating is disposed over a portion of an edge portion, and the edge portion comprises an outer peripheral edge circumscribing the body; and an adhesion promoter is positioned between the body and the coating. 2. The ceramic assembly of claim 1 , wherein the unpolished granular profile includes grains with a height of at least 150 nanometers relative to recessed portions of the respective major surface at boundaries between the respective grains. 3. The ceramic assembly of claim 2 , wherein the height of the grains is no more than 80 micrometers relative to recessed portions of the respective major surface at boundaries between the respective grains. 4. The ceramic assembly of claim 3 , wherein the coating fills in crevasses between grains of the unpolished granular profile. 5. The ceramic assembly of claim 1 , wherein the body is thicker than the coating. 6. The ceramic assembly of claim 5 , wherein thickness of the coating is less than 30 micrometers. 7. The ceramic assembly of claim 1 , wherein the grains sintered to one another have an average grain size of 5 μm or less, and wherein over a distance of 1 cm along a single axis, a surface roughness (Ra) of the coating is less than half that of the unpolished granular profile. 8. The ceramic assembly of claim 7 , wherein the surface roughness (Ra) of the coating is less than a third that of the unpolished granular profile. 9. The ceramic assembly of claim 1 , wherein a surface roughness (Ra) of the coating is less than 15 nm over a distance of 1 cm along a single axis. 10. The ceramic assembly of claim 1 , wherein a surface roughness (Rq) of the coating is less than 15 nm over a distance of 1 cm along a single axis. 11. The ceramic assembly of claim 1 , wherein the coating is amorphous. 12. The ceramic assembly of claim 1 , wherein the coating comprises a material with melting temperature above 500° C. 13. The ceramic assembly of claim 1 , wherein the body comprises an oxide.
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